NO20080837L - Use of a coating to form electrical contact - Google Patents
Use of a coating to form electrical contactInfo
- Publication number
- NO20080837L NO20080837L NO20080837A NO20080837A NO20080837L NO 20080837 L NO20080837 L NO 20080837L NO 20080837 A NO20080837 A NO 20080837A NO 20080837 A NO20080837 A NO 20080837A NO 20080837 L NO20080837 L NO 20080837L
- Authority
- NO
- Norway
- Prior art keywords
- contact
- contact device
- demetallization
- oxide layer
- mechanical stability
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Oppfinnelsen vedrører en overflatebehandling av en elektrisk kontaktinnretning i elektrolytiske maskiner, spesielt maskiner for behandling av kretskort og konduktorark. Slike kontaktinnretninger som for eksempel segmenterte kontaktdannende hjul, kontakthjul, kontaktbørster eller klemmer, består vanligvis av titan eller et annet oksiderende og derved kjemisk og elektrokjemisk resistent materiale. For å redusere ulempene med det elektrisk isolerende oksidlaget under metallisering og demetallisering av kontaktinnretningen, er sistnevnte forsynt med et edelmetallbelegg i henhold til kjent teknikk. Nevnte lag oppviser ikke mekanisk stabilitet. For å forhindre en uønsket metallisering av kontaktinnretningen som et resultat av utilstrekkelig demetallisering på grunn av det isolerende oksidlaget og for å forbedre beskyttelsen mot slitasje, er det i henhold til foreliggende oppfinnelse tilveiebrakt et elektrisk ledende diamantbelegg. Dette diamantbelegget, som også oppviser høy mekanisk stabilitet, brukes i henhold til oppfinnelsen i det minste på de kontaktdannende områdene av kontaktinnretningen.The invention relates to a surface treatment of an electrical contact device in electrolytic machines, in particular machines for the processing of circuit boards and conductor sheets. Such contact devices, such as segmented contact forming wheels, contact wheels, contact brushes or clamps, usually consist of titanium or another oxidizing and thereby chemical and electrochemically resistant material. In order to reduce the disadvantages of the electrically insulating oxide layer during metallization and demetallization of the contact device, the latter is provided with a noble metal coating according to the prior art. Said layers do not exhibit mechanical stability. In order to prevent unwanted metallization of the contact device as a result of insufficient demetallization due to the insulating oxide layer and to improve the protection against wear, according to the present invention, an electrically conductive diamond coating is provided. This diamond coating, which also exhibits high mechanical stability, is used in accordance with the invention at least in the contact forming regions of the contact device.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005034419A DE102005034419A1 (en) | 2005-07-19 | 2005-07-19 | Use of a coating for electrical contacting |
PCT/DE2006/001232 WO2007009441A1 (en) | 2005-07-19 | 2006-07-16 | Use of a coating for making electrical contact |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20080837L true NO20080837L (en) | 2008-06-02 |
Family
ID=37198790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20080837A NO20080837L (en) | 2005-07-19 | 2008-02-18 | Use of a coating to form electrical contact |
Country Status (11)
Country | Link |
---|---|
US (1) | US20080128289A1 (en) |
EP (1) | EP1907608B1 (en) |
JP (1) | JP2009501846A (en) |
KR (1) | KR20080031428A (en) |
CN (1) | CN101258270A (en) |
DE (3) | DE102005034419A1 (en) |
ES (1) | ES2318762T3 (en) |
NO (1) | NO20080837L (en) |
PL (1) | PL1907608T3 (en) |
TW (1) | TW200710280A (en) |
WO (1) | WO2007009441A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007055338B4 (en) | 2007-11-19 | 2009-08-13 | Rena Sondermaschinen Gmbh | Apparatus and method for the electrical contacting of goods in electrolytic continuous installations |
DE102009023767A1 (en) * | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Device and method for the electrical contacting of goods in electroplating plants |
DE102009057466A1 (en) * | 2009-12-03 | 2011-06-09 | Hübel, Egon, Dipl.-Ing. (FH) | Device and method for the electrical contacting of items to be treated in galvanizing plants |
DE102012206800B3 (en) | 2012-04-25 | 2013-09-05 | Atotech Deutschland Gmbh | Method and apparatus for the electrolytic deposition of a deposition metal on a workpiece |
JP6176234B2 (en) * | 2014-12-26 | 2017-08-09 | トヨタ自動車株式会社 | Metal film forming apparatus and film forming method |
CN108149295A (en) * | 2017-12-26 | 2018-06-12 | 北京派尔特医疗科技股份有限公司 | Semi-automatic silk material differential arc oxidation system and its oxidation, cleaning equipment and method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5785838A (en) * | 1993-02-26 | 1998-07-28 | Nikon Corporation By Hiroyuki Sugimura | Method for producing an oxide film |
DE19633797B4 (en) | 1996-08-22 | 2005-08-04 | Hans Höllmüller Maschinenbau GmbH | Device for electroplating electronic circuit boards or the like |
DE19840471A1 (en) | 1998-09-04 | 2000-03-09 | Schmid Gmbh & Co Geb | Apparatus for removal of coating from an article comprises devices which monitor voltage and/or current or potential variation, and are electrically connected to the control system of the apparatus |
JP2002030494A (en) * | 2000-07-13 | 2002-01-31 | Sumitomo Electric Ind Ltd | Corrosion resistant electrically conductive member |
US6884290B2 (en) * | 2002-01-11 | 2005-04-26 | Board Of Trustees Of Michigan State University | Electrically conductive polycrystalline diamond and particulate metal based electrodes |
EP1630257B1 (en) * | 2003-05-26 | 2013-11-06 | Sumitomo Electric Industries, Ltd. | Diamond-coated electrode and method for producing same |
KR20060041230A (en) * | 2003-08-08 | 2006-05-11 | 가부시키가이샤 에바라 세이사꾸쇼 | Submerged electrode and material thereof |
JP4714454B2 (en) * | 2004-11-04 | 2011-06-29 | 信彦 大貫 | Hook jig and metal recovery method |
-
2005
- 2005-07-19 DE DE102005034419A patent/DE102005034419A1/en not_active Withdrawn
-
2006
- 2006-07-16 WO PCT/DE2006/001232 patent/WO2007009441A1/en active Application Filing
- 2006-07-16 DE DE112006002613T patent/DE112006002613A5/en not_active Withdrawn
- 2006-07-16 EP EP06761810A patent/EP1907608B1/en not_active Not-in-force
- 2006-07-16 JP JP2008521798A patent/JP2009501846A/en active Pending
- 2006-07-16 ES ES06761810T patent/ES2318762T3/en active Active
- 2006-07-16 DE DE502006002138T patent/DE502006002138D1/en not_active Expired - Fee Related
- 2006-07-16 CN CNA2006800323980A patent/CN101258270A/en active Pending
- 2006-07-16 PL PL06761810T patent/PL1907608T3/en unknown
- 2006-07-16 KR KR1020087003988A patent/KR20080031428A/en active IP Right Grant
- 2006-07-18 TW TW095126278A patent/TW200710280A/en unknown
-
2008
- 2008-01-22 US US12/017,650 patent/US20080128289A1/en not_active Abandoned
- 2008-02-18 NO NO20080837A patent/NO20080837L/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1907608A1 (en) | 2008-04-09 |
JP2009501846A (en) | 2009-01-22 |
KR20080031428A (en) | 2008-04-08 |
EP1907608B1 (en) | 2008-11-19 |
DE502006002138D1 (en) | 2009-01-02 |
US20080128289A1 (en) | 2008-06-05 |
ES2318762T3 (en) | 2009-05-01 |
PL1907608T3 (en) | 2009-04-30 |
DE102005034419A1 (en) | 2007-01-25 |
CN101258270A (en) | 2008-09-03 |
DE112006002613A5 (en) | 2008-07-03 |
WO2007009441A1 (en) | 2007-01-25 |
TW200710280A (en) | 2007-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO20080837L (en) | Use of a coating to form electrical contact | |
CN101627449B (en) | Thin solid electrolytic capacitor embeddable in a substrate | |
KR101630043B1 (en) | Embedded multilayer ceramic electronic component, manufacturing method thereof and print circuit board having embedded multilayer ceramic electronic component | |
US10176923B2 (en) | Ceramic electronic component and method of producing the same | |
CN102194571B (en) | Laminated electronic component and manufacturing method thereof | |
CA2546791A1 (en) | Fuel cell manufacturing method and fuel cell having a dielectric layer formed in pores of an electrolyte layer | |
GB2472953A (en) | Circuit module and method of manufacturing the same | |
GB2395922B (en) | Creating layers in thin-film structures | |
TW200711038A (en) | Method of forming a semiconductor device having a diffusion barrier stack and structure thereof | |
TWI256684B (en) | Method of fabricate interconnect structures | |
CN102222563A (en) | Laminated ceramic electronic component and manufacturing method therefor | |
US10361018B2 (en) | Method for producing a multi-layer component and multi-layer component | |
TW200737455A (en) | Method for fabricating a metal protecting layer on electrically connecting pad of circuit board | |
CN1949421B (en) | Method of manufacturing thin flim capacitor | |
TW201121044A (en) | Electronic device and method for producing the same | |
JP2010153719A (en) | Overvoltage protection parts and manufacturing method thereof | |
JP2021066921A (en) | Production method of circuit board | |
EP2058076A3 (en) | Method for treating a surface of an electrically conductive substrate surface | |
EP0168609B1 (en) | Method for repairing pinholes in dielectric layers | |
GB0516387D0 (en) | Electronic tag | |
JP2010129730A (en) | Wiring substrate and probe card using the same | |
CN114026270B (en) | Electrolysis device with two boron doped diamond layers | |
JP7388932B2 (en) | How to form metal wiring | |
WO2018100360A1 (en) | Electrode and electrochemical cell comprising the same | |
WO2018100359A1 (en) | Electrode and electrochemical cell comprising the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |