NO20061164L - Metode og anordning for å separere wafere fra en stabel med wafere - Google Patents

Metode og anordning for å separere wafere fra en stabel med wafere

Info

Publication number
NO20061164L
NO20061164L NO20061164A NO20061164A NO20061164L NO 20061164 L NO20061164 L NO 20061164L NO 20061164 A NO20061164 A NO 20061164A NO 20061164 A NO20061164 A NO 20061164A NO 20061164 L NO20061164 L NO 20061164L
Authority
NO
Norway
Prior art keywords
wafers
stack
separating
separating wafers
Prior art date
Application number
NO20061164A
Other languages
English (en)
Other versions
NO324488B1 (no
Inventor
Zuhair Kamil Sallom
Thor Christian Tuv
Eivind Johannes Øvrelid
Per Arne Wang
Original Assignee
Rec Scanwafer As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rec Scanwafer As filed Critical Rec Scanwafer As
Priority to NO20061164A priority Critical patent/NO324488B1/no
Priority to US12/225,091 priority patent/US20090226283A1/en
Priority to PCT/NO2007/000097 priority patent/WO2007105958A1/en
Priority to CNA2007800092800A priority patent/CN101405832A/zh
Priority to EP07715970A priority patent/EP1999778A1/en
Priority to JP2009500309A priority patent/JP2009530810A/ja
Priority to KR1020087024951A priority patent/KR20080112292A/ko
Publication of NO20061164L publication Critical patent/NO20061164L/no
Publication of NO324488B1 publication Critical patent/NO324488B1/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G60/00—Simultaneously or alternatively stacking and de-stacking of articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
NO20061164A 2006-03-13 2006-03-13 Metode og anordning for a separere wafere fra en stabel med wafere NO324488B1 (no)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NO20061164A NO324488B1 (no) 2006-03-13 2006-03-13 Metode og anordning for a separere wafere fra en stabel med wafere
US12/225,091 US20090226283A1 (en) 2006-03-13 2007-03-13 Method For Separating Wafers From A Stack Of Wafers
PCT/NO2007/000097 WO2007105958A1 (en) 2006-03-13 2007-03-13 Method for separating wafers from a stack of wafers
CNA2007800092800A CN101405832A (zh) 2006-03-13 2007-03-13 从晶片堆分离晶片的方法
EP07715970A EP1999778A1 (en) 2006-03-13 2007-03-13 Method for separating wafers from a stack of wafers
JP2009500309A JP2009530810A (ja) 2006-03-13 2007-03-13 ウェハのスタックから複数のウェハを個別に分離する方法
KR1020087024951A KR20080112292A (ko) 2006-03-13 2007-03-13 웨이퍼들의 적층물로부터 웨이퍼들을 분리시키는 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO20061164A NO324488B1 (no) 2006-03-13 2006-03-13 Metode og anordning for a separere wafere fra en stabel med wafere

Publications (2)

Publication Number Publication Date
NO20061164L true NO20061164L (no) 2007-09-14
NO324488B1 NO324488B1 (no) 2007-10-29

Family

ID=38001785

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20061164A NO324488B1 (no) 2006-03-13 2006-03-13 Metode og anordning for a separere wafere fra en stabel med wafere

Country Status (7)

Country Link
US (1) US20090226283A1 (no)
EP (1) EP1999778A1 (no)
JP (1) JP2009530810A (no)
KR (1) KR20080112292A (no)
CN (1) CN101405832A (no)
NO (1) NO324488B1 (no)
WO (1) WO2007105958A1 (no)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101950778A (zh) * 2010-09-02 2011-01-19 董维来 太阳能硅片湿法自动分片方法
KR102164544B1 (ko) 2014-01-22 2020-10-12 삼성전자 주식회사 가스 충진부를 구비하는 웨이퍼 스토리지 장치를 포함하는 반도체 제조 장치
CN108266972A (zh) * 2017-12-26 2018-07-10 德淮半导体有限公司 晶圆干燥方法
CN111380349A (zh) * 2018-12-28 2020-07-07 扬博科技股份有限公司 基板工艺的微波干燥装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428824A (en) * 1987-07-24 1989-01-31 Hitachi Ltd Drier
US20010046435A1 (en) * 2000-05-26 2001-11-29 Automation Technology, Inc. Method and apparatus for separating wafers

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5269557A (en) * 1975-12-08 1977-06-09 Mitsubishi Electric Corp Processing method of semiconductor wafer
JPS5691432A (en) * 1979-12-25 1981-07-24 Fujitsu Ltd Method for drying semiconductor substrate
JPS63133634A (ja) * 1986-11-26 1988-06-06 Fujitsu Ltd 基板の乾燥方法
JPH04229986A (ja) 1990-07-19 1992-08-19 Cem Corp 可動密封容器内容物加熱用温度制御式マイクロ波加熱装置
DE4100526A1 (de) 1991-01-10 1992-07-16 Wacker Chemitronic Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben
KR100471936B1 (ko) * 1996-06-04 2005-09-09 미쓰비시 마테리알 가부시키가이샤 웨이퍼의세정·박리방법및장치
JP3055475B2 (ja) * 1996-11-08 2000-06-26 日本電気株式会社 マイクロ波励起の洗浄方法およびその装置
FR2796491B1 (fr) * 1999-07-12 2001-08-31 Commissariat Energie Atomique Procede de decollement de deux elements et dispositif pour sa mise en oeuvre
JP2002261081A (ja) * 2001-03-01 2002-09-13 Asm Japan Kk 半導体ウエハのエッチング装置及び方法
JP2002270570A (ja) * 2001-03-07 2002-09-20 Hitachi Ltd 半導体装置の製造方法および半導体製造装置
JP2003106773A (ja) * 2001-09-26 2003-04-09 Micro Denshi Kk マイクロ波連続加熱装置
US6598314B1 (en) * 2002-01-04 2003-07-29 Taiwan Semiconductor Manufacturing Company Method of drying wafers
JP3939178B2 (ja) * 2002-03-25 2007-07-04 大日本スクリーン製造株式会社 高圧乾燥装置、高圧乾燥方法および基板処理装置
KR100464853B1 (ko) * 2002-06-20 2005-01-06 삼성전자주식회사 순간감압가열 건조방법 및 장치
JP2004021901A (ja) 2002-06-20 2004-01-22 Canon Inc 被検者情報設定方法
JP2004219010A (ja) * 2003-01-17 2004-08-05 Sharp Corp 高周波加熱調理器
AU2003235243A1 (en) * 2003-05-13 2004-12-03 Mimasu Semiconductor Industry Co., Ltd. Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
US20070167029A1 (en) * 2005-11-11 2007-07-19 Kowalski Jeffrey M Thermal processing system, components, and methods
US20070215612A1 (en) * 2006-03-20 2007-09-20 Hicks Keith R Apparatus and method for microwave processing of materials

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428824A (en) * 1987-07-24 1989-01-31 Hitachi Ltd Drier
US20010046435A1 (en) * 2000-05-26 2001-11-29 Automation Technology, Inc. Method and apparatus for separating wafers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
- *

Also Published As

Publication number Publication date
JP2009530810A (ja) 2009-08-27
NO324488B1 (no) 2007-10-29
WO2007105958A1 (en) 2007-09-20
KR20080112292A (ko) 2008-12-24
US20090226283A1 (en) 2009-09-10
CN101405832A (zh) 2009-04-08
EP1999778A1 (en) 2008-12-10

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Legal Events

Date Code Title Description
CHAD Change of the owner's name or address (par. 44 patent law, par. patentforskriften)

Owner name: REC WAFER PTE LTD, SG

CHAD Change of the owner's name or address (par. 44 patent law, par. patentforskriften)

Owner name: REC SOLAR PTE LTD, SG