NO20043180L - Elektrisk viaforbindelse og tilknyttet kontaktanordning samt fremgangsmate til deres fremstilling - Google Patents

Elektrisk viaforbindelse og tilknyttet kontaktanordning samt fremgangsmate til deres fremstilling

Info

Publication number
NO20043180L
NO20043180L NO20043180A NO20043180A NO20043180L NO 20043180 L NO20043180 L NO 20043180L NO 20043180 A NO20043180 A NO 20043180A NO 20043180 A NO20043180 A NO 20043180A NO 20043180 L NO20043180 L NO 20043180L
Authority
NO
Norway
Prior art keywords
manufacture
well
wire connection
contact device
electrical wire
Prior art date
Application number
NO20043180A
Other languages
English (en)
Other versions
NO321381B1 (no
NO20043180D0 (no
Inventor
Goran Gustafsson
Rickard Liljedahl
Original Assignee
Thin Film Electronics Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thin Film Electronics Asa filed Critical Thin Film Electronics Asa
Priority to NO20043180A priority Critical patent/NO321381B1/no
Publication of NO20043180D0 publication Critical patent/NO20043180D0/no
Priority to PCT/NO2005/000269 priority patent/WO2006009463A1/en
Priority to CNA200580031326XA priority patent/CN101023526A/zh
Priority to EP05761433A priority patent/EP1782469A1/en
Priority to US11/185,808 priority patent/US20060018175A1/en
Publication of NO20043180L publication Critical patent/NO20043180L/no
Publication of NO321381B1 publication Critical patent/NO321381B1/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
NO20043180A 2004-07-22 2004-07-22 Elektrisk viaforbindelse og tilknyttet kontaktanordning samt fremgangsmate til deres fremstilling NO321381B1 (no)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NO20043180A NO321381B1 (no) 2004-07-22 2004-07-22 Elektrisk viaforbindelse og tilknyttet kontaktanordning samt fremgangsmate til deres fremstilling
PCT/NO2005/000269 WO2006009463A1 (en) 2004-07-22 2005-07-18 Electrical via connection and associated contact means as well as a method for their manufacture
CNA200580031326XA CN101023526A (zh) 2004-07-22 2005-07-18 电通路连接和关联的接触部件以及它们的制造方法
EP05761433A EP1782469A1 (en) 2004-07-22 2005-07-18 Electrical via connection and associated contact means as well as a method for their manufacture
US11/185,808 US20060018175A1 (en) 2004-07-22 2005-07-21 Electrical via connection and associated contact means as well as a method for their manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO20043180A NO321381B1 (no) 2004-07-22 2004-07-22 Elektrisk viaforbindelse og tilknyttet kontaktanordning samt fremgangsmate til deres fremstilling

Publications (3)

Publication Number Publication Date
NO20043180D0 NO20043180D0 (no) 2004-07-22
NO20043180L true NO20043180L (no) 2006-01-23
NO321381B1 NO321381B1 (no) 2006-05-02

Family

ID=35013327

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20043180A NO321381B1 (no) 2004-07-22 2004-07-22 Elektrisk viaforbindelse og tilknyttet kontaktanordning samt fremgangsmate til deres fremstilling

Country Status (5)

Country Link
US (1) US20060018175A1 (no)
EP (1) EP1782469A1 (no)
CN (1) CN101023526A (no)
NO (1) NO321381B1 (no)
WO (1) WO2006009463A1 (no)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO321280B1 (no) * 2004-07-22 2006-04-18 Thin Film Electronics Asa Organisk, elektronisk krets og fremgangsmate til dens fremstilling
FR2880990B1 (fr) * 2005-01-14 2007-04-27 St Microelectronics Sa Dispositif semi-conducteur optique a diodes photo-sensibles et procede de fabrication d'un tel dispositif.
JP5497261B2 (ja) * 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
US7839672B1 (en) 2006-12-18 2010-11-23 Marvell International Ltd. Phase change memory array circuits and methods of manufacture
US7868453B2 (en) * 2008-02-15 2011-01-11 International Business Machines Corporation Solder interconnect pads with current spreading layers
US8390553B2 (en) * 2009-02-13 2013-03-05 Apple Inc. Advanced pixel design for optimized driving
US20100208179A1 (en) * 2009-02-13 2010-08-19 Apple Inc. Pixel Black Mask Design and Formation Technique
US8345177B2 (en) * 2009-02-13 2013-01-01 Shih Chang Chang Via design for use in displays
US8587758B2 (en) * 2009-02-13 2013-11-19 Apple Inc. Electrodes for use in displays
US8633879B2 (en) 2009-02-13 2014-01-21 Apple Inc. Undulating electrodes for improved viewing angle and color shift
US9612489B2 (en) * 2009-02-13 2017-04-04 Apple Inc. Placement and shape of electrodes for use in displays
US8294647B2 (en) * 2009-02-13 2012-10-23 Apple Inc. LCD pixel design varying by color
US8558978B2 (en) * 2009-02-13 2013-10-15 Apple Inc. LCD panel with index-matching passivation layers
US8531408B2 (en) * 2009-02-13 2013-09-10 Apple Inc. Pseudo multi-domain design for improved viewing angle and color shift
US8111232B2 (en) * 2009-03-27 2012-02-07 Apple Inc. LCD electrode arrangement
US8294850B2 (en) * 2009-03-31 2012-10-23 Apple Inc. LCD panel having improved response
US9753597B2 (en) * 2009-07-24 2017-09-05 Cypress Semiconductor Corporation Mutual capacitance sensing array
CN111337857B (zh) * 2020-04-21 2022-06-28 广东电网有限责任公司梅州供电局 一种科隆模块的测试电缆线对工具

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5322816A (en) * 1993-01-19 1994-06-21 Hughes Aircraft Company Method for forming deep conductive feedthroughs
US5766379A (en) * 1995-06-07 1998-06-16 The Research Foundation Of State University Of New York Passivated copper conductive layers for microelectronic applications and methods of manufacturing same
US6127070A (en) * 1998-12-01 2000-10-03 Advanced Micro Devices, Inc. Thin resist with nitride hard mask for via etch application
US6495442B1 (en) * 2000-10-18 2002-12-17 Magic Corporation Post passivation interconnection schemes on top of the IC chips
DE10156470B4 (de) * 2001-11-16 2006-06-08 Infineon Technologies Ag RF-ID-Etikett mit einer Halbleiteranordnung mit Transistoren auf Basis organischer Halbleiter und nichtflüchtiger Schreib-Lese-Speicherzellen
US6828685B2 (en) * 2002-06-14 2004-12-07 Hewlett-Packard Development Company, L.P. Memory device having a semiconducting polymer film
NO317845B1 (no) * 2002-11-29 2004-12-20 Thin Film Electronics Asa Mellomlagsforbindelser for lagdelte elektroniske innretninger

Also Published As

Publication number Publication date
EP1782469A1 (en) 2007-05-09
US20060018175A1 (en) 2006-01-26
WO2006009463A8 (en) 2006-04-20
NO321381B1 (no) 2006-05-02
WO2006009463A1 (en) 2006-01-26
CN101023526A (zh) 2007-08-22
NO20043180D0 (no) 2004-07-22

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