NO20021031L - Kapasitiv eksitasjon - Google Patents
Kapasitiv eksitasjonInfo
- Publication number
- NO20021031L NO20021031L NO20021031A NO20021031A NO20021031L NO 20021031 L NO20021031 L NO 20021031L NO 20021031 A NO20021031 A NO 20021031A NO 20021031 A NO20021031 A NO 20021031A NO 20021031 L NO20021031 L NO 20021031L
- Authority
- NO
- Norway
- Prior art keywords
- sensor elements
- electronic circuit
- sensor
- coupled
- outer electrode
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
Denne oppfinnelsen angår en sensormodul for måling av strukturer i en overflate, særlig en fingeroverflate, som beveges over sensormodulen, omfattende et antall sensorelementer og en ytre elektrode plassert ved siden av sensorelementene, der sensorelementene er er koblet til minst en AC driverkrets som påtrykker en varierende strøm eller spenning, for derved å koble et signal gjennom sensorelementene til den ytre elektroden. Sensorelementene er også koblet til en elektronisk krets plassert på et substrat, hvilket substrat omfatter leder som kobler sensorelementene til den elektroniske kretsen, og der den elektroniske kretsen er innrettet til å måle størrelsen til kapasitansen eller AC impedansen mellom hvert sensorelement og den ytre elektroden. Sensorelementene utgjør et i det vesentlige lineært array, der arrayet er innrettet til å måle kapasitansen eller impedansen mellom hvert sensorelement og den ytre elektroden ved valgte tidspunkter, og at de målte verdiene blir kombinert for å danne en representasjon av overflatemønsteret.
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20021031A NO316796B1 (no) | 2002-03-01 | 2002-03-01 | Sensormodul for maling av strukturer i en overflate, saerlig en fingeroverflate |
AU2003208676A AU2003208676A1 (en) | 2002-03-01 | 2003-02-28 | Sensor module for measuring surfaces |
US10/506,197 US7239153B2 (en) | 2002-03-01 | 2003-02-28 | Sensor module for measuring surfaces |
EP03707262A EP1581111B1 (en) | 2002-03-01 | 2003-02-28 | Sensor module for measuring surfaces |
DE60313219T DE60313219T2 (de) | 2002-03-01 | 2003-02-28 | Sensormodul zur oberflächenmessung |
DK03707262T DK1581111T3 (da) | 2002-03-01 | 2003-02-28 | Sensormodul til måling af overflader |
ES03707262T ES2286407T3 (es) | 2002-03-01 | 2003-02-28 | Modulo detector para medir superficies. |
AT03707262T ATE359566T1 (de) | 2002-03-01 | 2003-02-28 | Sensormodul zur oberflächenmessung |
PCT/NO2003/000071 WO2003075210A2 (en) | 2002-03-01 | 2003-02-28 | Sensor module for measuring surfaces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20021031A NO316796B1 (no) | 2002-03-01 | 2002-03-01 | Sensormodul for maling av strukturer i en overflate, saerlig en fingeroverflate |
Publications (3)
Publication Number | Publication Date |
---|---|
NO20021031D0 NO20021031D0 (no) | 2002-03-01 |
NO20021031L true NO20021031L (no) | 2003-09-02 |
NO316796B1 NO316796B1 (no) | 2004-05-10 |
Family
ID=19913383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20021031A NO316796B1 (no) | 2002-03-01 | 2002-03-01 | Sensormodul for maling av strukturer i en overflate, saerlig en fingeroverflate |
Country Status (9)
Country | Link |
---|---|
US (1) | US7239153B2 (no) |
EP (1) | EP1581111B1 (no) |
AT (1) | ATE359566T1 (no) |
AU (1) | AU2003208676A1 (no) |
DE (1) | DE60313219T2 (no) |
DK (1) | DK1581111T3 (no) |
ES (1) | ES2286407T3 (no) |
NO (1) | NO316796B1 (no) |
WO (1) | WO2003075210A2 (no) |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
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US7190251B2 (en) | 1999-05-25 | 2007-03-13 | Varatouch Technology Incorporated | Variable resistance devices and methods |
NO315016B1 (no) * | 2000-06-09 | 2003-06-23 | Idex Asa | Miniatyrisert sensor |
ATE307362T1 (de) | 2000-12-05 | 2005-11-15 | Validity Sensors Inc | System und methode zur kapazitiven aufnahme von fingerabdrücken durch überstreichen |
FI115109B (fi) * | 2003-01-22 | 2005-02-28 | Nokia Corp | Tunnistusjärjestely ja tunnistusjärjestelyn käsittävä matkaviestin |
WO2004077340A1 (en) * | 2003-02-28 | 2004-09-10 | Idex Asa | Substrate multiplexing with active switches |
US7697729B2 (en) | 2004-01-29 | 2010-04-13 | Authentec, Inc. | System for and method of finger initiated actions |
EP1754180A1 (en) | 2004-04-16 | 2007-02-21 | Validity Sensors Inc. | Finger position sensing methods and apparatus |
US8358815B2 (en) | 2004-04-16 | 2013-01-22 | Validity Sensors, Inc. | Method and apparatus for two-dimensional finger motion tracking and control |
US8447077B2 (en) | 2006-09-11 | 2013-05-21 | Validity Sensors, Inc. | Method and apparatus for fingerprint motion tracking using an in-line array |
US8229184B2 (en) | 2004-04-16 | 2012-07-24 | Validity Sensors, Inc. | Method and algorithm for accurate finger motion tracking |
US8165355B2 (en) | 2006-09-11 | 2012-04-24 | Validity Sensors, Inc. | Method and apparatus for fingerprint motion tracking using an in-line array for use in navigation applications |
US8131026B2 (en) | 2004-04-16 | 2012-03-06 | Validity Sensors, Inc. | Method and apparatus for fingerprint image reconstruction |
US8175345B2 (en) | 2004-04-16 | 2012-05-08 | Validity Sensors, Inc. | Unitized ergonomic two-dimensional fingerprint motion tracking device and method |
US7751601B2 (en) | 2004-10-04 | 2010-07-06 | Validity Sensors, Inc. | Fingerprint sensing assemblies and methods of making |
EP1747525A2 (en) | 2004-04-23 | 2007-01-31 | Validity Sensors Inc. | Methods and apparatus for acquiring a swiped fingerprint image |
US7831070B1 (en) | 2005-02-18 | 2010-11-09 | Authentec, Inc. | Dynamic finger detection mechanism for a fingerprint sensor |
US8231056B2 (en) | 2005-04-08 | 2012-07-31 | Authentec, Inc. | System for and method of protecting an integrated circuit from over currents |
US7496216B2 (en) * | 2005-06-21 | 2009-02-24 | Hewlett-Packard Development Company, L.P. | Fingerprint capture |
US7460697B2 (en) | 2005-07-19 | 2008-12-02 | Validity Sensors, Inc. | Electronic fingerprint sensor with differential noise cancellation |
JP4740743B2 (ja) * | 2006-01-06 | 2011-08-03 | 富士通株式会社 | 生体情報入力装置 |
US7684953B2 (en) | 2006-02-10 | 2010-03-23 | Authentec, Inc. | Systems using variable resistance zones and stops for generating inputs to an electronic device |
US7656392B2 (en) * | 2006-03-24 | 2010-02-02 | Synaptics Incorporated | Touch sensor effective area enhancement |
KR100796172B1 (ko) * | 2006-07-20 | 2008-01-21 | 마이크로 인스펙션 주식회사 | 비접촉 싱글사이드 프로브 구조 |
US9235274B1 (en) | 2006-07-25 | 2016-01-12 | Apple Inc. | Low-profile or ultra-thin navigation pointing or haptic feedback device |
US8107212B2 (en) | 2007-04-30 | 2012-01-31 | Validity Sensors, Inc. | Apparatus and method for protecting fingerprint sensing circuitry from electrostatic discharge |
US8290150B2 (en) | 2007-05-11 | 2012-10-16 | Validity Sensors, Inc. | Method and system for electronically securing an electronic device using physically unclonable functions |
US20080297174A1 (en) * | 2007-05-31 | 2008-12-04 | Sarangan Narasimhan | Capacitive sensing devices |
US8276816B2 (en) | 2007-12-14 | 2012-10-02 | Validity Sensors, Inc. | Smart card system with ergonomic fingerprint sensor and method of using |
US8204281B2 (en) | 2007-12-14 | 2012-06-19 | Validity Sensors, Inc. | System and method to remove artifacts from fingerprint sensor scans |
US8116540B2 (en) | 2008-04-04 | 2012-02-14 | Validity Sensors, Inc. | Apparatus and method for reducing noise in fingerprint sensing circuits |
US8005276B2 (en) | 2008-04-04 | 2011-08-23 | Validity Sensors, Inc. | Apparatus and method for reducing parasitic capacitive coupling and noise in fingerprint sensing circuits |
EP2321764A4 (en) | 2008-07-22 | 2012-10-10 | Validity Sensors Inc | SYSTEM, DEVICE AND METHOD FOR SECURING A DEVICE COMPONENT |
US7855565B2 (en) * | 2008-11-06 | 2010-12-21 | Xerox Corporation | Substrate characterization device and method for characterizing a substrate |
US8391568B2 (en) | 2008-11-10 | 2013-03-05 | Validity Sensors, Inc. | System and method for improved scanning of fingerprint edges |
US8600122B2 (en) | 2009-01-15 | 2013-12-03 | Validity Sensors, Inc. | Apparatus and method for culling substantially redundant data in fingerprint sensing circuits |
US8278946B2 (en) | 2009-01-15 | 2012-10-02 | Validity Sensors, Inc. | Apparatus and method for detecting finger activity on a fingerprint sensor |
US8374407B2 (en) | 2009-01-28 | 2013-02-12 | Validity Sensors, Inc. | Live finger detection |
FI20095187A (fi) * | 2009-02-26 | 2010-08-27 | Valtion Teknillinen | Menetelmä ja laitteisto etanolin tunnistusta varten |
US9336428B2 (en) | 2009-10-30 | 2016-05-10 | Synaptics Incorporated | Integrated fingerprint sensor and display |
US9274553B2 (en) | 2009-10-30 | 2016-03-01 | Synaptics Incorporated | Fingerprint sensor and integratable electronic display |
US9400911B2 (en) | 2009-10-30 | 2016-07-26 | Synaptics Incorporated | Fingerprint sensor and integratable electronic display |
US8421890B2 (en) | 2010-01-15 | 2013-04-16 | Picofield Technologies, Inc. | Electronic imager using an impedance sensor grid array and method of making |
US8791792B2 (en) | 2010-01-15 | 2014-07-29 | Idex Asa | Electronic imager using an impedance sensor grid array mounted on or about a switch and method of making |
US8866347B2 (en) | 2010-01-15 | 2014-10-21 | Idex Asa | Biometric image sensing |
US9666635B2 (en) | 2010-02-19 | 2017-05-30 | Synaptics Incorporated | Fingerprint sensing circuit |
US8716613B2 (en) | 2010-03-02 | 2014-05-06 | Synaptics Incoporated | Apparatus and method for electrostatic discharge protection |
US9001040B2 (en) | 2010-06-02 | 2015-04-07 | Synaptics Incorporated | Integrated fingerprint sensor and navigation device |
EP2596478B1 (en) | 2010-07-19 | 2019-09-04 | Risst Ltd. | Fingerprint sensors and systems incorporating fingerprint sensors |
US8331096B2 (en) | 2010-08-20 | 2012-12-11 | Validity Sensors, Inc. | Fingerprint acquisition expansion card apparatus |
US8503140B2 (en) | 2010-10-05 | 2013-08-06 | International Business Machines Corporation | Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structures |
US8538097B2 (en) | 2011-01-26 | 2013-09-17 | Validity Sensors, Inc. | User input utilizing dual line scanner apparatus and method |
US8594393B2 (en) | 2011-01-26 | 2013-11-26 | Validity Sensors | System for and method of image reconstruction with dual line scanner using line counts |
GB2489100A (en) | 2011-03-16 | 2012-09-19 | Validity Sensors Inc | Wafer-level packaging for a fingerprint sensor |
US10043052B2 (en) | 2011-10-27 | 2018-08-07 | Synaptics Incorporated | Electronic device packages and methods |
US9195877B2 (en) | 2011-12-23 | 2015-11-24 | Synaptics Incorporated | Methods and devices for capacitive image sensing |
US9785299B2 (en) | 2012-01-03 | 2017-10-10 | Synaptics Incorporated | Structures and manufacturing methods for glass covered electronic devices |
US9251329B2 (en) | 2012-03-27 | 2016-02-02 | Synaptics Incorporated | Button depress wakeup and wakeup strategy |
US9268991B2 (en) | 2012-03-27 | 2016-02-23 | Synaptics Incorporated | Method of and system for enrolling and matching biometric data |
US9137438B2 (en) | 2012-03-27 | 2015-09-15 | Synaptics Incorporated | Biometric object sensor and method |
US9600709B2 (en) | 2012-03-28 | 2017-03-21 | Synaptics Incorporated | Methods and systems for enrolling biometric data |
US9152838B2 (en) | 2012-03-29 | 2015-10-06 | Synaptics Incorporated | Fingerprint sensor packagings and methods |
US20130279769A1 (en) | 2012-04-10 | 2013-10-24 | Picofield Technologies Inc. | Biometric Sensing |
US9665762B2 (en) | 2013-01-11 | 2017-05-30 | Synaptics Incorporated | Tiered wakeup strategy |
US9639214B2 (en) * | 2013-07-22 | 2017-05-02 | Synaptics Incorporated | Utilizing chip-on-glass technology to jumper routing traces |
NO20131424A1 (no) | 2013-10-28 | 2015-04-29 | Idex Asa | Fremgangsmåte og apparat for redusert krysstale og ASIC-areal in en fingeravtrykksensor. |
US9558390B2 (en) * | 2014-07-25 | 2017-01-31 | Qualcomm Incorporated | High-resolution electric field sensor in cover glass |
US9984273B2 (en) * | 2015-12-30 | 2018-05-29 | Image Match Design Inc. | Sensing element and fingerprint sensor comprising the same |
CN109668659B (zh) * | 2017-10-17 | 2020-12-18 | 宏碁股份有限公司 | 压力传感器以及压力感测方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2244164A (en) * | 1990-05-18 | 1991-11-20 | Philips Electronic Associated | Fingerprint sensing |
DE19511646C2 (de) * | 1995-03-30 | 1999-01-07 | Fife Gmbh | Vorrichtung zum berührungslosen Erfassen der Lage eines laufenden Materialbandes |
US5748005A (en) * | 1995-10-31 | 1998-05-05 | Creare, Inc. | Radial displacement sensor for non-contact bearings |
US6049620A (en) * | 1995-12-15 | 2000-04-11 | Veridicom, Inc. | Capacitive fingerprint sensor with adjustable gain |
NO307065B1 (no) | 1998-02-26 | 2000-01-31 | Idex As | Fingeravtrykksensor |
NO314647B1 (no) * | 2000-06-09 | 2003-04-22 | Idex Asa | Målesystem for fingeravtrykksensor |
NO315017B1 (no) * | 2000-06-09 | 2003-06-23 | Idex Asa | Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate |
NO315016B1 (no) | 2000-06-09 | 2003-06-23 | Idex Asa | Miniatyrisert sensor |
US6525547B2 (en) * | 2001-04-17 | 2003-02-25 | Sentronics Corporation | Capacitive two dimensional sensor |
JP2003028607A (ja) * | 2001-07-12 | 2003-01-29 | Sony Corp | 静電容量検出装置およびこれを用いた指紋照合装置 |
-
2002
- 2002-03-01 NO NO20021031A patent/NO316796B1/no not_active IP Right Cessation
-
2003
- 2003-02-28 EP EP03707262A patent/EP1581111B1/en not_active Expired - Lifetime
- 2003-02-28 AU AU2003208676A patent/AU2003208676A1/en not_active Abandoned
- 2003-02-28 ES ES03707262T patent/ES2286407T3/es not_active Expired - Lifetime
- 2003-02-28 DK DK03707262T patent/DK1581111T3/da active
- 2003-02-28 US US10/506,197 patent/US7239153B2/en not_active Expired - Lifetime
- 2003-02-28 AT AT03707262T patent/ATE359566T1/de active
- 2003-02-28 DE DE60313219T patent/DE60313219T2/de not_active Expired - Lifetime
- 2003-02-28 WO PCT/NO2003/000071 patent/WO2003075210A2/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
WO2003075210A2 (en) | 2003-09-12 |
AU2003208676A1 (en) | 2003-09-16 |
ES2286407T3 (es) | 2007-12-01 |
ATE359566T1 (de) | 2007-05-15 |
NO20021031D0 (no) | 2002-03-01 |
DE60313219T2 (de) | 2007-12-20 |
NO316796B1 (no) | 2004-05-10 |
WO2003075210A3 (en) | 2005-08-11 |
EP1581111A2 (en) | 2005-10-05 |
DE60313219D1 (de) | 2007-05-24 |
AU2003208676A8 (en) | 2003-09-16 |
EP1581111B1 (en) | 2007-04-11 |
US7239153B2 (en) | 2007-07-03 |
DK1581111T3 (da) | 2007-07-16 |
US20050089200A1 (en) | 2005-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CHAD | Change of the owner's name or address (par. 44 patent law, par. patentforskriften) |
Owner name: IDEX ASA, NO |
|
MM1K | Lapsed by not paying the annual fees |