NO151183C - PROCEDURE FOR INTENSIFICATION OF RINSE AND CLEANING PROCESSES FOR PERFORATIONS IN PIECES IN RINSE AND CLEANER - Google Patents

PROCEDURE FOR INTENSIFICATION OF RINSE AND CLEANING PROCESSES FOR PERFORATIONS IN PIECES IN RINSE AND CLEANER

Info

Publication number
NO151183C
NO151183C NO810902A NO810902A NO151183C NO 151183 C NO151183 C NO 151183C NO 810902 A NO810902 A NO 810902A NO 810902 A NO810902 A NO 810902A NO 151183 C NO151183 C NO 151183C
Authority
NO
Norway
Prior art keywords
rinse
intensification
perforations
cleaner
pieces
Prior art date
Application number
NO810902A
Other languages
Norwegian (no)
Other versions
NO810902L (en
NO151183B (en
Inventor
Georg Mueller
Wolfgang Gebauer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NO810902L publication Critical patent/NO810902L/en
Publication of NO151183B publication Critical patent/NO151183B/en
Publication of NO151183C publication Critical patent/NO151183C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
NO810902A 1980-03-21 1981-03-16 PROCEDURE FOR INTENSIFICATION OF RINSE AND CLEANING PROCESSES FOR PERFORATIONS IN PIECES IN RINSE AND CLEANER NO151183C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3011061A DE3011061C2 (en) 1980-03-21 1980-03-21 Process for intensifying rinsing and cleaning processes for perforations in molded parts in automatic rinsing and cleaning machines

Publications (3)

Publication Number Publication Date
NO810902L NO810902L (en) 1981-09-22
NO151183B NO151183B (en) 1984-11-19
NO151183C true NO151183C (en) 1985-02-27

Family

ID=6097972

Family Applications (1)

Application Number Title Priority Date Filing Date
NO810902A NO151183C (en) 1980-03-21 1981-03-16 PROCEDURE FOR INTENSIFICATION OF RINSE AND CLEANING PROCESSES FOR PERFORATIONS IN PIECES IN RINSE AND CLEANER

Country Status (3)

Country Link
EP (1) EP0037483B1 (en)
DE (1) DE3011061C2 (en)
NO (1) NO151183C (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3244860C2 (en) * 1982-12-03 1985-09-19 Siemens AG, 1000 Berlin und 8000 München Device for the oxidation of copper surfaces with a liquid oxidizing agent, especially in the case of printed circuit boards, by means of a horizontally operating continuous system
DE3528575A1 (en) * 1985-08-06 1987-02-19 Schering Ag METHOD AND DEVICE FOR CLEANING, ACTIVATING AND / OR METALLIZING DRILL HOLES IN HORIZONTALLY GUIDED PCBS
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
DE3708529A1 (en) * 1987-03-16 1988-09-29 Siemens Ag Cleansing module
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus
DE3916694A1 (en) * 1989-05-23 1990-11-29 Schering Ag ARRANGEMENT FOR CHEMICAL TREATMENT AND / OR CLEANING OF GOODS, ESPECIALLY BOLTED PCBS AND RELATED METHOD
DE3916693A1 (en) * 1989-05-23 1990-11-29 Schering Ag ARRANGEMENT FOR THE TREATMENT AND / OR CLEANING OF GOODS, IN PARTICULAR BORED BOARDS
ATE145672T1 (en) * 1989-08-29 1996-12-15 Univ California NEW INHIBITORS FOR HYDROLYTIC ENZYMES AND SUBSTRATES AND DETERMINATION METHODS, INCLUDING THE SAME METHODS AND TESTS
DE3932779A1 (en) * 1989-09-30 1991-04-11 Schering Ag METHOD FOR TREATING OBJECTS WITH A LIQUID, AND APPARATUS FOR CARRYING OUT THE METHOD
DE4017380C1 (en) * 1990-05-30 1991-10-02 Schering Ag Berlin-Bergkamen, 1000 Berlin, De Washing-out bores in objects to be galvanised - by alternating increasing and lowering of pressure of cleaning or rinsing liq., flowing through
DE4040119A1 (en) * 1990-12-13 1992-06-17 Schering Ag METHOD FOR FLOODING HOLES IN PLATE-SHAPED WORKPIECES, ESPECIALLY CIRCUIT BOARDS, AND DEVICE THEREFOR
US6016817A (en) * 1995-01-05 2000-01-25 Atotech Deutschland Gmbh Method and device for the treatment of plate-shaped workpieces having small holes
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
DE19524562A1 (en) * 1995-07-06 1997-01-09 Schmid Gmbh & Co Geb Device for treating flexible plate or sheet-shaped objects, in particular printed circuit boards
DE19530989C1 (en) * 1995-08-23 1997-03-13 Atotech Deutschland Gmbh Film stripping process
JP3005898B2 (en) * 1998-04-30 2000-02-07 東京化工機株式会社 Liquid ejection device
DE10015349A1 (en) * 2000-03-23 2001-10-25 Atotech Deutschland Gmbh Treatment method for wetting, removal of gas bubbles and improving material exchange in both through and blind holes in circuit boards by impulse generation
US8150543B2 (en) 2007-09-28 2012-04-03 Siemens Aktiengesellschaft Methods, apparatus and articles for an air jet loom
US7951244B2 (en) * 2008-01-11 2011-05-31 Illinois Tool Works Inc. Liquid cleaning apparatus for cleaning printed circuit boards
JP6329380B2 (en) * 2014-02-07 2018-05-23 株式会社ジャパンディスプレイ Manufacturing method and manufacturing apparatus for liquid crystal display device
CN111570151A (en) * 2020-04-21 2020-08-25 石狮市天宏金属制品有限公司 Production device and process for steel heat-insulation fireproof door

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB837487A (en) * 1957-05-08 1960-06-15 Birmetals Ltd Etching curved surfaces
US3082774A (en) * 1961-02-08 1963-03-26 Ct Circuits Inc Etching machine
US3630453A (en) * 1970-02-20 1971-12-28 United States Steel Corp Adjustable elongated spray nozzle
DE2016969A1 (en) * 1970-04-09 1971-12-23 Dainippon Screen Mfg Pickling process for obtaining perforations - in metallic sheet

Also Published As

Publication number Publication date
NO810902L (en) 1981-09-22
EP0037483B1 (en) 1984-08-22
EP0037483A1 (en) 1981-10-14
DE3011061A1 (en) 1981-10-15
DE3011061C2 (en) 1983-12-22
NO151183B (en) 1984-11-19

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Legal Events

Date Code Title Description
MK1K Patent expired

Free format text: EXPIRED IN MARCH 2001

MM1K Lapsed by not paying the annual fees

Free format text: LAPSED IN MARCH 2001