NO135943B - - Google Patents
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- NO135943B NO135943B NO4262/73A NO426273A NO135943B NO 135943 B NO135943 B NO 135943B NO 4262/73 A NO4262/73 A NO 4262/73A NO 426273 A NO426273 A NO 426273A NO 135943 B NO135943 B NO 135943B
- Authority
- NO
- Norway
- Prior art keywords
- lead
- aluminum
- plating
- weight
- nickel
- Prior art date
Links
- 238000007747 plating Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- 238000005219 brazing Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 150000003839 salts Chemical class 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- HEPLMSKRHVKCAQ-UHFFFAOYSA-N lead nickel Chemical compound [Ni].[Pb] HEPLMSKRHVKCAQ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 6
- 239000000908 ammonium hydroxide Substances 0.000 claims description 6
- 239000002585 base Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- PYPDMIQMPWEFHX-UHFFFAOYSA-N [Pb].[Co] Chemical compound [Pb].[Co] PYPDMIQMPWEFHX-UHFFFAOYSA-N 0.000 claims description 5
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 5
- HOQPTLCRWVZIQZ-UHFFFAOYSA-H bis[[2-(5-hydroxy-4,7-dioxo-1,3,2$l^{2}-dioxaplumbepan-5-yl)acetyl]oxy]lead Chemical compound [Pb+2].[Pb+2].[Pb+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HOQPTLCRWVZIQZ-UHFFFAOYSA-H 0.000 claims description 4
- 239000000337 buffer salt Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 229940046892 lead acetate Drugs 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 3
- 239000001509 sodium citrate Substances 0.000 claims description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 3
- 239000000176 sodium gluconate Substances 0.000 claims description 3
- 229940005574 sodium gluconate Drugs 0.000 claims description 3
- 235000012207 sodium gluconate Nutrition 0.000 claims description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 claims description 2
- 229910000361 cobalt sulfate Inorganic materials 0.000 claims description 2
- 229940044175 cobalt sulfate Drugs 0.000 claims description 2
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910001510 metal chloride Inorganic materials 0.000 claims description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005304 joining Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- KMWBBMXGHHLDKL-UHFFFAOYSA-N [AlH3].[Si] Chemical compound [AlH3].[Si] KMWBBMXGHHLDKL-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910000907 nickel aluminide Inorganic materials 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Foreliggende oppfinnelse angår en fremgangsmåte for plettering på overflater av aluminium eller aluminium-legeringer samt bad for utførelse av fremgangsmåten. The present invention relates to a method for plating on surfaces of aluminum or aluminum alloys and a bath for carrying out the method.
Tidligere ble plettering av aluminium med et bindings-befordrende metall eller hjelpemetall som nikkel og/eller kobolt gjennomført på mange måter. Til disse tidligere metoder hører pletteringsteknikker som benytter sure pletteringsmedia, f.eks. som beskrevet i US-patent nr. 1.837.835. Videre kjenner man vanlig kjemisk avsetning uten elektrisitet fra en hypofosfitt-oppløsning, som beskrevet i US-patent nr. 2.532.283. Sistnevnte belegningsmetode gir skinnende belegg med tiltrekkende utseende. Disse skinnende belegg er imidlertid dårligere enn belegg avsatt ved termisk nedbrytning eller vakuum-belegging når beleg-get skal brukes for senere sammenføyning. Når således en belagt del, fremstilt ved kjente pletteringsmetoder, brukes til en påfølgende sammenføyningsoperasjon, blir bindingen ofte ikke sterk nok. US-patent nr. 3.482.305 omhandler en slagloddemetode hvor man bruker et sammenføyningsbefordrende metall i forbindelse med lodding av aluminium. Foreliggende oppfinnelse er en forbedring av slik plettering hvor den pletterte aluminiumgjenstand skal sammenføyes med en annen aluminiumgjenstand ved slaglodding og gjør denne prosess enklere og bedre. In the past, plating of aluminum with a bond-promoting metal or auxiliary metal such as nickel and/or cobalt was carried out in many ways. These earlier methods include plating techniques that use acidic plating media, e.g. as described in US Patent No. 1,837,835. Furthermore, ordinary chemical deposition without electricity from a hypophosphite solution is known, as described in US patent no. 2,532,283. The latter coating method provides a shiny coating with an attractive appearance. However, these shiny coatings are inferior to coatings deposited by thermal decomposition or vacuum coating when the coating is to be used for later joining. Thus, when a coated part, produced by known plating methods, is used for a subsequent joining operation, the bond is often not strong enough. US patent no. 3,482,305 deals with a brazing method where a join-promoting metal is used in connection with the brazing of aluminium. The present invention is an improvement of such plating where the plated aluminum object is to be joined with another aluminum object by blow soldering and makes this process easier and better.
Ifølge foreliggende oppfinnelse er det tilveiebragt en fremgangsmåte for plettering på overflater av aluminium eller aluminium-legeringer med nikkel-bly, kobolt-bly eller blandinger av disse (i det følgende også kalt hjelpelegeringer), forut for slaglodding av to, eventuelt legerte, aluminiumdeler eller slaglodding av aluminium (eventuelt legert) til et annet metall, hvor slagloddemetallet kan være belagt på aluminiumdelen(e) eller anbragt separat som slagloddemateriale mellom delene, hvor man bruker et vandig pletteringsbad inneholdende oppløste salter av pletteringsmetaller og buffersalter og hvor pletterjngen foregår elektrolytisk eller strømfritt, og denne fremgangsmåte er kjennetegnet ved at pletteringsbadets pH holdes i området fra 7-12 ved tilsetning av en base valgt blant alkalimetallhydroksyder og ammoniumhydroksyd, og at badet tilsettes 0,005-1,0 vekt-%, basert på den totale badsammensetning, av et blysalt, hvorved det dannede belegg på aluminium- eller aluminiumlegerings-overflaten avsettes i form av små findelte, svampaktige partik--3 According to the present invention, a method is provided for plating surfaces of aluminum or aluminum alloys with nickel-lead, cobalt-lead or mixtures thereof (hereinafter also called auxiliary alloys), prior to brazing of two, possibly alloyed, aluminum parts or brazing of aluminum (possibly alloyed) to another metal, where the brazing metal can be coated on the aluminum part(s) or placed separately as brazing material between the parts, where an aqueous plating bath containing dissolved salts of plating metals and buffer salts is used and where the plating takes place electrolytically or without electricity , and this method is characterized by the fact that the pH of the plating bath is kept in the range from 7-12 by the addition of a base selected from among alkali metal hydroxides and ammonium hydroxide, and that 0.005-1.0% by weight, based on the total bath composition, of a lead salt is added to the bath , thereby forming a coating on aluminum or aluminum alloy stoves the surface is deposited in the form of small finely divided, spongy particles--3
ler med størrelse ikke over 2,5.10 mm. clay with a size not exceeding 2.5.10 mm.
Ved anvendelse av ammoniumhydroksyd som base holdes pletteringsbadets pH-verdi fortrinnsvis mellom 10,0 og 11,0. Blyacetat eller blycitrat er foretrukket som blysalt. When using ammonium hydroxide as a base, the pH value of the plating bath is preferably kept between 10.0 and 11.0. Lead acetate or lead citrate is preferred as lead salt.
Nevnte svampaktige partikler er meget velegnet for sammenføyningsprosesser på grunn av deres sterke effekt når det gjelder å begunstige fuktingen av aluminiumsdelene. Said spongy particles are very suitable for joining processes due to their strong effect in favoring the wetting of the aluminum parts.
Sammensetningen av pletteringsbadet vil naturligvis avhenge av den type belegning som finner sted, dvs. om beleg-ningsmetoden er elektrolyttisk eller strømfri. The composition of the plating bath will naturally depend on the type of plating that takes place, i.e. whether the plating method is electrolytic or electroless.
Det er ifølge foreliggende oppfinnelse videre tilveiebragt et pletteringsbad for utførelse av den ovenfor angitte fremgangsmåte, for elektroplettering av aluminium- og aluminiumlegerings-overflater med metaller valgt blant nikkel-bly, kobolt-bly og kombinasjoner av disse, og pletteringsbadet er kjennetegnet ved at det inneholder følgende kombinasjon av salter: 0,005-1,0 vekt-% blysalt valgt blant blyacetat og blycitrat samt 3-30 vekt-% metallsulfat valgt blant nikkelsulfat og koboltsulfat, According to the present invention, a plating bath is also provided for carrying out the above-mentioned method, for electroplating aluminum and aluminum alloy surfaces with metals selected from among nickel-lead, cobalt-lead and combinations thereof, and the plating bath is characterized by the fact that it contains the following combination of salts: 0.005-1.0% by weight lead salt selected from lead acetate and lead citrate and 3-30% by weight metal sulfate selected from nickel sulfate and cobalt sulfate,
3-10 vekt-% metallklorid valgt blant nikkelklorid og koboltklorid, og 3-10% by weight metal chloride chosen from nickel chloride and cobalt chloride, and
6-30 vekt-% buffersalt valgt blant natriumcitrat og natriumglukonat. 6-30% by weight buffer salt selected from sodium citrate and sodium gluconate.
Når plettering brukes som et trinn i forbindelse med den tidligere kjente slagloddeprosess som består i å sammenføye en aluminiumdel med en annen, blir hjelpelegeringen valgt fra nikkel-bly, kobolt-bly eller blandinger derav, plettert på en flate av aluminium som er belagt med slagloddemetall eller på overflaten av en folie av slagloddelegering. Slagloddebelegget eller -folien er en legering av f.eks. aluminium-silisium. When plating is used as a step in connection with the prior art brazing process of joining one aluminum part to another, the auxiliary alloy selected from nickel-lead, cobalt-lead or mixtures thereof is plated onto a surface of aluminum coated with brazing metal or on the surface of a foil of brazing alloy. The solder coating or foil is an alloy of e.g. aluminium-silicon.
Denne slagloddeprosess er angitt i norsk patentsøknad nr. 760065. This brazing process is specified in Norwegian patent application no. 760065.
Ved elektrolyttisk plettering av hjelpelegeringen innstilles badet alkalisk. Badet kan innstilles alkalisk ved å tilsette en base i form av et alkalimetallhydroksyd eller ammoniumhydroksyd. Den totale sammensetning buffres ved tilsetning av en buffer, nemlig natriumcitrat eller natriumglukonat. Badets temperatur under pletteringen kan være i området 25-72°C og pH er fra 7 til 12, dvs. på den alkaliske siden. When electrolytically plating the auxiliary alloy, the bath is made alkaline. The bath can be made alkaline by adding a base in the form of an alkali metal hydroxide or ammonium hydroxide. The total composition is buffered by adding a buffer, namely sodium citrate or sodium gluconate. The temperature of the bath during the plating can be in the range 25-72°C and the pH is from 7 to 12, i.e. on the alkaline side.
Ved strømfri plettering av hjelpelegeringen brukes en pletteringsoppløsning som ligner den for elektrolyttisk avsetning bortsett fra at det ikke behøves noe kloridion i form av metallsalt. Hjelpelegeringen blir ved denne fremgangsmåten påført ved fortrengning, dvs. en red-ox-reaksjon. For nikkel er reaksjonen: 2A1° + 3Ni<++> - >■ 2A1<+++> + 3Ni°. Ved andre strøm-frie prosesser som kan brukes, pletteres nikkelet ved en reduksjonsreaksjon, f.eks. NiS04<+> NaH2P<0>2<+><H>20 ■<>> Ni° + Nal^PO^ + H2SO4. Hjelpelegeringen kan være av den samme typen som ved elektrolyttisk plettering, og illustrerende prosentvise mengder i belegningspreparatene er oppført i de følgende In electroless plating of the auxiliary alloy, a plating solution similar to that of electrolytic deposition is used except that no chloride ion in the form of a metal salt is required. In this method, the auxiliary alloy is applied by displacement, i.e. a red-ox reaction. For nickel, the reaction is: 2A1° + 3Ni<++> - >■ 2A1<+++> + 3Ni°. In other electricity-free processes that can be used, the nickel is plated by a reduction reaction, e.g. NiS04<+> NaH2P<0>2<+><H>20 ■<>> Ni° + Nal^PO^ + H2SO4. The auxiliary alloy can be of the same type as in electrolytic plating, and illustrative percentage amounts in the coating preparations are listed in the following
tabeller.for elektrolyttiske og strømfrie pletteringsbad. tables.for electrolytic and electroless plating baths.
I tabellene nedenfor viser de eksempelvise bad-sammensetninger det prosentvise innholdet av hver av de forskjel-lige bestanddeler som benyttes for optimal plettering av lege-ringene på overflaten av en aluminium-slaglodde-metallflate. In the tables below, the exemplary bath compositions show the percentage content of each of the various components used for optimal plating of the alloy rings on the surface of an aluminum braze metal surface.
Man vil merke seg at eksemplene viser pletterings-oppløsninger som er innstilt alkalisk ved tilsetning av ammoniumhydroksyd, men andre basiske oppløsninger er like godt brukbare. Tilsetning av en base gjør at avsetningen bygges opp som små svampaktige partikler av hjelpelegering, vanligvis på under 100 mikrotommer (0,0025 mm) i diameter. Jo mindre partiklene er, jo bedre vil naturligvis overflaten på aluminium-legeringen belegges. De fullstendig belagte områder tjener som kjerner for fuktevirkningen av slagloddelegeringen. It will be noted that the examples show plating solutions which have been made alkaline by the addition of ammonium hydroxide, but other basic solutions are equally useful. Addition of a base causes the deposit to build up as small spongy particles of auxiliary alloy, typically less than 100 microinches (0.0025 mm) in diameter. Naturally, the smaller the particles, the better the surface of the aluminum alloy will be coated. The fully coated areas serve as cores for the wetting action of the brazing alloy.
Man har funnet at den beste tykkelsen av hjelpelegeringen, f.eks. av nikkel-bly på aluminium-slagloddemetall-legeringen, er over 7,5.10 -5 mm målt ved elektrolytisk oppløs-ning, f.eks. ved hjelp av en tykkelsesmåler av typen "Kocour Electronic Thickness Tester", og den optimale tykkelse er ca. It has been found that the best thickness of the auxiliary alloy, e.g. of nickel-lead on the aluminium-braze metal alloy, is over 7.5.10 -5 mm measured by electrolytic solution, e.g. using a thickness gauge of the "Kocour Electronic Thickness Tester" type, and the optimum thickness is approx.
-4 -4
5.10 mm. Imidlertid er mengden nikkel-bly-legering avhengig av tykkelsen på slaglodde-legeringen og førstnevnte bør ikke overstige 7 vekt-% av den samlede slagloddelegeringens vekt. 5.10 mm. However, the amount of nickel-lead alloy depends on the thickness of the braze alloy and the former should not exceed 7% by weight of the total braze alloy weight.
Når således slagloddelegeringens tykkelse reduseres til meget tynne belegg som er normalt i varmevekslere (særlig i varmevekslere med tynne varmevekslerplater), kan tykkelsen på slagloddelegeringen gå helt ned til 0,025 mm. I visse tilfeller kan det være nødvendig, for å holde seg under grensen 7 % totalt Thus, when the thickness of the brazing alloy is reduced to very thin coatings which are normal in heat exchangers (especially in heat exchangers with thin heat exchanger plates), the thickness of the brazing alloy can go all the way down to 0.025 mm. In certain cases, it may be necessary to stay under the 7% limit in total
-4 -4
nikkel, å gå lavere enn de foretrukne 5.10 mm nikkel-bly. nickel, to go lower than the preferred 5.10 mm nickel-lead.
Hvis man bruker for stor tykkelse, vil nikkelet ha tendens til å reagere med aluminiumet under dannelse av overskudd av nikkel-aluminid som innvirker uheldig på dannelsen av loddefugen. If too large a thickness is used, the nickel will tend to react with the aluminum to form an excess of nickel-aluminide which adversely affects the formation of the solder joint.
Når man bruker plettering med hjelpelegeringsmetall som et trinn ved slaglodding av en aluminiumdel til en annen, anbringes delene i kontakt med hverandre under inert atmosfære (enten med eller uten påsatt trykk) ved en temperatur på fra ca. 565-620°C i kort tid. Kontakttiden er vanligvis et par minutter som tillater smelting og spredning av sveiselegeringen som bevirker binding med hjelpelegeringen. When using auxiliary alloy metal plating as a step in brazing one aluminum part to another, the parts are placed in contact with each other under an inert atmosphere (either with or without applied pressure) at a temperature of from approx. 565-620°C for a short time. The contact time is usually a few minutes which allows melting and spreading of the welding alloy which causes bonding with the auxiliary alloy.
Claims (4)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO760065A NO141635C (en) | 1972-11-07 | 1976-01-09 | PROCEDURE FOR SHOCKING OF AN ALUMINUM PART TO ANOTHER METAL PART |
| NO761333A NO137455C (en) | 1972-11-07 | 1976-04-20 | PLATING BATH FOR ELECTROLYSIS-FREE PLATING OF ALUMINUM AND ALUMINUM ALLOY SURFACES |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30445772A | 1972-11-07 | 1972-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NO135943B true NO135943B (en) | 1977-03-21 |
| NO135943C NO135943C (en) | 1977-06-29 |
Family
ID=23176599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO4262/73A NO135943C (en) | 1972-11-07 | 1973-11-06 |
Country Status (12)
| Country | Link |
|---|---|
| JP (1) | JPS5750879B2 (en) |
| BE (1) | BE806897A (en) |
| BR (1) | BR7308659D0 (en) |
| CA (1) | CA1020816A (en) |
| DE (2) | DE2365799C3 (en) |
| FR (1) | FR2205581B1 (en) |
| GB (1) | GB1444179A (en) |
| IT (1) | IT999233B (en) |
| NL (1) | NL7314947A (en) |
| NO (1) | NO135943C (en) |
| SE (1) | SE7705860L (en) |
| ZA (1) | ZA738183B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2001281769B2 (en) * | 2000-05-18 | 2004-04-01 | Corus Aluminium Walzprodukte Gmbh | Method of manufacturing an aluminium product |
| EP1291933A1 (en) * | 2001-09-05 | 2003-03-12 | Thomas Steel Strip Corporation | Method of manufacturing a steel sheet for a battery case |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1627461U (en) | 1951-07-16 | 1951-08-23 | Glas Veredelungs Ind K G | WALL MIRROR. |
-
1973
- 1973-10-23 ZA ZA00738183A patent/ZA738183B/en unknown
- 1973-10-31 DE DE2365799A patent/DE2365799C3/en not_active Expired
- 1973-10-31 DE DE2354588A patent/DE2354588C3/en not_active Expired
- 1973-10-31 NL NL7314947A patent/NL7314947A/xx not_active Application Discontinuation
- 1973-11-02 GB GB5104373A patent/GB1444179A/en not_active Expired
- 1973-11-05 BE BE137388A patent/BE806897A/en not_active IP Right Cessation
- 1973-11-05 JP JP48123502A patent/JPS5750879B2/ja not_active Expired
- 1973-11-06 BR BR8659/73A patent/BR7308659D0/en unknown
- 1973-11-06 IT IT30967/73A patent/IT999233B/en active
- 1973-11-06 CA CA185,165A patent/CA1020816A/en not_active Expired
- 1973-11-06 NO NO4262/73A patent/NO135943C/no unknown
- 1973-11-07 FR FR7339600A patent/FR2205581B1/fr not_active Expired
-
1977
- 1977-05-17 SE SE7705860A patent/SE7705860L/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| BE806897A (en) | 1974-05-06 |
| DE2354588C3 (en) | 1980-03-06 |
| JPS5750879B2 (en) | 1982-10-29 |
| BR7308659D0 (en) | 1974-08-15 |
| SE7705860L (en) | 1977-05-18 |
| DE2354588A1 (en) | 1974-05-16 |
| GB1444179A (en) | 1976-07-28 |
| NL7314947A (en) | 1974-05-09 |
| CA1020816A (en) | 1977-11-15 |
| IT999233B (en) | 1976-02-20 |
| FR2205581B1 (en) | 1976-11-19 |
| NO135943C (en) | 1977-06-29 |
| AU6193973A (en) | 1975-05-01 |
| JPS49134550A (en) | 1974-12-25 |
| DE2365799B2 (en) | 1980-10-02 |
| FR2205581A1 (en) | 1974-05-31 |
| DE2365799C3 (en) | 1981-08-20 |
| DE2354588B2 (en) | 1979-06-28 |
| DE2365799A1 (en) | 1976-05-06 |
| ZA738183B (en) | 1975-04-30 |
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