JPH0156158B2 - - Google Patents
Info
- Publication number
- JPH0156158B2 JPH0156158B2 JP59138670A JP13867084A JPH0156158B2 JP H0156158 B2 JPH0156158 B2 JP H0156158B2 JP 59138670 A JP59138670 A JP 59138670A JP 13867084 A JP13867084 A JP 13867084A JP H0156158 B2 JPH0156158 B2 JP H0156158B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- alloy plating
- alloy
- solder
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 59
- 239000000956 alloy Substances 0.000 claims description 45
- 229910045601 alloy Inorganic materials 0.000 claims description 45
- 229910000831 Steel Inorganic materials 0.000 claims description 29
- 239000010959 steel Substances 0.000 claims description 29
- 229910020220 Pb—Sn Inorganic materials 0.000 claims description 21
- 229910007570 Zn-Al Inorganic materials 0.000 claims description 13
- 229910007567 Zn-Ni Inorganic materials 0.000 claims description 11
- 229910007614 Zn—Ni Inorganic materials 0.000 claims description 11
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims 11
- 239000011247 coating layer Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 28
- 239000010408 film Substances 0.000 description 22
- 239000011701 zinc Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 229910007610 Zn—Sn Inorganic materials 0.000 description 2
- 239000010960 cold rolled steel Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 102220474387 PDZ and LIM domain protein 7_H63A_mutation Human genes 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
〔産業上の利用分野〕
この発明はハンダ付け性の向上を図つたZn系
合金メツキ鋼板に関する。
〔従来技術〕
Zn系合金メツキ鋼板は耐食性にすぐれている
ため家電製品のシヤーシ、石油ストーブタンク
材、自動車ガソリンタンク材等に広く利用されて
いるが、その成形方法にハンダ付け工程を含む場
合が多い。このZn系合金メツキ鋼板は一般に、
ハンダ濡れ性が通常の令延鋼板に比べて悪く、ハ
ンダ付け性に劣り、このためハンダの接合不良が
需要先で起こることがあつて問題となつている。
そもそもハンダ濡れ性は、溶融ハンダと被接合
金属の接合面との間の表面張力に支持される。そ
して金属表面は大気下では通常極めて薄い酸化物
被膜（以下酸化皮膜という）で被覆されており、
ハンダと接する被接合金属の表面にこのような酸
化皮膜が存在すると上記表面張力が低下し、ハン
ダと被接合金属との粘着力が阻害されてハンダ濡
れ性は低下する。しかもこの酸化皮膜はハンダ付
けの際の高温処理により高温に曝されると、酸化
が一段と進んでさらに強固な酸化皮膜を形成して
くるので、ハンダ付けの際のハンダ濡れ性はより
一層低下することになる。
上記酸化皮膜形成によるハンダ濡れ性低下の対
策としては一般に、ハンダ付けの際に適当なフラ
ツクスを接合面に塗布する等して、そのフラツク
スに酸化皮膜の生成、増大の抑制またはその分離
除去等を行わせ、被接合金属の接合面のハンダ濡
れ性の向上を図るという処理がとられている。
しかし上記Zn系合金メツキ鋼板の場合には、
通常の冷延鋼板に較べて大気下での酸化皮膜が発
生し易い許りでなく、ハンダ付けの際高温に曝さ
れると表面酸化がなお一層進み易いという性質か
ら一段と強固な酸化皮膜が形成されてきて、通常
のフラツクス処理では酸化皮膜の生成抑制または
分離除去等のハンダ濡れ性向上の効果が十分に現
われず、上記の如くハンダの接合不良という事態
にまで発展する事例が発生し、問題となつている
のである。
〔発明の目的〕
本発明は、Zn系合金メツキ鋼板本来の耐食性
を有し、しかも経済的にも有利なハンダ付け性に
すぐれた表面処理鋼板を提供しようとするもので
ある。
〔発明の構成〕
本発明者らは、Zn系合金メツキ鋼板の大気中
での酸化皮膜の生成ならびにハンダ付けに当つて
の高温暴露による酸化皮膜の成長を抑制する安価
で効果的な手段について、鋭意実験研究を重ねた
結果、Zn系合金メツキ鋼板の表面にPb−Sn合金
メツキ層を設けることによつて上記の目的を達成
し得てハンダ付け性にすぐれた表面処理鋼板を安
価にえることができるという知見を得た。
すなわち本発明は、Zn−Ni系、Zn−Fe系及び
Zn−Al系合金メツキ鋼板において、その少なく
とも片面に付着量0.1〜100ｇ／m2のSnを３〜20重
量％含有するPb−Sn合金メツキ層を設けたこと
を特徴とするハンダ付け性にすぐれた表面処理鋼
板を要旨とする。Zn−Ni、Zn−Fe及びZn−Al
系合金メツキ鋼板の表面にPb−Sn合金メツキ層
を設けることによりハンダ付け性が向上するのは
次の理由による。
すなわち、Pb−Snメツキは、融点が低く、
成分組成がハンダに近くて濡れ性が良好で表面
に厚い酸化皮膜ができにくい等の性質を有してい
るところから、特に高温に曝された場合の酸化皮
膜の増大がPb−Sn合金メツキ層により完全に抑
制されて、フラツクスによるハンダ濡れ性向上効
果が冷延鋼板なみに享受し得るものと考察され
る。
また、このPb−SnメツキはNi−Ｂ系のメツキ
等と比較して使用薬剤が安い上、メツキ速度が早
く生産性が高いため、経済的にも有利なわけであ
る。
Zn−Ni合金系メツキとはZn−Ni（Ni5〜20wt
％）系合金メツキ、Zn−Fe合金メツキとはZn−
Fe（Fe5〜35wt％）系合金メツキ、Zn−Al合金メ
ツキとはZn−Al（Al3〜7wt％にミツシユメタル
（La、Ce等）0.01〜0.03％もしくはMg0.1〜0.5％
添加）系合金メツキをいう。
また、本発明においてZn系合金メツキ中から
Zn−Ni系、Zn−Fe系及びZn−Al系を選択した
理由は次の通りである。
すなわち、
Pb−Sn合金上層メツキ結晶と、下層である合
金メツキ結晶との密着性が強固であるためであ
る。Zn−Sn系、Zn−Cr系、Zn−Ma系等の他の
Zn系合金メツキ皮膜とのメツキ密着力は劣つて
いる。また、上層Pb−Snメツキ皮膜を完全な連
続皮膜とすることは難しく、メツキした時点でミ
クロ・ポアやミクロ・クラツクが多数存在してい
ることが多い。需要家での成形加工によつてもメ
ツキ皮膜に微細なクラツクが導入される。このよ
うなミクロ的な上層メツキ皮膜欠陥存在下では、
欠陥部を通しての下層メツキ皮膜の大気酸化性が
問題となる。Zn−Ni、Zn−Fe、Zn−Al系合金
メツキ皮膜は、Znメツキや他のZn−Sn、Zn−
Mn、Zn−Cr系等のZn系合金メツキに比較して、
相対的に大気酸化性が弱く、Pb−Sn薄膜形成に
よりハンダ性の改善効果が著しい。
すなわち、大気酸化能の弱いZn−Ni、Zn−
Fe、Zn−Al系メツキの場合には、特公昭56−
79743に示されているような処理や、特開昭57−
101694に示されているような加熱リフロー処理に
よる上層皮膜欠陥封孔対策等を施さなくても、上
層メツキのままで良好なハンダ性を有している。
また、Pb−Sn合金メツキとはSn3〜20wt％を
含有したSn−Pb合金のメツキをいう。
Snを３〜20wt％に限定したのは、３％未満で
は、ハンダ濡れ性が劣つており、一方20wt％を
超えると、口金、配管、取手等を本発明の鋼板に
ロウ付けする際に、鋼板の粒界浸食割れをひき起
こすので問題である。
Zn系合金メツキ層のメツキ付着量は用途に応
じて種々異なつてくるが、５〜100ｇ／m2の範囲
が好ましい。
Pb−Sn合金メツキ層のメツキ付着量は0.1〜
100ｇ／m2の範囲とするが、これは0.1ｇ／m2未満
ではメツキ量が少な過ぎてハンダ濡れ性の向上効
果が不十分であり、また100ｇ／m2を超えて厚く
してもハンダ濡れ性の向上効果が飽和していたず
らに経済的にコスト高となるだけであるからであ
る。
また、本発明の表面処理鋼板のZn系合金メツ
キ層もしくはPb−Sn合金メツキ層に、少量の
Co、Cr、Mn、Mo、Ni、Fe、Sn、Cd、Pb、
Cu、Ti、In、Tl、Hg、Bi、Ｐ、Ｓ、Ｂ、Si等の
一種または二種以上か含有されている場合も、本
発明の効果が低下するものではないので本発明の
範囲に含まれるものとする。
また、本発明によりPb−Sn合金メツキ層を設
けた面の反対側の片面は、前記と同様のメツキ面
でもよいし、また鋼板裸面でも、異なる種類の別
の構成のメツキ面でもよく、さらにはジンクリツ
チプライマー等の有機被覆を施した形態のもので
もよく、特に限定するものではない。
これらの各メツキ層は、公知の電気メツキ法、
溶融メツキ法、蒸着法、溶射法、イオンクラスタ
ービーム法等のうちから適宜選択された最適な方
法にて得ることができる。
〔発明の効果〕
次に本発明の実施効果について説明する。
鋼板表面に下記の条件による電気メツキもしく
は溶融メツキにて付着量を種々に変えて、Zn−
Ni合金、Zn−Fe合金またはZn−Al合金メツキを
施したメツキ鋼板に下記の条件による電気メツキ
にて付着量を種々に変えてPb−Sn合金メツキを
施し、本発明例と比較例の各種の表面処理鋼板を
得た。
Zn−Ni合金メツキ条件
硫酸塩と塩化物の混合浴：Ni2+90ｇ／、
Zn2+30〜360ｇ／
電解条件：80A／ｄm2
浴温：70℃
PH：1.0
Zn−Fe合金メツキ条件
硫酸塩浴：Fe2+60ｇ／、Zn2+40〜80ｇ／
電解条件：120A／ｄm2
浴温：70℃
PH：1.5
Zn−Al合金メツキ条件
鋼板試片を電解脱脂後、H2雰囲気ガス中で720
℃×30秒の還元処理を行いそのまま直ちに溶融
Zn−Al金属浴中に浸漬
Pb−Snメツキ条件
電解液成分：Pb（BF4）2＋Sn（BF4）2250ｇ／
HBF440ｇ／、HBO325ｇ／
電解条件：50A／ｄm2
浴温：40℃
PH：＜1.0
得られた表面処理鋼板について下記の試験によ
りハンダ濡れ性の調査を行つた。
ハンダ濡れ性実験
ハンダの種類：H63A（日本工業規格）
フラツクスの種類：ロジン・アルコール系
ハンダ漏れ性評価：ハンダを230℃に30秒保持
後、該ハンダ300mgを試験片表面にハンダ付けし
てその広がり面積を求め、次の評点で評価を行つ
た。
[Industrial Application Field] The present invention relates to a Zn-based alloy plated steel plate with improved solderability. [Prior art] Zn-based alloy plated steel sheets have excellent corrosion resistance and are widely used for chassis of home appliances, kerosene stove tank materials, automobile gasoline tank materials, etc. However, the forming method may include a soldering process. many. This Zn-based alloy plated steel sheet is generally
Its solder wettability is poorer than that of ordinary rolled steel sheets, and its solderability is poor, resulting in poor solder joints at customers, which has become a problem. In the first place, solder wettability is supported by the surface tension between the molten solder and the joining surfaces of the metals to be joined. Under atmospheric conditions, metal surfaces are usually covered with an extremely thin oxide film (hereinafter referred to as oxide film).
If such an oxide film exists on the surface of the metal to be joined that is in contact with the solder, the above-mentioned surface tension will be reduced, the adhesive force between the solder and the metal to be joined will be inhibited, and the solder wettability will be reduced. Moreover, when this oxide film is exposed to high temperatures during high-temperature treatment during soldering, oxidation progresses further and an even stronger oxide film is formed, resulting in a further decline in solder wettability during soldering. It turns out. As a countermeasure for reducing solder wettability due to the formation of the above-mentioned oxide film, generally, during soldering, an appropriate flux is applied to the joint surface, and the generation and growth of the oxide film is suppressed or separated and removed. The solder wettability of the bonding surfaces of the metals to be bonded is improved. However, in the case of the Zn-based alloy plated steel sheet mentioned above,
Compared to ordinary cold-rolled steel sheets, it is not easy to form an oxide film in the atmosphere, and when exposed to high temperatures during soldering, surface oxidation progresses even more easily, so a stronger oxide film is formed. However, with normal flux treatment, the effects of improving solder wettability such as suppressing the formation of oxide film or separating and removing it do not appear sufficiently, and there have been cases where the situation has progressed to poor solder joints as described above, and this has caused problems. It has become. [Object of the Invention] The present invention aims to provide a surface-treated steel sheet that has the inherent corrosion resistance of a Zn-based alloy plated steel sheet, is economically advantageous, and has excellent solderability. [Structure of the Invention] The present inventors have proposed an inexpensive and effective means for suppressing the formation of oxide films on Zn-based alloy plated steel sheets in the atmosphere and the growth of oxide films due to high temperature exposure during soldering. As a result of extensive experimental research, we have found that by providing a Pb-Sn alloy plating layer on the surface of a Zn-based alloy plated steel plate, the above objectives can be achieved and a surface-treated steel plate with excellent solderability can be obtained at a low cost. We obtained the knowledge that it is possible. That is, the present invention applies to Zn-Ni series, Zn-Fe series and
A Zn-Al alloy plated steel sheet with excellent solderability characterized by having a Pb-Sn alloy plating layer containing 3 to 20% by weight of Sn with an adhesion amount of 0.1 to 100 g/m 2 on at least one side. This paper focuses on surface-treated steel sheets. Zn-Ni, Zn-Fe and Zn-Al
The reason why solderability is improved by providing a Pb-Sn alloy plating layer on the surface of a Pb-Sn alloy plating steel plate is as follows. In other words, Pb-Sn plating has a low melting point,
The Pb-Sn alloy plating layer is similar in composition to solder, has good wettability, and does not easily form a thick oxide film on the surface, so the oxide film increases when exposed to high temperatures. It is considered that the effect of improving solder wettability due to flux can be completely suppressed and the effect of improving solder wettability due to flux can be enjoyed on a par with that of cold-rolled steel sheets. In addition, this Pb-Sn plating uses cheaper chemicals than Ni-B-based plating, has a fast plating speed, and has high productivity, so it is economically advantageous. Zn-Ni alloy plating is Zn-Ni (Ni5~20wt)
%) system alloy plating and Zn-Fe alloy plating are Zn-
What is Fe (Fe5~35wt%) alloy plating and Zn-Al alloy plating?
additive) alloy plating. In addition, in the present invention, from Zn-based alloy plating
The reason for selecting Zn-Ni system, Zn-Fe system, and Zn-Al system is as follows. That is, this is because the adhesion between the Pb-Sn alloy upper layer plating crystal and the lower alloy plating crystal is strong. Other types such as Zn-Sn system, Zn-Cr system, Zn-Ma system, etc.
The plating adhesion to the Zn-based alloy plating film is poor. Furthermore, it is difficult to form the upper Pb-Sn plating film into a completely continuous film, and many micro pores and micro cracks are often present at the time of plating. Fine cracks are also introduced into the plating film during the molding process at the customer. In the presence of such microscopic defects in the upper plating film,
Atmospheric oxidation of the lower plating film through the defect is a problem. Zn-Ni, Zn-Fe, Zn-Al alloy plating film is Zn plating and other Zn-Sn, Zn-
Compared to Zn-based alloy plating such as Mn and Zn-Cr,
It has relatively low atmospheric oxidation, and the formation of a Pb-Sn thin film significantly improves solderability. In other words, Zn−Ni and Zn− have weak atmospheric oxidation ability.
In the case of Fe, Zn-Al plating,
79743, or JP-A-57-
101694, it has good solderability with the upper layer plated as it is, even without taking measures to seal defects in the upper layer film by heating reflow treatment. Moreover, Pb-Sn alloy plating refers to plating of Sn-Pb alloy containing 3 to 20 wt% of Sn. The reason for limiting Sn to 3 to 20 wt% is that if it is less than 3%, the solder wettability will be poor, whereas if it exceeds 20 wt%, it will be difficult to braze the cap, piping, handle, etc. to the steel plate of the present invention. This is a problem because it causes intergranular erosion cracking of the steel sheet. The plating amount of the Zn-based alloy plating layer varies depending on the application, but is preferably in the range of 5 to 100 g/m 2 . The plating amount of the Pb-Sn alloy plating layer is 0.1~
The plating should be in the range of 100g/ m2 , but if it is less than 0.1g/ m2 , the amount of plating will be too small and the effect of improving solder wettability will be insufficient, and if it is thicker than 100g/ m2 , the solder will not work. This is because the effect of improving wettability is saturated and the cost becomes unnecessarily high. In addition, a small amount of
Co, Cr, Mn, Mo, Ni, Fe, Sn, Cd, Pb,
Even if one or more of Cu, Ti, In, Tl, Hg, Bi, P, S, B, Si, etc. are contained, the effects of the present invention are not reduced and are therefore within the scope of the present invention. shall be included. Further, the surface opposite to the surface on which the Pb-Sn alloy plating layer is provided according to the present invention may be the same plating surface as described above, or may be a bare surface of the steel plate, or a plating surface of a different type and another configuration. Furthermore, it may be coated with an organic coating such as a zinc-rich primer, and is not particularly limited. Each of these plating layers is formed by a known electroplating method,
It can be obtained by an optimal method appropriately selected from among melt plating methods, vapor deposition methods, thermal spraying methods, ion cluster beam methods, and the like. [Effects of the Invention] Next, the effects of implementing the present invention will be explained. Zn-
Pb-Sn alloy plating was applied to plated steel sheets plated with Ni alloy, Zn-Fe alloy, or Zn-Al alloy by electroplating under the following conditions with various coating amounts. A surface-treated steel sheet was obtained. Zn-Ni alloy plating conditions Sulfate and chloride mixed bath: Ni 2+ 90g/,
Zn 2+ 30-360g/ Electrolysis conditions: 80A/dm 2 Bath temperature: 70℃ PH: 1.0 Zn-Fe alloy plating conditions Sulfate bath: Fe 2+ 60g/, Zn 2+ 40-80g/ Electrolysis conditions: 120A/ dm 2 Bath temperature: 70℃ PH: 1.5 Zn-Al alloy plating conditions After electrolytically degreasing the steel plate specimen, 720℃ in H2 atmosphere gas
Melt immediately after reduction treatment at ℃ x 30 seconds.
Pb-Sn plating conditions immersed in Zn-Al metal bath Electrolyte component: Pb (BF 4 ) 2 + Sn (BF 4 ) 2 250g/
HBF 4 40g/, HBO 3 25g/ Electrolytic conditions: 50A/dm 2 Bath temperature: 40°C PH: <1.0 The obtained surface-treated steel sheet was examined for solder wettability by the following test. Solder wettability experiment Type of solder: H63A (Japanese Industrial Standards) Type of flux: Rosin/alcohol based Solder leakage evaluation: After holding the solder at 230°C for 30 seconds, 300 mg of the solder was soldered to the surface of the test piece. The spread area was determined and evaluated using the following rating.
【表】 上記結果をまとめて第１表に示した。【table】 The above results are summarized in Table 1.
【表】【table】
【表】
第１表に見る通り、評価の基準としたPb−Sn
合金メツキ層なしの比較例(1)〜(9)がハンダ濡れ性
評点が１で劣悪であるのに対し、本発明(10)〜
（17）はハンダ濡れ性評点がいずれも３を示し、
極めて良好なハンダ濡れ性を有するものと判定さ
れた。
また、Zn−Ni、Zn−Fe、Zn−Al系合金メツ
キ以外の比較例(4)〜(6)は、大気酸化性がより強い
ため、Pb−Sn上層被覆しても、ハンダ濡れ性の
点で劣るものであることがわかる。比較例(7)〜(9)
も、Zn−Ni、Zn−Fe、Zn−Al系合金メツキで
あつてもSnの量が３％未満であるPb−Sn合金メ
ツキであるため、やはり濡れ性に劣つている。
以上の説明から明らかな如く、本発明は、高温
に曝されると表面酸化を起こし易く接合不良を起
こすというZn系合金メツキ鋼板のハンダ付けに
おける弱点を有効かつ安価に解消するものであ
り、従つてZn系合金メツキ鋼板のハンダ付け作
業の能率向上ならびにコストの低減に大きく寄与
するものと言うことができる。[Table] As shown in Table 1, Pb-Sn used as the evaluation standard
Comparative examples (1) to (9) without alloy plating layer had a poor solder wettability rating of 1, whereas the present invention (10) to
(17) all showed a solder wettability rating of 3,
It was determined that it had extremely good solder wettability. In addition, comparative examples (4) to (6) other than Zn-Ni, Zn-Fe, and Zn-Al alloy plating have stronger atmospheric oxidation, so even if Pb-Sn is coated with an upper layer, solder wettability is poor. It can be seen that it is inferior in some respects. Comparative examples (7) to (9)
Even if it is a Zn-Ni, Zn-Fe, or Zn-Al alloy plating, it is still a Pb-Sn alloy plating with an Sn content of less than 3%, so it still has poor wettability. As is clear from the above description, the present invention effectively and inexpensively eliminates the weak point in soldering Zn-based alloy plated steel sheets, in which surface oxidation tends to occur when exposed to high temperatures, resulting in poor bonding. Therefore, it can be said that this greatly contributes to improving the efficiency and reducing costs of soldering work for Zn-based alloy plated steel sheets.
Claims (1)
ツキ層を有し、その上に付着量0.1〜100ｇ／m2で
Snを３〜20重量％含有するPb−Sn合金メツキ層
を有することを特徴とするハンダ付性にすぐれた
表面処理鋼板。 ２ 鋼板の表面に下層として、Zn−Fe系合金メ
ツキ層を有し、その上に付着量0.1〜100ｇ／m2で
Snを３〜20重量％含有するPb−Sn合金メツキ層
を有することを特徴とするハンダ付性にすぐれた
表面処理鋼板。 ３ 鋼板の表面に下層として、Zn−Al系合金メ
ツキ層を有し、その上に付着量0.1〜100ｇ／m2で
Snを３〜20重量％含有するPb−Sn合金メツキ層
を有することを特徴とするハンダ付性にすぐれた
表面処理鋼板。[Claims] 1. A Zn-Ni alloy plating layer is provided as a lower layer on the surface of the steel plate, and a coating layer with a coating amount of 0.1 to 100 g/m 2 is provided on the surface of the steel plate.
A surface-treated steel sheet with excellent solderability, characterized by having a Pb-Sn alloy plating layer containing 3 to 20% by weight of Sn. 2. A Zn-Fe alloy plating layer is provided as a lower layer on the surface of the steel plate, and a coating amount of 0.1 to 100 g/m 2 is applied on top of the Zn-Fe alloy plating layer.
A surface-treated steel sheet with excellent solderability, characterized by having a Pb-Sn alloy plating layer containing 3 to 20% by weight of Sn. 3. A Zn-Al alloy plating layer is provided as a lower layer on the surface of the steel plate, and a coating amount of 0.1 to 100 g/m 2 is applied on top of the Zn-Al alloy plating layer.
A surface-treated steel sheet with excellent solderability, characterized by having a Pb-Sn alloy plating layer containing 3 to 20% by weight of Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13867084A JPS6119793A (en) | 1984-07-03 | 1984-07-03 | Surface treated steel plate excellent in solderability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13867084A JPS6119793A (en) | 1984-07-03 | 1984-07-03 | Surface treated steel plate excellent in solderability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6119793A JPS6119793A (en) | 1986-01-28 |
| JPH0156158B2 true JPH0156158B2 (en) | 1989-11-29 |
Family
ID=15227372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13867084A Granted JPS6119793A (en) | 1984-07-03 | 1984-07-03 | Surface treated steel plate excellent in solderability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119793A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH078793Y2 (en) * | 1986-12-12 | 1995-03-06 | 三和シヤツタ−工業株式会社 | Smoke-proof shutter automatic closing device |
| US5639515A (en) * | 1987-11-10 | 1997-06-17 | Toyo Kohan Co., Ltd. | Method for post-treatment of plated steel sheet for soldering |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629747A (en) * | 1979-08-16 | 1981-03-25 | Nec Corp | 2-level system microprogram control data processor |
| JPS57101694A (en) * | 1980-12-18 | 1982-06-24 | Toyo Kohan Co Ltd | Preparation of very thin-tin plated steel plate |
-
1984
- 1984-07-03 JP JP13867084A patent/JPS6119793A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629747A (en) * | 1979-08-16 | 1981-03-25 | Nec Corp | 2-level system microprogram control data processor |
| JPS57101694A (en) * | 1980-12-18 | 1982-06-24 | Toyo Kohan Co Ltd | Preparation of very thin-tin plated steel plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6119793A (en) | 1986-01-28 |
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