NL7707845A - Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties - Google Patents
Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical propertiesInfo
- Publication number
- NL7707845A NL7707845A NL7707845A NL7707845A NL7707845A NL 7707845 A NL7707845 A NL 7707845A NL 7707845 A NL7707845 A NL 7707845A NL 7707845 A NL7707845 A NL 7707845A NL 7707845 A NL7707845 A NL 7707845A
- Authority
- NL
- Netherlands
- Prior art keywords
- filler
- compsns
- wax
- coupling agent
- silane coupling
- Prior art date
Links
- 239000000945 filler Substances 0.000 title abstract 3
- 239000006087 Silane Coupling Agent Substances 0.000 title abstract 2
- 239000000314 lubricant Substances 0.000 title abstract 2
- 239000003822 epoxy resin Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 239000001993 wax Substances 0.000 abstract 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 2
- -1 alkyl styrene Chemical compound 0.000 abstract 2
- 150000002118 epoxides Chemical class 0.000 abstract 2
- 239000000178 monomer Substances 0.000 abstract 2
- 229920001730 Moisture cure polyurethane Polymers 0.000 abstract 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 abstract 1
- 229920002732 Polyanhydride Polymers 0.000 abstract 1
- 239000004698 Polyethylene Substances 0.000 abstract 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 abstract 1
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract 1
- 235000010216 calcium carbonate Nutrition 0.000 abstract 1
- 235000013869 carnauba wax Nutrition 0.000 abstract 1
- 239000004203 carnauba wax Substances 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000004927 clay Substances 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 235000013872 montan acid ester Nutrition 0.000 abstract 1
- 229920000573 polyethylene Polymers 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 239000004810 polytetrafluoroethylene Substances 0.000 abstract 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Compsn. comprises (a) an epoxide cpd. with >=2 1,2-epoxide gps., (b) hardener selected from (i) polyanhydride of m.wt. 1000 comprising the reaction prod. of a maleic monomer and >=1 alkyl styrene monomers and (ii) pre-polymers of (i) and the epoxide, (c) curing catalyst, (d) 55-75 wt. % of a silica filler, (e) 10-20 wt.% calcined clay Sb2O3, Sb tetraoxide, Ca silicate, TiO2, CaCO3, ZnO, MgO or mixts. as additional filler, (f) 0.01-2 wt.% of carnauba wax, montanic acid ester wax, polyethylene wax and/or PTFE wax lubricant, and (g) 0.05-2 wt.% of silane coupling agent. The presence of (e), (f) and (g) improves the high temp. wet electrical props of the compsn., when heat cured, as indicated by a decreased % change of the dielectric loss index measured after exposure to 15 psig steam for 16 hr from the dielectric loss index measured under dry conditions at 25%. Compsns. are used to encapsulate semiconductors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7707845A NL7707845A (en) | 1977-07-14 | 1977-07-14 | Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7707845A NL7707845A (en) | 1977-07-14 | 1977-07-14 | Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7707845A true NL7707845A (en) | 1979-01-16 |
Family
ID=19828875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7707845A NL7707845A (en) | 1977-07-14 | 1977-07-14 | Anhydride-hardened epoxy resin-based encapsulating compsns. - contg. filler, wax lubricant and silane coupling agent to improve high temp. wet electrical properties |
Country Status (1)
| Country | Link |
|---|---|
| NL (1) | NL7707845A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8006198A (en) * | 1980-01-14 | 1981-08-17 | Plaskon Prod | FLASH-RESISTANT EPOXY ENCAPSULATION MATERIAL AND METHOD FOR PREPARING THEREOF. |
-
1977
- 1977-07-14 NL NL7707845A patent/NL7707845A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8006198A (en) * | 1980-01-14 | 1981-08-17 | Plaskon Prod | FLASH-RESISTANT EPOXY ENCAPSULATION MATERIAL AND METHOD FOR PREPARING THEREOF. |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CNR | Transfer of rights (patent application after its laying open for public inspection) |
Free format text: PLASKON PRODUCTS INC. |
|
| BA | A request for search or an international-type search has been filed | ||
| A85 | Still pending on 85-01-01 | ||
| BB | A search report has been drawn up | ||
| BC | A request for examination has been filed | ||
| BV | The patent application has lapsed |