NL7217019A - - Google Patents
Info
- Publication number
- NL7217019A NL7217019A NL7217019A NL7217019A NL7217019A NL 7217019 A NL7217019 A NL 7217019A NL 7217019 A NL7217019 A NL 7217019A NL 7217019 A NL7217019 A NL 7217019A NL 7217019 A NL7217019 A NL 7217019A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2204490A DE2204490A1 (de) | 1972-01-31 | 1972-01-31 | Halbleiterbauelement mit druckkontakt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7217019A true NL7217019A (ref) | 1973-08-02 |
Family
ID=5834583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7217019A NL7217019A (ref) | 1972-01-31 | 1972-12-14 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS4885079A (ref) |
| CH (1) | CH541869A (ref) |
| DE (1) | DE2204490A1 (ref) |
| FR (1) | FR2169819B1 (ref) |
| GB (1) | GB1397430A (ref) |
| IT (1) | IT972620B (ref) |
| NL (1) | NL7217019A (ref) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2727319A1 (de) * | 1977-06-16 | 1979-01-04 | Nippon Electric Co | Halbleiteranordnung mit einer hoeckerfoermigen anschlusselektrode |
| JPS55121654A (en) * | 1979-03-13 | 1980-09-18 | Toshiba Corp | Compression bonded semiconductor device |
| JPS5871633A (ja) * | 1981-10-23 | 1983-04-28 | Toshiba Corp | 圧接型半導体装置 |
| DE10330053A1 (de) * | 2003-07-03 | 2005-02-10 | Infineon Technologies Ag | Halbleiterbauelement mit einem Druckkontakt und Ronde für einen Druckkontakt eines Halbleiterbauelements |
| DE102004059389B4 (de) * | 2004-12-09 | 2012-02-23 | Infineon Technologies Ag | Halbleiterbauelement mit Ausgleichsmetallisierung |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS413220Y1 (ref) * | 1965-01-02 | 1966-02-23 |
-
1972
- 1972-01-31 DE DE2204490A patent/DE2204490A1/de active Pending
- 1972-10-03 CH CH1440772A patent/CH541869A/de not_active IP Right Cessation
- 1972-10-16 GB GB4756872A patent/GB1397430A/en not_active Expired
- 1972-12-14 NL NL7217019A patent/NL7217019A/xx unknown
- 1972-12-18 FR FR7245017A patent/FR2169819B1/fr not_active Expired
- 1972-12-20 IT IT33234/72A patent/IT972620B/it active
-
1973
- 1973-01-31 JP JP48012828A patent/JPS4885079A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT972620B (it) | 1974-05-31 |
| CH541869A (de) | 1973-09-15 |
| JPS4885079A (ref) | 1973-11-12 |
| GB1397430A (en) | 1975-06-11 |
| FR2169819A1 (ref) | 1973-09-14 |
| DE2204490A1 (de) | 1973-08-09 |
| FR2169819B1 (ref) | 1977-12-30 |