NL7206120A - - Google Patents

Info

Publication number
NL7206120A
NL7206120A NL7206120A NL7206120A NL7206120A NL 7206120 A NL7206120 A NL 7206120A NL 7206120 A NL7206120 A NL 7206120A NL 7206120 A NL7206120 A NL 7206120A NL 7206120 A NL7206120 A NL 7206120A
Authority
NL
Netherlands
Application number
NL7206120A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7206120A publication Critical patent/NL7206120A/xx

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Classifications

    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S148/00—Metal treatment
    • Y10S148/02—Contacts, special

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)
  • Electrodes Of Semiconductors (AREA)
NL7206120A 1971-05-06 1972-05-05 NL7206120A (forum.php)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19712122487 DE2122487A1 (de) 1971-05-06 1971-05-06 Halbleiterbauelement mit Aluminiumkontakt
US24912672A 1972-05-01 1972-05-01
US40170573 US3877061A (en) 1971-05-06 1973-09-28 Semiconductor component with mixed aluminum silver electrode

Publications (1)

Publication Number Publication Date
NL7206120A true NL7206120A (forum.php) 1972-11-08

Family

ID=27183408

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7206120A NL7206120A (forum.php) 1971-05-06 1972-05-05

Country Status (6)

Country Link
US (1) US3877061A (forum.php)
CH (1) CH537095A (forum.php)
DE (1) DE2122487A1 (forum.php)
FR (1) FR2139862B1 (forum.php)
GB (1) GB1378218A (forum.php)
NL (1) NL7206120A (forum.php)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3136730A1 (de) * 1981-09-16 1983-03-31 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterdiode
US4953003A (en) * 1987-05-21 1990-08-28 Siemens Aktiengesellschaft Power semiconductor device
EP2528092A1 (en) * 2011-05-27 2012-11-28 ABB Research Ltd. Semiconductor device
EP2673803B1 (en) 2011-02-08 2021-04-14 ABB Power Grids Switzerland AG Power semiconductor module and method to produce a power semiconductor module
EP3306663A1 (en) * 2016-10-05 2018-04-11 ABB Schweiz AG Sic-on-si-based semiconductor module with short circuit failure mode

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492546A (en) * 1964-07-27 1970-01-27 Raytheon Co Contact for semiconductor device
US3716765A (en) * 1966-03-14 1973-02-13 Hughes Aircraft Co Semiconductor device with protective glass sealing
DE1614928A1 (de) * 1966-07-19 1970-12-23 Solitron Devices Verfahren zur Kontaktierung von Halbleiter-Bauelementen
US3513361A (en) * 1968-05-09 1970-05-19 Westinghouse Electric Corp Flat package electrical device
US3639811A (en) * 1970-11-19 1972-02-01 Fairchild Camera Instr Co Semiconductor with bonded electrical contact

Also Published As

Publication number Publication date
FR2139862B1 (forum.php) 1980-03-14
US3877061A (en) 1975-04-08
FR2139862A1 (forum.php) 1973-01-12
DE2122487A1 (de) 1972-11-16
CH537095A (de) 1973-06-29
GB1378218A (en) 1974-12-27

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