NL7116101A - - Google Patents

Info

Publication number
NL7116101A
NL7116101A NL7116101A NL7116101A NL7116101A NL 7116101 A NL7116101 A NL 7116101A NL 7116101 A NL7116101 A NL 7116101A NL 7116101 A NL7116101 A NL 7116101A NL 7116101 A NL7116101 A NL 7116101A
Authority
NL
Netherlands
Application number
NL7116101A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7116101A publication Critical patent/NL7116101A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
NL7116101A 1970-12-02 1971-11-23 NL7116101A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702059425 DE2059425A1 (en) 1970-12-02 1970-12-02 Partial structure of printed multilayer circuits

Publications (1)

Publication Number Publication Date
NL7116101A true NL7116101A (en) 1972-06-06

Family

ID=5789821

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7116101A NL7116101A (en) 1970-12-02 1971-11-23

Country Status (6)

Country Link
BE (1) BE776073A (en)
DE (1) DE2059425A1 (en)
FR (1) FR2117172A5 (en)
IT (1) IT941784B (en)
LU (1) LU64374A1 (en)
NL (1) NL7116101A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4284468A (en) * 1977-12-16 1981-08-18 Llewelyn Stearns Patterned chemical etching of high temperature resistant metals

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH576739A5 (en) * 1972-08-25 1976-06-15 Ciba Geigy Ag
GB1535813A (en) * 1975-07-03 1978-12-13 Ncr Co Multi-layer circuit board
FR2340620A1 (en) * 1976-02-06 1977-09-02 Ibm MANUFACTURING PROCESS OF A LARGE-SCALE INTEGRATED DEVICE HAVING A FLAT SURFACE
DE3013667C2 (en) * 1980-04-09 1983-01-20 Wilhelm Ruf KG, 8000 München Printed circuit board and process for their manufacture
WO1983003944A1 (en) * 1982-05-05 1983-11-10 Hughes Aircraft Company High density printed wiring board
US4591411A (en) * 1982-05-05 1986-05-27 Hughes Aircraft Company Method for forming a high density printed wiring board
US4663497A (en) * 1982-05-05 1987-05-05 Hughes Aircraft Company High density printed wiring board
FR2656493A1 (en) * 1989-12-21 1991-06-28 Bull Sa METHOD FOR INTERCONNECTING METAL LAYERS OF THE MULTILAYERED NETWORK OF AN ELECTRONIC CARD, AND RESULTING CARD.
US5698299A (en) * 1991-02-28 1997-12-16 Dyconex Patente Ag Thin laminated microstructure with precisely aligned openings
DE59208606D1 (en) * 1991-02-28 1997-07-17 Heinze Dyconex Patente METHOD FOR PRODUCING A COMPOSITE BODY MADE FROM MICROSCREENS
DE59309575D1 (en) * 1992-06-15 1999-06-17 Heinze Dyconex Patente METHOD FOR PRODUCING CIRCUIT BOARDS USING A SEMI-FINISHED PRODUCT WITH EXTREMELY TIGHT WIRING FOR THE SIGNALING
FR2713139B1 (en) * 1993-12-03 1995-12-29 Loic Demeure Metallic support based on organic foam, assembly of at least two of these supports and method of manufacturing this support.
DE4438777A1 (en) * 1994-10-18 1996-05-02 Atotech Deutschland Gmbh Process for the production of electrical circuit carriers
DE59609022D1 (en) 1995-06-15 2002-05-08 Dyconex Patente Ag Zug CONNECTION SUBSTRATE
EP1318704A1 (en) * 2001-10-16 2003-06-11 Ultratera Corporation Printed circuit board micro hole processing method
JP2005150263A (en) * 2003-11-13 2005-06-09 Nitto Denko Corp Double-sided wiring circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4284468A (en) * 1977-12-16 1981-08-18 Llewelyn Stearns Patterned chemical etching of high temperature resistant metals

Also Published As

Publication number Publication date
LU64374A1 (en) 1972-06-19
BE776073A (en) 1972-03-16
DE2059425A1 (en) 1972-06-22
IT941784B (en) 1973-03-10
FR2117172A5 (en) 1972-07-21

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