NL7107282A - - Google Patents

Info

Publication number
NL7107282A
NL7107282A NL7107282A NL7107282A NL7107282A NL 7107282 A NL7107282 A NL 7107282A NL 7107282 A NL7107282 A NL 7107282A NL 7107282 A NL7107282 A NL 7107282A NL 7107282 A NL7107282 A NL 7107282A
Authority
NL
Netherlands
Application number
NL7107282A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7107282A publication Critical patent/NL7107282A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1554—Rotating or turning the PCB in a continuous manner
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Apparatus (AREA)
NL7107282A 1970-05-26 1971-05-26 NL7107282A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4068270A 1970-05-26 1970-05-26

Publications (1)

Publication Number Publication Date
NL7107282A true NL7107282A (https=) 1971-11-30

Family

ID=21912343

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7107282A NL7107282A (https=) 1970-05-26 1971-05-26

Country Status (10)

Country Link
US (1) US3661638A (https=)
JP (2) JPS5247548B1 (https=)
AT (1) AT317335B (https=)
CA (1) CA927524A (https=)
CH (1) CH535627A (https=)
DE (1) DE2126799B2 (https=)
ES (1) ES396839A1 (https=)
FR (1) FR2112893A5 (https=)
GB (1) GB1326285A (https=)
NL (1) NL7107282A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3862856A (en) * 1972-06-29 1975-01-28 Headway Research Inc Method for achieving thin films on substrates
US3904788A (en) * 1972-07-18 1975-09-09 Selas Corp Of America Method of placing membrane on support
US3893409A (en) * 1972-12-01 1975-07-08 Xerox Corp Apparatus for solder coating printed circuit boards
US3999004A (en) * 1974-09-27 1976-12-21 International Business Machines Corporation Multilayer ceramic substrate structure
US4083323A (en) * 1975-08-07 1978-04-11 Xerox Corporation Pneumatic system for solder leveling apparatus
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
US5061216A (en) * 1990-04-16 1991-10-29 The United States Of America As Represented By The United States Department Of Energy Ionization chamber dosimeter
US5104689A (en) * 1990-09-24 1992-04-14 International Business Machines Corporation Method and apparatus for automated solder deposition at multiple sites
GB2265101B (en) * 1992-03-17 1995-05-10 Sun Ind Coatings Soldering apparatus and method
GB2265325A (en) * 1992-03-18 1993-09-29 Ibm Solder application to a circuit board
US5909012A (en) * 1996-10-21 1999-06-01 Ford Motor Company Method of making a three-dimensional part with buried conductors

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3046157A (en) * 1958-05-07 1962-07-24 Philips Corp Method for coating the inner wall of a tube intended for electric discharge lamps with a uniform liquid layer as well as an arrangement for the application of the method
US3031339A (en) * 1959-08-10 1962-04-24 Regan Ind Inc Coating machine and method
US3200788A (en) * 1963-10-30 1965-08-17 Electrovert Mfg Co Ltd Centrifugal pre-tinning apparatus for printed circuit boards
US3483616A (en) * 1964-01-23 1969-12-16 Sanders Associates Inc Method for producing a printed circuit board
US3359132A (en) * 1964-07-10 1967-12-19 Albin E Wittmann Method of coating circuit paths on printed circuit boards with solder
US3393659A (en) * 1966-02-07 1968-07-23 Varo Inc Electrokinetics Div Solder coating apparatus
US3416958A (en) * 1966-02-25 1968-12-17 Lear Siegler Inc Alloy coating for electrical conductors
US3491779A (en) * 1967-07-06 1970-01-27 Brown Eng Co Inc Solder leveling apparatus

Also Published As

Publication number Publication date
JPS5432699B2 (https=) 1979-10-16
JPS5335169A (en) 1978-04-01
FR2112893A5 (https=) 1972-06-23
DE2126799A1 (de) 1972-01-20
JPS5247548B1 (https=) 1977-12-03
CA927524A (en) 1973-05-29
GB1326285A (en) 1973-08-08
DE2126799B2 (de) 1972-11-23
CH535627A (de) 1973-04-15
AT317335B (de) 1974-08-26
ES396839A1 (es) 1974-06-16
US3661638A (en) 1972-05-09

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