NL7102323A - - Google Patents
Info
- Publication number
- NL7102323A NL7102323A NL7102323A NL7102323A NL7102323A NL 7102323 A NL7102323 A NL 7102323A NL 7102323 A NL7102323 A NL 7102323A NL 7102323 A NL7102323 A NL 7102323A NL 7102323 A NL7102323 A NL 7102323A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- ing And Chemical Polishing (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1447870A | 1970-02-26 | 1970-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7102323A true NL7102323A (enExample) | 1971-08-30 |
Family
ID=21765748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7102323A NL7102323A (enExample) | 1970-02-26 | 1971-02-22 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3644180A (enExample) |
| BE (1) | BE763308A (enExample) |
| CA (1) | CA952058A (enExample) |
| DE (1) | DE2108327A1 (enExample) |
| FR (1) | FR2085598A1 (enExample) |
| NL (1) | NL7102323A (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4330604A (en) * | 1980-08-04 | 1982-05-18 | Hughes Aircraft Company | Fabrication of holograms on plastic substrates |
| US4329409A (en) * | 1980-08-04 | 1982-05-11 | Hughes Aircraft Company | Process for fabricating stable holograms |
| DE3720465A1 (de) * | 1987-06-20 | 1988-12-29 | Asea Brown Boveri | Haftvermittler fuer negativresist zum aetzen tiefer graeben in siliciumscheiben mit glatter oberflaeche und verfahren zur herstellung des haftvermittlers |
| US5902475A (en) * | 1997-04-08 | 1999-05-11 | Interventional Technologies, Inc. | Method for manufacturing a stent |
| US6063646A (en) * | 1998-10-06 | 2000-05-16 | Japan Rec Co., Ltd. | Method for production of semiconductor package |
| US6047637A (en) * | 1999-06-17 | 2000-04-11 | Fujitsu Limited | Method of paste printing using stencil and masking layer |
| US6617251B1 (en) * | 2001-06-19 | 2003-09-09 | Lsi Logic Corporation | Method of shallow trench isolation formation and planarization |
| US11859093B2 (en) | 2021-03-26 | 2024-01-02 | Te Connectivity Solutions Gmbh | Printable non-curable thixotropic hot melt composition |
| US11859092B2 (en) | 2021-03-26 | 2024-01-02 | Te Connectivity Solutions Gmbh | Printable non-curable thixotropic hot melt composition |
-
1970
- 1970-02-26 US US14478A patent/US3644180A/en not_active Expired - Lifetime
- 1970-09-18 CA CA093,509A patent/CA952058A/en not_active Expired
-
1971
- 1971-02-22 DE DE19712108327 patent/DE2108327A1/de active Pending
- 1971-02-22 NL NL7102323A patent/NL7102323A/xx unknown
- 1971-02-23 FR FR7106166A patent/FR2085598A1/fr not_active Withdrawn
- 1971-02-23 BE BE763308A patent/BE763308A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2085598A1 (enExample) | 1971-12-24 |
| DE2108327A1 (de) | 1971-10-28 |
| BE763308A (fr) | 1971-07-16 |
| CA952058A (en) | 1974-07-30 |
| US3644180A (en) | 1972-02-22 |