NL7100410A - - Google Patents

Info

Publication number
NL7100410A
NL7100410A NL7100410A NL7100410A NL7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A
Authority
NL
Netherlands
Application number
NL7100410A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7100410A priority Critical patent/NL7100410A/xx
Priority to DE19712163855 priority patent/DE2163855A1/de
Priority to US00211277A priority patent/US3780429A/en
Priority to IT19193/72A priority patent/IT946430B/it
Priority to CA131,999A priority patent/CA953504A/en
Priority to GB99272A priority patent/GB1380644A/en
Priority to FR7200777A priority patent/FR2121744A1/fr
Publication of NL7100410A publication Critical patent/NL7100410A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casings For Electric Apparatus (AREA)
NL7100410A 1971-01-13 1971-01-13 NL7100410A (enrdf_load_html_response)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (enrdf_load_html_response) 1971-01-13 1971-01-13
DE19712163855 DE2163855A1 (de) 1971-01-13 1971-12-22 Verfahren und Vorrichtung zum Herstellen eines Bodens für die Umhüllung eines elektrischen Bauelementes, sowie Boden für die Umhüllung eines elektrischen Bauelementes
US00211277A US3780429A (en) 1971-01-13 1971-12-23 Method for manufacturing a base for the envelope of an electric component
IT19193/72A IT946430B (it) 1971-01-13 1972-01-10 Metodo e dispositivo per la fabbri cazione di una base per un conteni tore di un componente elettrico e base per il com ponente elettrico
CA131,999A CA953504A (en) 1971-01-13 1972-01-10 Manufacturing a base for the envelope of an electrical component
GB99272A GB1380644A (en) 1971-01-13 1972-01-10 Manufacture of bases for electrical-component envelopes
FR7200777A FR2121744A1 (enrdf_load_html_response) 1971-01-13 1972-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (enrdf_load_html_response) 1971-01-13 1971-01-13

Publications (1)

Publication Number Publication Date
NL7100410A true NL7100410A (enrdf_load_html_response) 1972-07-17

Family

ID=19812245

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7100410A NL7100410A (enrdf_load_html_response) 1971-01-13 1971-01-13

Country Status (7)

Country Link
US (1) US3780429A (enrdf_load_html_response)
CA (1) CA953504A (enrdf_load_html_response)
DE (1) DE2163855A1 (enrdf_load_html_response)
FR (1) FR2121744A1 (enrdf_load_html_response)
GB (1) GB1380644A (enrdf_load_html_response)
IT (1) IT946430B (enrdf_load_html_response)
NL (1) NL7100410A (enrdf_load_html_response)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100675A (en) * 1976-11-01 1978-07-18 Mansol Ceramics Company Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
US5074036A (en) * 1989-02-10 1991-12-24 Honeywell Inc. Method of die bonding semiconductor chip by using removable frame
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
DE4428319C2 (de) * 1994-08-10 1996-08-14 Duerrwaechter E Dr Doduco Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526588A (en) * 1946-03-22 1950-10-17 Raytheon Mfg Co Molding apparatus
US2958100A (en) * 1955-05-16 1960-11-01 Erie Resistor Corp Mold for forming a plurality of electrical elements with embedded terminals
NL258072A (enrdf_load_html_response) * 1960-11-17
US3379823A (en) * 1965-04-29 1968-04-23 Corning Glass Works Hermetic enclosure for electronic devices

Also Published As

Publication number Publication date
GB1380644A (en) 1975-01-15
CA953504A (en) 1974-08-27
IT946430B (it) 1973-05-21
US3780429A (en) 1973-12-25
FR2121744A1 (enrdf_load_html_response) 1972-08-25
DE2163855A1 (de) 1972-07-20

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