NL7011885A - - Google Patents

Info

Publication number
NL7011885A
NL7011885A NL7011885A NL7011885A NL7011885A NL 7011885 A NL7011885 A NL 7011885A NL 7011885 A NL7011885 A NL 7011885A NL 7011885 A NL7011885 A NL 7011885A NL 7011885 A NL7011885 A NL 7011885A
Authority
NL
Netherlands
Application number
NL7011885A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7011885A priority Critical patent/NL7011885A/xx
Priority to DE2136201A priority patent/DE2136201C3/de
Priority to GB37351/71A priority patent/GB1293710A/en
Priority to AU32121/71A priority patent/AU463465B2/en
Priority to BR5101/71A priority patent/BR7105101D0/pt
Priority to JP46059670A priority patent/JPS5110072B1/ja
Priority to CA120,461A priority patent/CA964379A/en
Priority to US00170482A priority patent/US3780432A/en
Priority to ES394087A priority patent/ES394087A1/es
Priority to FR7129371A priority patent/FR2102211B1/fr
Publication of NL7011885A publication Critical patent/NL7011885A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/479Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77Auxiliary members characterised by their shape
    • H10W40/778Auxiliary members characterised by their shape in encapsulations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device
NL7011885A 1970-08-12 1970-08-12 NL7011885A (https=)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL7011885A NL7011885A (https=) 1970-08-12 1970-08-12
DE2136201A DE2136201C3 (de) 1970-08-12 1971-07-20 Verfahren zum Anbringen metallischer Zuleitungen an einem elektrischen Festkörper-Bauelement
GB37351/71A GB1293710A (en) 1970-08-12 1971-08-09 Improvements in and relating to substrate connections
AU32121/71A AU463465B2 (en) 1970-08-12 1971-08-09 Method of establishing relatively insulation connections between conductor ends andan insulating substrate
BR5101/71A BR7105101D0 (pt) 1970-08-12 1971-08-09 Processo para estabelecer conexoes relativamente isoladas entre as extremidades de condutores metalicos
JP46059670A JPS5110072B1 (https=) 1970-08-12 1971-08-09
CA120,461A CA964379A (en) 1970-08-12 1971-08-10 Method of establishing relatively insulation connections between conductor ends and an insulating substrate
US00170482A US3780432A (en) 1970-08-12 1971-08-10 Method of establishing relatively insulated connections between conductor ends and an insulating substrate
ES394087A ES394087A1 (es) 1970-08-12 1971-08-10 Un metodo de establecer conexiones relativamente aisladas entre los terminales de conductores metalicos dispuestos en un bastidor de montaje y un sustrato aislante.
FR7129371A FR2102211B1 (https=) 1970-08-12 1971-08-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7011885A NL7011885A (https=) 1970-08-12 1970-08-12

Publications (1)

Publication Number Publication Date
NL7011885A true NL7011885A (https=) 1972-02-15

Family

ID=19810763

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7011885A NL7011885A (https=) 1970-08-12 1970-08-12

Country Status (10)

Country Link
US (1) US3780432A (https=)
JP (1) JPS5110072B1 (https=)
AU (1) AU463465B2 (https=)
BR (1) BR7105101D0 (https=)
CA (1) CA964379A (https=)
DE (1) DE2136201C3 (https=)
ES (1) ES394087A1 (https=)
FR (1) FR2102211B1 (https=)
GB (1) GB1293710A (https=)
NL (1) NL7011885A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893234A (en) * 1972-07-03 1975-07-08 Sierracin Corp Edge improvement for window with electrically conductive layer
US3909934A (en) * 1972-12-02 1975-10-07 Licentia Gmbh Method of producing a measuring head for measuring electrical components
JPH033604U (https=) * 1989-06-02 1991-01-16
EP0464232B1 (de) * 1990-06-30 1994-03-16 Dr. Johannes Heidenhain GmbH Lötverbinder und Verfahren zur Herstellung einer elektrischen Schaltung mit diesem Lötverbinder
US5184206A (en) * 1990-10-26 1993-02-02 General Electric Company Direct thermocompression bonding for thin electronic power chips
DE4429002A1 (de) * 1994-08-16 1996-02-22 Siemens Nixdorf Inf Syst Anschlußstiele für elektronische Bausteine mit flächigen Anschlußfeldern
KR20090076949A (ko) * 2006-10-06 2009-07-13 마이크로세미 코포레이션 고온, 고전압 탄화규소 무공극 전자 패키지

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396461A (en) * 1962-12-04 1968-08-13 Engelhard Ind Inc Printed circuit board and method of manufacture thereof
GB1087861A (en) * 1963-04-18 1967-10-18 Sealectro Corp Improvements in electrical socket connectors and other electrical contact devices
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3381081A (en) * 1965-04-16 1968-04-30 Cts Corp Electrical connection and method of making the same
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3371148A (en) * 1966-04-12 1968-02-27 Radiation Inc Semiconductor device package and method of assembly therefor
US3434940A (en) * 1966-07-21 1969-03-25 Mc Donnell Douglas Corp Process for making thin-film temperature sensors
US3618200A (en) * 1970-04-17 1971-11-09 Matsuo Electric Co Method of manufacturing chip-shaped passive electronic components

Also Published As

Publication number Publication date
FR2102211B1 (https=) 1976-05-28
CA964379A (en) 1975-03-11
DE2136201A1 (de) 1973-08-16
ES394087A1 (es) 1974-11-16
GB1293710A (en) 1972-10-25
JPS5110072B1 (https=) 1976-04-01
BR7105101D0 (pt) 1973-04-12
FR2102211A1 (https=) 1972-04-07
DE2136201C3 (de) 1978-05-24
AU3212171A (en) 1973-02-15
DE2136201B2 (de) 1977-09-22
US3780432A (en) 1973-12-25
AU463465B2 (en) 1975-07-31

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