NL7009641A - - Google Patents

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Publication number
NL7009641A
NL7009641A NL7009641A NL7009641A NL7009641A NL 7009641 A NL7009641 A NL 7009641A NL 7009641 A NL7009641 A NL 7009641A NL 7009641 A NL7009641 A NL 7009641A NL 7009641 A NL7009641 A NL 7009641A
Authority
NL
Netherlands
Application number
NL7009641A
Other versions
NL172806C (nl
NL172806B (nl
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Publication date
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Publication of NL7009641A publication Critical patent/NL7009641A/xx
Publication of NL172806B publication Critical patent/NL172806B/xx
Application granted granted Critical
Publication of NL172806C publication Critical patent/NL172806C/xx

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Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NL7009641A 1969-06-30 1970-06-30 Werkwijze voor het verbinden van metalen draden aan gemetalliseerde zones van een halfgeleiderelement. NL172806C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83748569A 1969-06-30 1969-06-30

Publications (3)

Publication Number Publication Date
NL7009641A true NL7009641A (enrdf_load_stackoverflow) 1971-01-04
NL172806B NL172806B (nl) 1983-05-16
NL172806C NL172806C (nl) 1983-10-17

Family

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NL7009641A NL172806C (nl) 1969-06-30 1970-06-30 Werkwijze voor het verbinden van metalen draden aan gemetalliseerde zones van een halfgeleiderelement.

Country Status (7)

Country Link
US (1) US3641660A (enrdf_load_stackoverflow)
JP (1) JPS565062B1 (enrdf_load_stackoverflow)
KR (1) KR780000596B1 (enrdf_load_stackoverflow)
DE (2) DE2032302C2 (enrdf_load_stackoverflow)
FR (1) FR2048054B1 (enrdf_load_stackoverflow)
GB (1) GB1323331A (enrdf_load_stackoverflow)
NL (1) NL172806C (enrdf_load_stackoverflow)

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US4340166A (en) * 1978-11-22 1982-07-20 Kulicke & Soffa Industries, Inc. High speed wire bonding method
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
US5244140A (en) * 1991-09-30 1993-09-14 Texas Instruments Incorporated Ultrasonic bonding process beyond 125 khz
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
DE19617470B4 (de) * 1995-11-07 2006-02-02 Hesse & Knipps Gmbh Fadenzuführung
US5813590A (en) 1995-12-18 1998-09-29 Micron Technology, Inc. Extended travel wire bonding machine
DE19831550B4 (de) * 1998-07-14 2013-08-14 Robert Bosch Gmbh Bondverfahren
US6520026B1 (en) * 1999-11-03 2003-02-18 International Business Machines Corporation Method for making and testing thermocompression bonds
US6651866B2 (en) 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
US20050051600A1 (en) * 2003-09-10 2005-03-10 Texas Instruments Incorporated Method and system for stud bumping
DE102004056702B3 (de) * 2004-04-22 2006-03-02 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding

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Also Published As

Publication number Publication date
US3641660A (en) 1972-02-15
GB1323331A (en) 1973-07-11
FR2048054A1 (enrdf_load_stackoverflow) 1971-03-19
NL172806C (nl) 1983-10-17
FR2048054B1 (enrdf_load_stackoverflow) 1975-09-26
DE2066210A1 (enrdf_load_stackoverflow) 1986-03-20
DE2032302C2 (de) 1987-01-29
JPS565062B1 (enrdf_load_stackoverflow) 1981-02-03
DE2032302A1 (de) 1971-02-25
KR780000596B1 (en) 1978-11-23
NL172806B (nl) 1983-05-16

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