NL7006122A - - Google Patents

Info

Publication number
NL7006122A
NL7006122A NL7006122A NL7006122A NL7006122A NL 7006122 A NL7006122 A NL 7006122A NL 7006122 A NL7006122 A NL 7006122A NL 7006122 A NL7006122 A NL 7006122A NL 7006122 A NL7006122 A NL 7006122A
Authority
NL
Netherlands
Application number
NL7006122A
Other versions
NL145395B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7006122A publication Critical patent/NL7006122A/xx
Publication of NL145395B publication Critical patent/NL145395B/xx

Links

Classifications

    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
NL707006122A 1969-04-26 1970-04-27 Werkwijze voor het vervaardigen van een ondersteuning voor een halfgeleiderinrichting. NL145395B (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB21401/69A GB1255832A (en) 1969-04-26 1969-04-26 Improvements relating to the manufacture of supports for semiconductor devices
GB4646772A GB1356879A (en) 1969-04-26 1972-10-09 Manufacture of supports for semiconductor devices

Publications (2)

Publication Number Publication Date
NL7006122A true NL7006122A (enrdf_load_stackoverflow) 1970-10-28
NL145395B NL145395B (nl) 1975-03-17

Family

ID=62527852

Family Applications (1)

Application Number Title Priority Date Filing Date
NL707006122A NL145395B (nl) 1969-04-26 1970-04-27 Werkwijze voor het vervaardigen van een ondersteuning voor een halfgeleiderinrichting.

Country Status (4)

Country Link
DE (2) DE2017499A1 (enrdf_load_stackoverflow)
FR (1) FR2045377A5 (enrdf_load_stackoverflow)
GB (2) GB1255832A (enrdf_load_stackoverflow)
NL (1) NL145395B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486725A1 (fr) * 1980-07-09 1982-01-15 Gleizes Raymond Procede et appareil de presoudage de billes de soudure sur des pattes de connexion
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.

Also Published As

Publication number Publication date
FR2045377A5 (enrdf_load_stackoverflow) 1971-02-26
NL145395B (nl) 1975-03-17
DE2017499A1 (de) 1970-11-05
GB1356879A (en) 1974-06-19
DE7006122U (enrdf_load_stackoverflow) 1900-01-01
GB1255832A (en) 1971-12-01

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