NL6918641A - - Google Patents

Info

Publication number
NL6918641A
NL6918641A NL6918641A NL6918641A NL6918641A NL 6918641 A NL6918641 A NL 6918641A NL 6918641 A NL6918641 A NL 6918641A NL 6918641 A NL6918641 A NL 6918641A NL 6918641 A NL6918641 A NL 6918641A
Authority
NL
Netherlands
Application number
NL6918641A
Other versions
NL167049C (nl
NL167049B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6918641A publication Critical patent/NL6918641A/xx
Publication of NL167049B publication Critical patent/NL167049B/xx
Application granted granted Critical
Publication of NL167049C publication Critical patent/NL167049C/xx

Links

Classifications

    • H10W20/40—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10P95/00—
    • H10W74/43—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/927—Electromigration resistant metallization
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
NL6918641.A 1969-01-15 1969-12-12 Microschakelelement of geintegreerde schakeling met dunne geleiders en werkwijze ter vervaardiging van deze inrichtingen. NL167049C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79137169A 1969-01-15 1969-01-15

Publications (3)

Publication Number Publication Date
NL6918641A true NL6918641A (cg-RX-API-DMAC10.html) 1970-07-17
NL167049B NL167049B (nl) 1981-05-15
NL167049C NL167049C (nl) 1981-10-15

Family

ID=25153531

Family Applications (2)

Application Number Title Priority Date Filing Date
NL87258D NL87258C (cg-RX-API-DMAC10.html) 1969-01-15
NL6918641.A NL167049C (nl) 1969-01-15 1969-12-12 Microschakelelement of geintegreerde schakeling met dunne geleiders en werkwijze ter vervaardiging van deze inrichtingen.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL87258D NL87258C (cg-RX-API-DMAC10.html) 1969-01-15

Country Status (10)

Country Link
US (1) US3725309A (cg-RX-API-DMAC10.html)
JP (1) JPS4922397B1 (cg-RX-API-DMAC10.html)
BE (1) BE744429A (cg-RX-API-DMAC10.html)
CA (1) CA939077A (cg-RX-API-DMAC10.html)
CH (1) CH502050A (cg-RX-API-DMAC10.html)
DE (1) DE2001515C3 (cg-RX-API-DMAC10.html)
FR (1) FR2030151B1 (cg-RX-API-DMAC10.html)
GB (1) GB1279741A (cg-RX-API-DMAC10.html)
NL (2) NL167049C (cg-RX-API-DMAC10.html)
SE (1) SE355475B (cg-RX-API-DMAC10.html)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3848330A (en) * 1972-06-01 1974-11-19 Motorola Inc Electromigration resistant semiconductor contacts and the method of producing same
US3928027A (en) * 1973-03-27 1975-12-23 Us Energy Nonswelling alloy
US3924264A (en) * 1973-05-17 1975-12-02 Ibm Schottky barrier device and circuit application
US4097663A (en) * 1976-01-29 1978-06-27 Stauffer Chemical Company Low fusion copolymer comprising vinyl chloride, vinyl acetate, and bis(hydrocarbyl)vinylphosphonate
US4017890A (en) * 1975-10-24 1977-04-12 International Business Machines Corporation Intermetallic compound layer in thin films for improved electromigration resistance
US3987216A (en) * 1975-12-31 1976-10-19 International Business Machines Corporation Method of forming schottky barrier junctions having improved barrier height
JPS5459080A (en) * 1977-10-19 1979-05-12 Nec Corp Semiconductor device
US4433004A (en) * 1979-07-11 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and a method for manufacturing the same
JPS5731144A (en) * 1980-07-31 1982-02-19 Fujitsu Ltd Mamufacture of semiconductor device
US4335506A (en) * 1980-08-04 1982-06-22 International Business Machines Corporation Method of forming aluminum/copper alloy conductors
US4373966A (en) * 1981-04-30 1983-02-15 International Business Machines Corporation Forming Schottky barrier diodes by depositing aluminum silicon and copper or binary alloys thereof and alloy-sintering
US4349411A (en) * 1981-10-05 1982-09-14 Bell Telephone Laboratories, Incorporated Etch procedure for aluminum alloy
US4393096A (en) * 1981-11-16 1983-07-12 International Business Machines Corporation Aluminum-copper alloy evaporated films with low via resistance
JPS5884411A (ja) * 1981-11-16 1983-05-20 Tdk Corp 磁気記録媒体の製造方法
GB2131624B (en) * 1982-12-09 1986-07-09 Standard Telephones Cables Ltd Thick film circuits
US4525734A (en) * 1983-03-21 1985-06-25 Syracuse University Hydrogen charged thin film conductor
US4489482A (en) * 1983-06-06 1984-12-25 Fairchild Camera & Instrument Corp. Impregnation of aluminum interconnects with copper
US4549036A (en) * 1984-07-23 1985-10-22 Reichbach Morris M Circular integrated circuit package
DE3782904T2 (de) * 1986-09-17 1993-04-08 Fujitsu Ltd Verfahren zur ausbildung einer kupfer enthaltenden metallisierungsschicht auf der oberflaeche eines halbleiterbauelementes.
US5019891A (en) * 1988-01-20 1991-05-28 Hitachi, Ltd. Semiconductor device and method of fabricating the same
JP2680468B2 (ja) * 1989-07-01 1997-11-19 株式会社東芝 半導体装置および半導体装置の製造方法
US5243221A (en) * 1989-10-25 1993-09-07 At&T Bell Laboratories Aluminum metallization doped with iron and copper to prevent electromigration
US5554889A (en) * 1992-04-03 1996-09-10 Motorola, Inc. Structure and method for metallization of semiconductor devices
EP0606761A3 (en) * 1992-12-28 1995-02-08 Kawasaki Steel Co Semiconductor device and its manufacturing method.
JP3349332B2 (ja) 1995-04-28 2002-11-25 インターナショナル・ビジネス・マシーンズ・コーポレーション 反射式空間光変調素子配列及びその形成方法
JP4083921B2 (ja) * 1998-05-29 2008-04-30 株式会社東芝 半導体装置の製造方法
US6955980B2 (en) * 2002-08-30 2005-10-18 Texas Instruments Incorporated Reducing the migration of grain boundaries
US20100307568A1 (en) * 2009-06-04 2010-12-09 First Solar, Inc. Metal barrier-doped metal contact layer
US11738537B2 (en) 2013-10-30 2023-08-29 San Diego Gas & Electric Company, c/o Sempra Energy Nonconductive films for lighter than air balloons
US20150118460A1 (en) 2013-10-30 2015-04-30 San Diego Gas & Electric company c/o Sempra Energy Nonconductive films for lighter than air balloons

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1658757A (en) * 1926-03-19 1928-02-07 Gen Electric Metal composition
US2569149A (en) * 1945-10-19 1951-09-25 Joseph B Brennan Bimetallic structure
US2706680A (en) * 1952-02-27 1955-04-19 Aluminum Co Of America Aluminum base alloy
US3018198A (en) * 1959-08-13 1962-01-23 Resistance Products Company Film resistor and method of making same
US3318758A (en) * 1963-02-18 1967-05-09 Tellite Corp Method of making a printed circuit board which includes low temperature saturation and the product
US3307978A (en) * 1964-02-17 1967-03-07 Dow Chemical Co Process for preparing high strength fabricated articles from aluminum-base alloys containing copper
US3359141A (en) * 1964-02-18 1967-12-19 Pechiney Prod Chimiques Sa Electrical conductors of aluminum and methods for production of same
FR1449426A (fr) * 1964-10-10 1966-08-12 Nippon Electric Co Dispositif semi-conducteurs utilisant une couche d'un composé d'aluminium et d'or
US3360349A (en) * 1965-04-01 1967-12-26 Sperry Rand Corp Copper layer bonded to a non-conductive layer by means of a copper alloy
NL6617141A (cg-RX-API-DMAC10.html) * 1966-02-11 1967-08-14 Siemens Ag
US3474530A (en) * 1967-02-03 1969-10-28 Ibm Mass production of electronic devices

Also Published As

Publication number Publication date
GB1279741A (en) 1972-06-28
JPS4922397B1 (cg-RX-API-DMAC10.html) 1974-06-07
US3725309A (en) 1973-04-03
NL167049C (nl) 1981-10-15
DE2001515A1 (de) 1970-08-27
FR2030151A1 (cg-RX-API-DMAC10.html) 1970-10-30
NL87258C (cg-RX-API-DMAC10.html)
BE744429A (fr) 1970-07-14
DE2001515C3 (de) 1984-06-20
DE2001515B2 (de) 1979-08-09
NL167049B (nl) 1981-05-15
SE355475B (cg-RX-API-DMAC10.html) 1973-04-16
FR2030151B1 (cg-RX-API-DMAC10.html) 1974-02-01
CA939077A (en) 1973-12-25
CH502050A (de) 1971-01-15

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Legal Events

Date Code Title Description
V4 Discontinued because of reaching the maximum lifetime of a patent