NL6912308A - - Google Patents

Info

Publication number
NL6912308A
NL6912308A NL6912308A NL6912308A NL6912308A NL 6912308 A NL6912308 A NL 6912308A NL 6912308 A NL6912308 A NL 6912308A NL 6912308 A NL6912308 A NL 6912308A NL 6912308 A NL6912308 A NL 6912308A
Authority
NL
Netherlands
Application number
NL6912308A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6912308A publication Critical patent/NL6912308A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Conductive Materials (AREA)
NL6912308A 1968-09-20 1969-08-13 NL6912308A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19681789005 DE1789005A1 (de) 1968-09-20 1968-09-20 Eingekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen
DE19681789014 DE1789014B2 (de) 1968-09-20 1968-09-21 Halbleiterbauelement mit gas- und feuchtigkeitsdichtem gehaeuse

Publications (1)

Publication Number Publication Date
NL6912308A true NL6912308A (de) 1970-03-24

Family

ID=25755981

Family Applications (2)

Application Number Title Priority Date Filing Date
NL6912308A NL6912308A (de) 1968-09-20 1969-08-13
NL6912771A NL6912771A (de) 1968-09-20 1969-08-21

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL6912771A NL6912771A (de) 1968-09-20 1969-08-21

Country Status (7)

Country Link
US (2) US3598896A (de)
BE (2) BE738238A (de)
CH (2) CH495057A (de)
DE (2) DE1789005A1 (de)
FR (2) FR2018581A1 (de)
GB (2) GB1278841A (de)
NL (2) NL6912308A (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1803307A1 (de) * 1968-10-16 1970-05-21 Siemens Ag Verfahren zum Herstellen einer festen Verbindung zwischen einem Kunststoff- und einem Metallkoerper
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3800192A (en) * 1970-08-11 1974-03-26 O Schaerli Semiconductor circuit element with pressure contact means
US3885243A (en) * 1971-06-25 1975-05-20 Bbc Brown Boveri & Cie Semiconductor device
US3992717A (en) * 1974-06-21 1976-11-16 Westinghouse Electric Corporation Housing for a compression bonded encapsulation of a semiconductor device
JPS51140619A (en) * 1975-05-30 1976-12-03 Pioneer Electronic Corp Vibration member for acoustic convertor
DE2556749A1 (de) * 1975-12-17 1977-06-23 Bbc Brown Boveri & Cie Leistungshalbleiterbauelement in scheibenzellenbauweise
DE2840400C2 (de) * 1978-09-16 1982-04-08 Brown, Boveri & Cie Ag, 6800 Mannheim Steuerbares Leistungs-Halbleiterbauelement
US4414562A (en) * 1980-07-24 1983-11-08 Thermal Associates, Inc. Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases
DE3308661A1 (de) * 1983-03-11 1984-09-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterelement
JPH0749815Y2 (ja) * 1990-07-23 1995-11-13 シャープ株式会社 表面実装型光結合装置
SE501855C2 (sv) * 1990-11-19 1995-06-06 Skf Ab Gjutgods med ingjuten armering, samt förfarande för framställning av ett sådant gjutgods
US5198958A (en) * 1991-06-03 1993-03-30 Amphenol Corporation Transient suppression component
US5339222A (en) * 1993-04-06 1994-08-16 The Whitaker Corporation Shielded printed circuit card holder
DE19934554A1 (de) * 1999-07-22 2001-01-25 Michael Stollenwerk Wärmetauscher
DE10103669B4 (de) * 2001-01-27 2004-07-29 Ksb Ag Verfahren zur Herstellung eines mit Kunststoff überzogenen Gußstücks
US6970360B2 (en) * 2004-03-18 2005-11-29 International Business Machines Corporation Tamper-proof enclosure for a circuit card
US8019451B2 (en) * 2006-11-22 2011-09-13 Target Brands, Inc. Financial transaction product with media player
US7841538B2 (en) * 2007-10-31 2010-11-30 Target Brands, Inc. Transaction product with memory
DE102007055018B4 (de) * 2007-11-14 2021-05-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Verbinden einer Edelmetalloberfläche mit einem Polymer
WO2012039976A1 (en) * 2010-09-23 2012-03-29 Corning Incorporated Technique to modify the microstructure of semiconducting materials
CN104124215B (zh) * 2014-06-26 2017-02-15 江苏省宜兴电子器件总厂 一种焊接、键合和密封同步完成的封装结构和封装工艺

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475662A (en) * 1967-11-22 1969-10-28 Westinghouse Electric Corp Hermetically sealed electrical device

Also Published As

Publication number Publication date
CH495058A (de) 1970-08-15
US3598896A (en) 1971-08-10
DE1789014A1 (de) 1972-04-06
BE738957A (de) 1970-03-02
BE738238A (de) 1970-02-02
CH495057A (de) 1970-08-15
DE1789014B2 (de) 1973-03-29
DE1789014C3 (de) 1973-10-11
FR2018581A1 (de) 1970-05-29
FR2018557A1 (de) 1970-05-29
NL6912771A (de) 1970-03-24
GB1278841A (en) 1972-06-21
US3597524A (en) 1971-08-03
GB1272251A (en) 1972-04-26
DE1789005A1 (de) 1972-01-20

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