NL6900945A - - Google Patents

Info

Publication number
NL6900945A
NL6900945A NL6900945A NL6900945A NL6900945A NL 6900945 A NL6900945 A NL 6900945A NL 6900945 A NL6900945 A NL 6900945A NL 6900945 A NL6900945 A NL 6900945A NL 6900945 A NL6900945 A NL 6900945A
Authority
NL
Netherlands
Application number
NL6900945A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6900945A priority Critical patent/NL6900945A/xx
Priority to DE19702001312 priority patent/DE2001312A1/de
Priority to GB1288731D priority patent/GB1288731A/en
Priority to AU10375/70A priority patent/AU1037570A/en
Priority to JP45004747A priority patent/JPS4826973B1/ja
Priority to ES375616A priority patent/ES375616A1/es
Priority to AT45770A priority patent/AT300086B/de
Priority to CH69070A priority patent/CH522999A/de
Priority to FR7001752A priority patent/FR2033252A7/fr
Priority to BE744625D priority patent/BE744625A/xx
Publication of NL6900945A publication Critical patent/NL6900945A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01043—Technetium [Tc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Electronic Switches (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
NL6900945A 1969-01-21 1969-01-21 NL6900945A (enrdf_load_stackoverflow)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL6900945A NL6900945A (enrdf_load_stackoverflow) 1969-01-21 1969-01-21
DE19702001312 DE2001312A1 (de) 1969-01-21 1970-01-13 Biegsame isolierende Folie mit einem Muster von Leiterbahnen
GB1288731D GB1288731A (enrdf_load_stackoverflow) 1969-01-21 1970-01-16
AU10375/70A AU1037570A (en) 1969-01-21 1970-01-16 Flexible insulating foil having a pattern of conductive tracks
JP45004747A JPS4826973B1 (enrdf_load_stackoverflow) 1969-01-21 1970-01-19
ES375616A ES375616A1 (es) 1969-01-21 1970-01-19 Una disposicion de hoja electricamente aislante, flexible.
AT45770A AT300086B (de) 1969-01-21 1970-01-19 Biegsame, elektrisch isolierende Folie, auf der ein Muster von Leiterbahnen angebracht ist
CH69070A CH522999A (de) 1969-01-21 1970-01-19 Biegsame, elektrisch isolierende Folie mit einem Muster von Leiterbahnen
FR7001752A FR2033252A7 (enrdf_load_stackoverflow) 1969-01-21 1970-01-19
BE744625D BE744625A (fr) 1969-01-21 1970-01-19 Feuille isolante souple munie d'une configuration de conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6900945A NL6900945A (enrdf_load_stackoverflow) 1969-01-21 1969-01-21

Publications (1)

Publication Number Publication Date
NL6900945A true NL6900945A (enrdf_load_stackoverflow) 1970-07-23

Family

ID=19805919

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6900945A NL6900945A (enrdf_load_stackoverflow) 1969-01-21 1969-01-21

Country Status (10)

Country Link
JP (1) JPS4826973B1 (enrdf_load_stackoverflow)
AT (1) AT300086B (enrdf_load_stackoverflow)
AU (1) AU1037570A (enrdf_load_stackoverflow)
BE (1) BE744625A (enrdf_load_stackoverflow)
CH (1) CH522999A (enrdf_load_stackoverflow)
DE (1) DE2001312A1 (enrdf_load_stackoverflow)
ES (1) ES375616A1 (enrdf_load_stackoverflow)
FR (1) FR2033252A7 (enrdf_load_stackoverflow)
GB (1) GB1288731A (enrdf_load_stackoverflow)
NL (1) NL6900945A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52159669U (enrdf_load_stackoverflow) * 1976-05-28 1977-12-03
JPS6080357A (ja) * 1983-10-08 1985-05-08 Ricoh Co Ltd 電子回路担持装置
DE3506526A1 (de) * 1985-02-25 1986-08-28 Akzo Gmbh, 5600 Wuppertal Gedrucktes schaltelement mit polyimid enthaltender deckschicht
JPH0450820A (ja) * 1990-06-14 1992-02-19 Seiko Epson Corp 配線接続装置

Also Published As

Publication number Publication date
BE744625A (fr) 1970-07-20
JPS4826973B1 (enrdf_load_stackoverflow) 1973-08-17
AU1037570A (en) 1971-07-22
GB1288731A (enrdf_load_stackoverflow) 1972-09-13
DE2001312A1 (de) 1970-07-30
ES375616A1 (es) 1972-05-16
CH522999A (de) 1972-05-15
AT300086B (de) 1972-07-10
FR2033252A7 (enrdf_load_stackoverflow) 1970-12-04

Similar Documents

Publication Publication Date Title
AU465452B2 (enrdf_load_stackoverflow)
AU450150B2 (enrdf_load_stackoverflow)
FR2033252A7 (enrdf_load_stackoverflow)
AU442375B2 (enrdf_load_stackoverflow)
CS150600B2 (enrdf_load_stackoverflow)
AU470301B1 (enrdf_load_stackoverflow)
AU5113869A (enrdf_load_stackoverflow)
AU442380B2 (enrdf_load_stackoverflow)
AU442357B2 (enrdf_load_stackoverflow)
AU442463B2 (enrdf_load_stackoverflow)
AU442538B2 (enrdf_load_stackoverflow)
AU442554B2 (enrdf_load_stackoverflow)
AU442322B2 (enrdf_load_stackoverflow)
AU442285B2 (enrdf_load_stackoverflow)
AU5133369A (enrdf_load_stackoverflow)
AU4949169A (enrdf_load_stackoverflow)
CS151217B1 (enrdf_load_stackoverflow)
CS149992B1 (enrdf_load_stackoverflow)
AU5397469A (enrdf_load_stackoverflow)
AU5228269A (enrdf_load_stackoverflow)
CS148794B1 (enrdf_load_stackoverflow)
AU4540468A (enrdf_load_stackoverflow)
AU5109569A (enrdf_load_stackoverflow)
AU5077469A (enrdf_load_stackoverflow)
AU481328A (enrdf_load_stackoverflow)