NL6818017A - - Google Patents

Info

Publication number
NL6818017A
NL6818017A NL6818017A NL6818017A NL6818017A NL 6818017 A NL6818017 A NL 6818017A NL 6818017 A NL6818017 A NL 6818017A NL 6818017 A NL6818017 A NL 6818017A NL 6818017 A NL6818017 A NL 6818017A
Authority
NL
Netherlands
Application number
NL6818017A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6818017A priority Critical patent/NL6818017A/xx
Priority to DE19691958811 priority patent/DE1958811A1/de
Priority to BR215013/69A priority patent/BR6915013D0/pt
Priority to DK656869AA priority patent/DK121806B/da
Priority to CH1844369A priority patent/CH506230A/de
Priority to GB6055569A priority patent/GB1303650A/en
Priority to AT1153769A priority patent/AT301666B/de
Priority to BE743089D priority patent/BE743089A/xx
Priority to ES374491A priority patent/ES374491A1/es
Priority to FR6943359A priority patent/FR2026186A1/fr
Publication of NL6818017A publication Critical patent/NL6818017A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
NL6818017A 1968-12-14 1968-12-14 NL6818017A (en:Method)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL6818017A NL6818017A (en:Method) 1968-12-14 1968-12-14
DE19691958811 DE1958811A1 (de) 1968-12-14 1969-11-22 Biegsame Isolierfolie mit einem Muster von Leiterbahnen
BR215013/69A BR6915013D0 (pt) 1968-12-14 1969-12-11 Folha isolante flexivel provida de configuracao de trilhas condutoras
DK656869AA DK121806B (da) 1968-12-14 1969-12-11 Fleksibel isolerende folie med et mønster af ledende baner.
CH1844369A CH506230A (de) 1968-12-14 1969-12-11 Biegsame Isolierfolie mit einem Muster von Leiterbahnen
GB6055569A GB1303650A (en:Method) 1968-12-14 1969-12-11
AT1153769A AT301666B (de) 1968-12-14 1969-12-11 Biegsame Isolierfolie, auf der ein Muster von Leiterbahnen angebracht ist
BE743089D BE743089A (en:Method) 1968-12-14 1969-12-12
ES374491A ES374491A1 (es) 1968-12-14 1969-12-12 Un dispositivo de lamina aislante flexible sobre el cual esta situado un diseno de pistas conductoras.
FR6943359A FR2026186A1 (en:Method) 1968-12-14 1969-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6818017A NL6818017A (en:Method) 1968-12-14 1968-12-14

Publications (1)

Publication Number Publication Date
NL6818017A true NL6818017A (en:Method) 1970-06-16

Family

ID=19805406

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6818017A NL6818017A (en:Method) 1968-12-14 1968-12-14

Country Status (10)

Country Link
AT (1) AT301666B (en:Method)
BE (1) BE743089A (en:Method)
BR (1) BR6915013D0 (en:Method)
CH (1) CH506230A (en:Method)
DE (1) DE1958811A1 (en:Method)
DK (1) DK121806B (en:Method)
ES (1) ES374491A1 (en:Method)
FR (1) FR2026186A1 (en:Method)
GB (1) GB1303650A (en:Method)
NL (1) NL6818017A (en:Method)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2633434C2 (de) * 1976-07-24 1981-04-30 Diehl GmbH & Co, 8500 Nürnberg Verlorener Verschlußstopfen
JPS566498A (en) * 1979-06-26 1981-01-23 Hitachi Chemical Co Ltd Method of manufacturing flexible printed circuit board
JPS60206639A (ja) * 1984-03-31 1985-10-18 日東電工株式会社 ポリイミド−金属箔複合フイルムの製造方法

Also Published As

Publication number Publication date
BE743089A (en:Method) 1970-06-12
ES374491A1 (es) 1972-01-01
AT301666B (de) 1972-09-11
DE1958811A1 (de) 1970-07-02
CH506230A (de) 1971-04-15
GB1303650A (en:Method) 1973-01-17
BR6915013D0 (pt) 1973-01-02
DK121806B (da) 1971-12-06
FR2026186A1 (en:Method) 1970-09-11

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