NL6814388A - - Google Patents
Info
- Publication number
- NL6814388A NL6814388A NL6814388A NL6814388A NL6814388A NL 6814388 A NL6814388 A NL 6814388A NL 6814388 A NL6814388 A NL 6814388A NL 6814388 A NL6814388 A NL 6814388A NL 6814388 A NL6814388 A NL 6814388A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68219367A | 1967-11-13 | 1967-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6814388A true NL6814388A (https=) | 1969-05-16 |
Family
ID=24738624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6814388A NL6814388A (https=) | 1967-11-13 | 1968-10-08 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US3550261A (https=) |
| ES (1) | ES360199A1 (https=) |
| FR (1) | FR1605395A (https=) |
| GB (1) | GB1237099A (https=) |
| NL (1) | NL6814388A (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1952216A1 (de) * | 1969-10-16 | 1971-04-29 | Siemens Ag | Verfahren zum Trennen von aus einem Halbleitergrundkoerper herzustellenden Halbleiterchips |
| US3771219A (en) * | 1970-02-05 | 1973-11-13 | Sharp Kk | Method for manufacturing semiconductor device |
| US3824678A (en) * | 1970-08-31 | 1974-07-23 | North American Rockwell | Process for laser scribing beam lead semiconductor wafers |
| US3947952A (en) * | 1970-12-28 | 1976-04-06 | Bell Telephone Laboratories, Incorporated | Method of encapsulating beam lead semiconductor devices |
| US3839781A (en) * | 1971-04-21 | 1974-10-08 | Signetics Corp | Method for discretionary scribing and breaking semiconductor wafers for yield improvement |
| US3747202A (en) * | 1971-11-22 | 1973-07-24 | Honeywell Inf Systems | Method of making beam leads on substrates |
| BE791930A (fr) * | 1971-12-02 | 1973-03-16 | Western Electric Co | Dispositif electroluminescent et procede pour sa fabrication |
| US3760238A (en) * | 1972-02-28 | 1973-09-18 | Microsystems Int Ltd | Fabrication of beam leads |
| US3838501A (en) * | 1973-02-09 | 1974-10-01 | Honeywell Inf Systems | Method in microcircuit package assembly providing nonabrasive, electrically passive edges on integrated circuit chips |
| US4086375A (en) * | 1975-11-07 | 1978-04-25 | Rockwell International Corporation | Batch process providing beam leads for microelectronic devices having metallized contact pads |
| US4685210A (en) * | 1985-03-13 | 1987-08-11 | The Boeing Company | Multi-layer circuit board bonding method utilizing noble metal coated surfaces |
| GB2208453B (en) * | 1987-08-24 | 1991-11-20 | Marconi Electronic Devices | Capacitors |
| US5756370A (en) * | 1996-02-08 | 1998-05-26 | Micron Technology, Inc. | Compliant contact system with alignment structure for testing unpackaged semiconductor dice |
| US6713374B2 (en) * | 1999-07-30 | 2004-03-30 | Formfactor, Inc. | Interconnect assemblies and methods |
| US7435108B1 (en) | 1999-07-30 | 2008-10-14 | Formfactor, Inc. | Variable width resilient conductive contact structures |
| US6882048B2 (en) * | 2001-03-30 | 2005-04-19 | Dainippon Printing Co., Ltd. | Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
| US6759311B2 (en) * | 2001-10-31 | 2004-07-06 | Formfactor, Inc. | Fan out of interconnect elements attached to semiconductor wafer |
| US8236613B2 (en) * | 2010-05-24 | 2012-08-07 | Alpha & Omega Semiconductor Inc. | Wafer level chip scale package method using clip array |
| WO2013087101A1 (en) * | 2011-12-14 | 2013-06-20 | Reinhardt Microtech Gmbh | Substrate-supported circuit parts with free-standing three-dimensional structures |
-
0
- US US355026D patent/USB355026I5/en active Pending
-
1967
- 1967-11-13 US US682193A patent/US3550261A/en not_active Expired - Lifetime
-
1968
- 1968-09-04 GB GB42135/68A patent/GB1237099A/en not_active Expired
- 1968-10-04 FR FR168751A patent/FR1605395A/fr not_active Expired
- 1968-10-08 NL NL6814388A patent/NL6814388A/xx not_active Application Discontinuation
- 1968-11-13 ES ES360199A patent/ES360199A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1804349A1 (de) | 1969-06-19 |
| FR1605395A (https=) | 1975-02-28 |
| USB355026I5 (https=) | |
| US3550261A (en) | 1970-12-29 |
| DE1804349B2 (de) | 1975-09-11 |
| ES360199A1 (es) | 1970-10-16 |
| GB1237099A (en) | 1971-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BV | The patent application has lapsed |