|
DE1952216A1
(de)
*
|
1969-10-16 |
1971-04-29 |
Siemens Ag |
Verfahren zum Trennen von aus einem Halbleitergrundkoerper herzustellenden Halbleiterchips
|
|
US3771219A
(en)
*
|
1970-02-05 |
1973-11-13 |
Sharp Kk |
Method for manufacturing semiconductor device
|
|
US3824678A
(en)
*
|
1970-08-31 |
1974-07-23 |
North American Rockwell |
Process for laser scribing beam lead semiconductor wafers
|
|
US3947952A
(en)
*
|
1970-12-28 |
1976-04-06 |
Bell Telephone Laboratories, Incorporated |
Method of encapsulating beam lead semiconductor devices
|
|
US3839781A
(en)
*
|
1971-04-21 |
1974-10-08 |
Signetics Corp |
Method for discretionary scribing and breaking semiconductor wafers for yield improvement
|
|
US3747202A
(en)
*
|
1971-11-22 |
1973-07-24 |
Honeywell Inf Systems |
Method of making beam leads on substrates
|
|
BE791930A
(fr)
*
|
1971-12-02 |
1973-03-16 |
Western Electric Co |
Dispositif electroluminescent et procede pour sa fabrication
|
|
US3760238A
(en)
*
|
1972-02-28 |
1973-09-18 |
Microsystems Int Ltd |
Fabrication of beam leads
|
|
US3838501A
(en)
*
|
1973-02-09 |
1974-10-01 |
Honeywell Inf Systems |
Method in microcircuit package assembly providing nonabrasive, electrically passive edges on integrated circuit chips
|
|
US4086375A
(en)
*
|
1975-11-07 |
1978-04-25 |
Rockwell International Corporation |
Batch process providing beam leads for microelectronic devices having metallized contact pads
|
|
US4685210A
(en)
*
|
1985-03-13 |
1987-08-11 |
The Boeing Company |
Multi-layer circuit board bonding method utilizing noble metal coated surfaces
|
|
GB2208453B
(en)
*
|
1987-08-24 |
1991-11-20 |
Marconi Electronic Devices |
Capacitors
|
|
US5756370A
(en)
*
|
1996-02-08 |
1998-05-26 |
Micron Technology, Inc. |
Compliant contact system with alignment structure for testing unpackaged semiconductor dice
|
|
US7435108B1
(en)
*
|
1999-07-30 |
2008-10-14 |
Formfactor, Inc. |
Variable width resilient conductive contact structures
|
|
US6713374B2
(en)
*
|
1999-07-30 |
2004-03-30 |
Formfactor, Inc. |
Interconnect assemblies and methods
|
|
US6882048B2
(en)
*
|
2001-03-30 |
2005-04-19 |
Dainippon Printing Co., Ltd. |
Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area
|
|
US6759311B2
(en)
*
|
2001-10-31 |
2004-07-06 |
Formfactor, Inc. |
Fan out of interconnect elements attached to semiconductor wafer
|
|
US8236613B2
(en)
*
|
2010-05-24 |
2012-08-07 |
Alpha & Omega Semiconductor Inc. |
Wafer level chip scale package method using clip array
|
|
WO2013087101A1
(en)
*
|
2011-12-14 |
2013-06-20 |
Reinhardt Microtech Gmbh |
Substrate-supported circuit parts with free-standing three-dimensional structures
|