NL6810881A - - Google Patents

Info

Publication number
NL6810881A
NL6810881A NL6810881A NL6810881A NL6810881A NL 6810881 A NL6810881 A NL 6810881A NL 6810881 A NL6810881 A NL 6810881A NL 6810881 A NL6810881 A NL 6810881A NL 6810881 A NL6810881 A NL 6810881A
Authority
NL
Netherlands
Application number
NL6810881A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6810881A publication Critical patent/NL6810881A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
NL6810881A 1967-08-04 1968-07-31 NL6810881A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB35952/67A GB1219570A (en) 1967-08-04 1967-08-04 Diode units

Publications (1)

Publication Number Publication Date
NL6810881A true NL6810881A (enExample) 1969-02-06

Family

ID=10383324

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6810881A NL6810881A (enExample) 1967-08-04 1968-07-31

Country Status (4)

Country Link
US (1) US3548267A (enExample)
FR (1) FR1576776A (enExample)
GB (1) GB1219570A (enExample)
NL (1) NL6810881A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2118356A1 (de) * 1971-04-15 1972-10-26 Siemens AG, 1000 Berlin u. 8000 München Scheibenförmiges Halbleiterbauelement
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
US3992717A (en) * 1974-06-21 1976-11-16 Westinghouse Electric Corporation Housing for a compression bonded encapsulation of a semiconductor device
JPS5871633A (ja) * 1981-10-23 1983-04-28 Toshiba Corp 圧接型半導体装置
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Icカードの製造方法およびicカード

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1774814A (en) * 1924-04-07 1930-09-02 Cleveland Trust Co Liquid-level-operated rheostat
US1672123A (en) * 1925-03-06 1928-06-05 Atwater Kent Mfg Co Switch member and method of producing the same
US2798137A (en) * 1953-08-31 1957-07-02 Beckman Instruments Inc Potentiometer and contact therefor
US2814705A (en) * 1954-04-23 1957-11-26 Clarostat Mfg Co Inc Control assembly and contact
US3066248A (en) * 1958-12-16 1962-11-27 Sarkes Tarzian Semiconductor device
US3300841A (en) * 1962-07-17 1967-01-31 Texas Instruments Inc Method of junction passivation and product

Also Published As

Publication number Publication date
GB1219570A (en) 1971-01-20
US3548267A (en) 1970-12-15
FR1576776A (enExample) 1969-08-01

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