NL6810881A - - Google Patents
Info
- Publication number
- NL6810881A NL6810881A NL6810881A NL6810881A NL6810881A NL 6810881 A NL6810881 A NL 6810881A NL 6810881 A NL6810881 A NL 6810881A NL 6810881 A NL6810881 A NL 6810881A NL 6810881 A NL6810881 A NL 6810881A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB35952/67A GB1219570A (en) | 1967-08-04 | 1967-08-04 | Diode units |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6810881A true NL6810881A (cg-RX-API-DMAC7.html) | 1969-02-06 |
Family
ID=10383324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6810881A NL6810881A (cg-RX-API-DMAC7.html) | 1967-08-04 | 1968-07-31 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3548267A (cg-RX-API-DMAC7.html) |
| FR (1) | FR1576776A (cg-RX-API-DMAC7.html) |
| GB (1) | GB1219570A (cg-RX-API-DMAC7.html) |
| NL (1) | NL6810881A (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2118356A1 (de) * | 1971-04-15 | 1972-10-26 | Siemens AG, 1000 Berlin u. 8000 München | Scheibenförmiges Halbleiterbauelement |
| US3763403A (en) * | 1972-03-01 | 1973-10-02 | Gen Electric | Isolated heat-sink semiconductor device |
| US3992717A (en) * | 1974-06-21 | 1976-11-16 | Westinghouse Electric Corporation | Housing for a compression bonded encapsulation of a semiconductor device |
| JPS5871633A (ja) * | 1981-10-23 | 1983-04-28 | Toshiba Corp | 圧接型半導体装置 |
| JP2560895B2 (ja) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | Ｉｃカードの製造方法およびｉｃカード |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1774814A (en) * | 1924-04-07 | 1930-09-02 | Cleveland Trust Co | Liquid-level-operated rheostat |
| US1672123A (en) * | 1925-03-06 | 1928-06-05 | Atwater Kent Mfg Co | Switch member and method of producing the same |
| US2798137A (en) * | 1953-08-31 | 1957-07-02 | Beckman Instruments Inc | Potentiometer and contact therefor |
| US2814705A (en) * | 1954-04-23 | 1957-11-26 | Clarostat Mfg Co Inc | Control assembly and contact |
| US3066248A (en) * | 1958-12-16 | 1962-11-27 | Sarkes Tarzian | Semiconductor device |
| US3300841A (en) * | 1962-07-17 | 1967-01-31 | Texas Instruments Inc | Method of junction passivation and product |
-
1967
- 1967-08-04 GB GB35952/67A patent/GB1219570A/en not_active Expired
-
1968
- 1968-07-16 US US745306A patent/US3548267A/en not_active Expired - Lifetime
- 1968-07-31 NL NL6810881A patent/NL6810881A/xx unknown
- 1968-08-01 FR FR1576776D patent/FR1576776A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1219570A (en) | 1971-01-20 |
| FR1576776A (cg-RX-API-DMAC7.html) | 1969-08-01 |
| US3548267A (en) | 1970-12-15 |