GB1257033A
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*
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1968-07-10 |
1971-12-15 |
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US3668044A
(en)
*
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1970-04-09 |
1972-06-06 |
Teledyne Inc |
Apparatus for bonding semi-conductive devices
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US3725186A
(en)
*
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1970-11-25 |
1973-04-03 |
Nat Beryllia Corp |
Composite ceramic articles
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US3747210A
(en)
*
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1971-09-13 |
1973-07-24 |
Int Standard Electric Corp |
Method of producing terminal pins of a printed circuit board
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JPS4855347U
(xx)
*
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1971-10-29 |
1973-07-16 |
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US3893230A
(en)
*
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1971-11-15 |
1975-07-08 |
Ford Motor Co |
Method of manufacture of an exhaust gas sensor for an air-fuel ratio sensing system
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US3765082A
(en)
*
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1972-09-20 |
1973-10-16 |
San Fernando Electric Mfg |
Method of making an inductor chip
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US3834604A
(en)
*
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1972-10-03 |
1974-09-10 |
Western Electric Co |
Apparatus for solid-phase bonding mating members through an interposed pre-shaped compliant medium
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(en)
*
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1972-12-20 |
1975-07-22 |
Exxon Research Engineering Co |
Process for the formation of beta alumina-type ceramics
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DE2306236C2
(de)
*
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1973-02-08 |
1982-11-25 |
Siemens AG, 1000 Berlin und 8000 München |
Verfahren zur Herstellung von Schichtschaltungen mit leitenden Schichten auf beiden Seiten eines Keramiksubstrates
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*
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1973-02-09 |
1975-06-10 |
Kennametal Inc |
Method of centrifugally compacting granular material using a destructible mold
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US3926746A
(en)
*
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1973-10-04 |
1975-12-16 |
Minnesota Mining & Mfg |
Electrical interconnection for metallized ceramic arrays
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(en)
*
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1973-12-13 |
1976-04-06 |
International Business Machines Corporation |
Method for metallizing ceramic green sheets
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*
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1973-12-14 |
1975-08-12 |
Ibm |
Process for forming a ceramic substrate
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JPS5427238B2
(xx)
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1974-12-13 |
1979-09-08 |
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FR2296988A1
(fr)
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1974-12-31 |
1976-07-30 |
Ibm France |
Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
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1975-12-31 |
1980-08-12 |
Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) |
Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
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US4064552A
(en)
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1976-02-03 |
1977-12-20 |
Angelucci Thomas L |
Multilayer flexible printed circuit tape
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JPS5382170A
(en)
*
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1976-12-28 |
1978-07-20 |
Ngk Insulators Ltd |
Method of producing coupled type ic ceramic package
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(en)
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1977-05-20 |
1978-08-01 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
Application of semiconductor diffusants to solar cells by screen printing
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EP0006444B1
(de)
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1978-06-23 |
1982-12-22 |
International Business Machines Corporation |
Vielschichtiges, dielektrisches Substrat
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GB2033147B
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1978-09-21 |
1982-12-15 |
Tokyo Shibaura Electric Co |
Method for production of composite piezoelectric material
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JPS5555556A
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1978-09-29 |
1980-04-23 |
Hakutou Kk |
Device for adhering non-conductivity tape having plating hole to metallic tape blank
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JPS55100269A
(en)
*
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1979-01-25 |
1980-07-31 |
Ngk Insulators Ltd |
Production of cordierite type ceramic honeycomb structure
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1979-11-05 |
1981-08-25 |
Solid Photography Inc. |
Method and apparatus for producing planar elements in the construction of surfaces and bodies
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US4345955A
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1980-10-28 |
1982-08-24 |
E. I. Du Pont De Nemours And Company |
Process for manufacturing multilayer ceramic chip carrier modules
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(en)
*
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1980-11-14 |
1985-10-22 |
Analog Devices, Incorporated |
Method of manufacture of miniaturized transformer
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1981-03-20 |
1982-07-20 |
International Business Machines Corporation |
Process for forming refractory metal layers on ceramic substrate
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1981-04-10 |
1984-02-28 |
International Business Machines Corporation |
Pinned ceramic substrate
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JPS6038868B2
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1981-11-06 |
1985-09-03 |
富士通株式会社 |
半導体パツケ−ジ
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EP0092971B1
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1982-04-27 |
1989-08-16 |
Richardson Chemical Company |
Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
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1982-10-04 |
1984-07-24 |
General Electric Ceramics, Inc. |
Method for preparing ceramic articles having raised, selectively metallized electrical contact points
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1983-06-16 |
1985-12-03 |
Cts Corporation |
Porcelain tape for producing porcelainized metal substrates
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1983-06-20 |
1986-07-08 |
International Business Machines Corporation |
Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate
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1983-06-24 |
1986-05-06 |
Materials Research Corporation |
Method of making ceramic tapes
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FR2556503B1
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1983-12-08 |
1986-12-12 |
Eurofarad |
Substrat d'interconnexion en alumine pour composant electronique
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1983-12-12 |
1985-07-02 |
International Business Machines Corporation |
Metallization of a ceramic substrate
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1983-12-12 |
1985-09-03 |
International Business Machines Corporation |
Forming multilayer ceramic substrates from large area green sheets
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1984-05-21 |
1986-02-25 |
Ctx Corporation |
Method of making an electrically insulative substrate
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1984-10-30 |
1986-04-15 |
International Business Machines Corporation |
Diffusion isolation layer for maskless cladding process
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1986-11-10 |
1988-11-22 |
Coors Porcelain Company |
Method for producing cast tape finish on a dry-pressed substrate
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WO1988005959A1
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1987-02-04 |
1988-08-11 |
Coors Porcelain Company |
Ceramic substrate with conductively-filled vias and method for producing
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1988-01-28 |
1995-02-28 |
Mcdonnell Douglas Corporation |
Production of silica "green" tape and co-fired silica substrates therefrom
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DE3810992A1
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1988-03-31 |
1989-10-12 |
Hoechst Ceram Tec Ag |
Verfahren und vorrichtung zum plattieren von pin-grid-arrays
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1988-06-29 |
1991-02-05 |
Ushio Co. Ltd. |
Punch press for piercing green sheet with liner
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JPH02124295A
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1988-10-28 |
1990-05-11 |
Ushio Kk |
多軸穿孔装置
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EP0367185B1
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1988-10-31 |
1994-07-06 |
Ushio Co. Limited |
Multiple piercing apparatus and method
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1988-10-31 |
1989-07-11 |
Hamilton Standard Controls, Inc. |
Method of making a resistive element
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1989-12-19 |
1994-01-11 |
Fujitsu Limited |
Semiconductor device having improved adhesive structure and method of producing same
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GB9002986D0
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1990-02-09 |
1990-04-04 |
Ici Plc |
Ceramic product
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KR920002589B1
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1990-03-30 |
1992-03-30 |
삼성코닝 주식회사 |
금속 인쇄된 세라믹 팩키지의 제조방법
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1990-05-09 |
1995-08-01 |
Joseph B. Taphorn |
Green sheet manufacturing methods and apparatuses
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JPH07123098B2
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1990-07-13 |
1995-12-25 |
株式会社村田製作所 |
セラミック積層体の製造方法および装置
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1990-07-13 |
1993-07-06 |
Murata Manufacturing Co., Ltd. |
Apparatus for manufacturing ceramic capacitors
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JP2704562B2
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1990-07-19 |
1998-01-26 |
株式会社村田製作所 |
積層セラミックコンデンサの製造方法
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1990-08-03 |
1992-04-28 |
Cts Corporation |
Optic interface hybrid
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DE4240812A1
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1992-12-04 |
1994-06-09 |
Bosch Gmbh Robert |
Heizeranordnung für einen Meßfühler zur Bestimmung von Bestandteilen in Gasen
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1993-10-28 |
1997-01-07 |
International Business Machines Corporation |
Solder ball interconnected assembly
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1993-11-18 |
1998-01-20 |
Mcdonnell Douglas Corporation |
Preparation of sputtering targets
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1994-01-07 |
1995-12-12 |
International Business Machines Corporation |
Process for surface mounting flip chip carrier modules
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1995-03-10 |
1997-09-23 |
Lam Research Corporation |
Multilayered electrostatic chuck and method of manufacture thereof
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1995-06-05 |
1997-03-04 |
Smith International, Inc. |
Drill bit and cutting structure having enhanced placement and sizing of cutters for improved bit stabilization
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1995-09-13 |
1998-12-15 |
Hughes Electronics Corporation |
Multilayer electronic structure and its preparation
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1995-10-03 |
1998-10-06 |
Dow-United Technologies Composite Products, Inc. |
Method for precision preforming of complex composite articles
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1996-04-10 |
2002-05-21 |
Smith International, Inc. |
Rolling cone bit with gage and off-gage cutter elements positioned to separate sidewall and bottom hole cutting duty
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1996-06-21 |
1999-10-19 |
Smith International, Inc. |
Rolling cone bit having gage and nestled gage cutter elements having enhancements in materials and geometry to optimize borehole corner cutting duty
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1998-02-19 |
2001-04-01 |
Teijin Ltd |
Method and apparatus for producing laminated type electronic component
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TWI448370B
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2009-06-04 |
2014-08-11 |
Au Optronics Corp |
沖切機台及定位沖切方法
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2011-10-04 |
2013-04-12 |
삼성디스플레이 주식회사 |
인쇄 회로 필름 모재 제조 방법 및 상기 인쇄 회로 필름을 타발하는 장치
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2012-10-22 |
2017-10-10 |
Imerys Ceramics France |
Proceso para elaborar una lámina inorgánica
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