NL6806852A - - Google Patents

Info

Publication number
NL6806852A
NL6806852A NL6806852A NL6806852A NL6806852A NL 6806852 A NL6806852 A NL 6806852A NL 6806852 A NL6806852 A NL 6806852A NL 6806852 A NL6806852 A NL 6806852A NL 6806852 A NL6806852 A NL 6806852A
Authority
NL
Netherlands
Application number
NL6806852A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6806852A publication Critical patent/NL6806852A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
NL6806852A 1967-05-15 1968-05-15 NL6806852A (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63853667A 1967-05-15 1967-05-15

Publications (1)

Publication Number Publication Date
NL6806852A true NL6806852A (cg-RX-API-DMAC7.html) 1968-11-18

Family

ID=24560432

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6806852A NL6806852A (cg-RX-API-DMAC7.html) 1967-05-15 1968-05-15

Country Status (9)

Country Link
US (1) US3489952A (cg-RX-API-DMAC7.html)
BE (1) BE715204A (cg-RX-API-DMAC7.html)
CH (1) CH472120A (cg-RX-API-DMAC7.html)
DE (1) DE1766392A1 (cg-RX-API-DMAC7.html)
ES (1) ES367720A1 (cg-RX-API-DMAC7.html)
FR (1) FR1578928A (cg-RX-API-DMAC7.html)
GB (1) GB1165854A (cg-RX-API-DMAC7.html)
NL (1) NL6806852A (cg-RX-API-DMAC7.html)
SE (1) SE334654B (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604099A (en) * 1969-08-18 1971-09-14 Western Electric Co Methods of and apparatus for bonding leaded devices to substrates
US3672046A (en) * 1970-01-14 1972-06-27 Technitrol Inc The method of making an electrical component
US3919602A (en) * 1972-03-23 1975-11-11 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US3959874A (en) * 1974-12-20 1976-06-01 Western Electric Company, Inc. Method of forming an integrated circuit assembly
US4392181A (en) * 1981-05-01 1983-07-05 Western Electric Company, Inc. Circuit board and contact assemblies
US4514784A (en) * 1983-04-22 1985-04-30 Cray Research, Inc. Interconnected multiple circuit module
US4559272A (en) * 1984-05-09 1985-12-17 Hughes Aircraft Company Heat curable polyglycidyl aromatic amine encapsulants
US4780795A (en) * 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
US5444600A (en) * 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
US7927920B2 (en) * 2007-02-15 2011-04-19 Headway Technologies, Inc. Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package
US7816176B2 (en) * 2007-05-29 2010-10-19 Headway Technologies, Inc. Method of manufacturing electronic component package
DE102009001371A1 (de) * 2009-03-06 2010-09-09 Hilti Aktiengesellschaft Handgeführtes Eintreibgerät
US8310835B2 (en) * 2009-07-14 2012-11-13 Apple Inc. Systems and methods for providing vias through a modular component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2629802A (en) * 1951-12-07 1953-02-24 Rca Corp Photocell amplifier construction
US3029495A (en) * 1959-04-06 1962-04-17 Norman J Doctor Electrical interconnection of miniaturized modules
GB1058296A (en) * 1963-06-28 1967-02-08 Rca Corp Composite insulator-semiconductor wafer and method of making same
US3290753A (en) * 1963-08-19 1966-12-13 Bell Telephone Labor Inc Method of making semiconductor integrated circuit elements
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3312871A (en) * 1964-12-23 1967-04-04 Ibm Interconnection arrangement for integrated circuits
US3457123A (en) * 1965-06-28 1969-07-22 Motorola Inc Methods for making semiconductor structures having glass insulated islands

Also Published As

Publication number Publication date
SE334654B (cg-RX-API-DMAC7.html) 1971-05-03
CH472120A (fr) 1969-04-30
FR1578928A (cg-RX-API-DMAC7.html) 1969-08-22
ES367720A1 (es) 1971-04-16
BE715204A (cg-RX-API-DMAC7.html) 1968-09-30
GB1165854A (en) 1969-10-01
US3489952A (en) 1970-01-13
DE1766392A1 (de) 1971-07-22

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