NL6802104A - - Google Patents

Info

Publication number
NL6802104A
NL6802104A NL6802104A NL6802104A NL6802104A NL 6802104 A NL6802104 A NL 6802104A NL 6802104 A NL6802104 A NL 6802104A NL 6802104 A NL6802104 A NL 6802104A NL 6802104 A NL6802104 A NL 6802104A
Authority
NL
Netherlands
Application number
NL6802104A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6802104A publication Critical patent/NL6802104A/xx

Links

Classifications

    • H10W72/30—
    • H10P95/00—
    • H10W72/073—
    • H10W72/07336—
NL6802104A 1967-02-27 1968-02-14 NL6802104A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61863867A 1967-02-27 1967-02-27

Publications (1)

Publication Number Publication Date
NL6802104A true NL6802104A (cg-RX-API-DMAC10.html) 1968-08-28

Family

ID=24478504

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6802104A NL6802104A (cg-RX-API-DMAC10.html) 1967-02-27 1968-02-14

Country Status (4)

Country Link
BE (1) BE711076A (cg-RX-API-DMAC10.html)
FR (1) FR1555176A (cg-RX-API-DMAC10.html)
GB (1) GB1149606A (cg-RX-API-DMAC10.html)
NL (1) NL6802104A (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586143A (ja) * 1981-07-02 1983-01-13 Matsushita Electronics Corp 半導体装置
GB2102833B (en) * 1981-07-31 1984-08-01 Philips Electronic Associated Lead-indium-silver alloy for use in semiconductor devices
JPS60119777A (ja) * 1983-11-30 1985-06-27 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ
CH662007A5 (en) * 1983-12-21 1987-08-31 Bbc Brown Boveri & Cie Method of soldering semiconductor components
DE19606101A1 (de) * 1996-02-19 1997-08-21 Siemens Ag Halbleiterkörper mit Lotmaterialschicht
JP2002118202A (ja) * 2000-10-05 2002-04-19 Sanyo Electric Co Ltd 放熱基板および半導体モジュール
JP2007194514A (ja) 2006-01-23 2007-08-02 Mitsubishi Electric Corp 半導体装置の製造方法
CN119133096B (zh) * 2024-09-12 2025-02-28 江南大学 一种铜-铝或铝-铝的互连结构及方法

Also Published As

Publication number Publication date
GB1149606A (en) 1969-04-23
BE711076A (cg-RX-API-DMAC10.html) 1968-08-21
FR1555176A (cg-RX-API-DMAC10.html) 1969-01-24

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