NL6802061A - - Google Patents

Info

Publication number
NL6802061A
NL6802061A NL6802061A NL6802061A NL6802061A NL 6802061 A NL6802061 A NL 6802061A NL 6802061 A NL6802061 A NL 6802061A NL 6802061 A NL6802061 A NL 6802061A NL 6802061 A NL6802061 A NL 6802061A
Authority
NL
Netherlands
Application number
NL6802061A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6802061A priority Critical patent/NL6802061A/xx
Priority to GB1258942D priority patent/GB1258942A/en
Priority to CH199369A priority patent/CH496815A/de
Priority to CH199469A priority patent/CH491499A/de
Priority to GB1251757D priority patent/GB1251757A/en
Priority to DE19691906727 priority patent/DE1906727A1/de
Priority to DE19691906726 priority patent/DE1906726A1/de
Priority to FR6903432A priority patent/FR2001819A1/fr
Priority to BE728374D priority patent/BE728374A/xx
Priority to BE728375D priority patent/BE728375A/xx
Priority to FR6903433A priority patent/FR2001820A1/fr
Publication of NL6802061A publication Critical patent/NL6802061A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
NL6802061A 1968-02-13 1968-02-13 NL6802061A (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
NL6802061A NL6802061A (ja) 1968-02-13 1968-02-13
GB1258942D GB1258942A (ja) 1968-02-13 1969-02-10
CH199369A CH496815A (de) 1968-02-13 1969-02-10 Verfahren zur Herstellung einer Halbleiteranordnung mit mindestens einem Halbleiterkörper, der mit einem oder mehreren starren Leitern versehen ist, Vorrichtung zur Ausführung des Verfahrens und nach dem Verfahren hergestellte Halbleiteranordnung
CH199469A CH491499A (de) 1968-02-13 1969-02-10 Halbleiteranordnung mit mindestens einem Halbleiterkörper, der mit einem oder mehreren starren Leitern versehen ist
GB1251757D GB1251757A (ja) 1968-02-13 1969-02-10
DE19691906727 DE1906727A1 (de) 1968-02-13 1969-02-11 Halbleitervorrichtung mit einem oder mehreren Halbleiterkoerpern und aus einem solchen Koerper seitlich hinausragenden starren Leitern
DE19691906726 DE1906726A1 (de) 1968-02-13 1969-02-11 Verfahren und Vorrichtung zur Herstellung von Halbleiteranordnungen mit einer oder mehreren starren Leitern,die seitlich aus einem Halbleiterkoerper hinausragen und Halbleiteranordnung,die mit Verwendung dieses Verfahrens hergestellt ist
FR6903432A FR2001819A1 (fr) 1968-02-13 1969-02-13 Procede et appareil pour la fabrication de dispositifs semi-conducteurs
BE728374D BE728374A (ja) 1968-02-13 1969-02-13
BE728375D BE728375A (ja) 1968-02-13 1969-02-13
FR6903433A FR2001820A1 (fr) 1968-02-13 1969-02-13 Dispositif electronique comportant au moins un corps semi-conducteur et des conducteurs rigides faisant saillie lateralement par rapport audit corps

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6802061A NL6802061A (ja) 1968-02-13 1968-02-13

Publications (1)

Publication Number Publication Date
NL6802061A true NL6802061A (ja) 1969-08-15

Family

ID=19802752

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6802061A NL6802061A (ja) 1968-02-13 1968-02-13

Country Status (1)

Country Link
NL (1) NL6802061A (ja)

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