NL6802060A - - Google Patents
Info
- Publication number
- NL6802060A NL6802060A NL6802060A NL6802060A NL6802060A NL 6802060 A NL6802060 A NL 6802060A NL 6802060 A NL6802060 A NL 6802060A NL 6802060 A NL6802060 A NL 6802060A NL 6802060 A NL6802060 A NL 6802060A
- Authority
- NL
- Netherlands
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6802060A NL6802060A (ja) | 1968-02-13 | 1968-02-13 | |
GB1258942D GB1258942A (ja) | 1968-02-13 | 1969-02-10 | |
CH199369A CH496815A (de) | 1968-02-13 | 1969-02-10 | Verfahren zur Herstellung einer Halbleiteranordnung mit mindestens einem Halbleiterkörper, der mit einem oder mehreren starren Leitern versehen ist, Vorrichtung zur Ausführung des Verfahrens und nach dem Verfahren hergestellte Halbleiteranordnung |
CH199469A CH491499A (de) | 1968-02-13 | 1969-02-10 | Halbleiteranordnung mit mindestens einem Halbleiterkörper, der mit einem oder mehreren starren Leitern versehen ist |
GB1251757D GB1251757A (ja) | 1968-02-13 | 1969-02-10 | |
DE19691906727 DE1906727A1 (de) | 1968-02-13 | 1969-02-11 | Halbleitervorrichtung mit einem oder mehreren Halbleiterkoerpern und aus einem solchen Koerper seitlich hinausragenden starren Leitern |
DE19691906726 DE1906726A1 (de) | 1968-02-13 | 1969-02-11 | Verfahren und Vorrichtung zur Herstellung von Halbleiteranordnungen mit einer oder mehreren starren Leitern,die seitlich aus einem Halbleiterkoerper hinausragen und Halbleiteranordnung,die mit Verwendung dieses Verfahrens hergestellt ist |
FR6903432A FR2001819A1 (fr) | 1968-02-13 | 1969-02-13 | Procede et appareil pour la fabrication de dispositifs semi-conducteurs |
BE728374D BE728374A (ja) | 1968-02-13 | 1969-02-13 | |
BE728375D BE728375A (ja) | 1968-02-13 | 1969-02-13 | |
FR6903433A FR2001820A1 (fr) | 1968-02-13 | 1969-02-13 | Dispositif electronique comportant au moins un corps semi-conducteur et des conducteurs rigides faisant saillie lateralement par rapport audit corps |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6802060A NL6802060A (ja) | 1968-02-13 | 1968-02-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6802060A true NL6802060A (ja) | 1969-08-15 |
Family
ID=19802751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6802060A NL6802060A (ja) | 1968-02-13 | 1968-02-13 |
Country Status (1)
Country | Link |
---|---|
NL (1) | NL6802060A (ja) |
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1968
- 1968-02-13 NL NL6802060A patent/NL6802060A/xx unknown