NL6714670A - - Google Patents

Info

Publication number
NL6714670A
NL6714670A NL6714670A NL6714670A NL6714670A NL 6714670 A NL6714670 A NL 6714670A NL 6714670 A NL6714670 A NL 6714670A NL 6714670 A NL6714670 A NL 6714670A NL 6714670 A NL6714670 A NL 6714670A
Authority
NL
Netherlands
Application number
NL6714670A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6714670A publication Critical patent/NL6714670A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
NL6714670A 1966-12-30 1967-10-27 NL6714670A (xx)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US60634866A 1966-12-30 1966-12-30
US60606466A 1966-12-30 1966-12-30
US79186269A 1969-01-02 1969-01-02

Publications (1)

Publication Number Publication Date
NL6714670A true NL6714670A (xx) 1968-07-01

Family

ID=27416936

Family Applications (2)

Application Number Title Priority Date Filing Date
NL6714670A NL6714670A (xx) 1966-12-30 1967-10-27
NL6714669A NL6714669A (xx) 1966-12-30 1967-10-27

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL6714669A NL6714669A (xx) 1966-12-30 1967-10-27

Country Status (5)

Country Link
US (2) US3434020A (xx)
DE (2) DE1789106A1 (xx)
GB (3) GB1203087A (xx)
MY (2) MY7300372A (xx)
NL (2) NL6714670A (xx)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7038290B1 (en) * 1965-09-28 2006-05-02 Li Chou H Integrated circuit device
US5696402A (en) * 1965-09-28 1997-12-09 Li; Chou H. Integrated circuit device
US6849918B1 (en) * 1965-09-28 2005-02-01 Chou H. Li Miniaturized dielectrically isolated solid state device
US3643232A (en) * 1967-06-05 1972-02-15 Texas Instruments Inc Large-scale integration of electronic systems in microminiature form
GB1243247A (en) * 1968-03-04 1971-08-18 Texas Instruments Inc Ohmic contact and electrical interconnection system for electronic devices
US3486126A (en) * 1968-11-15 1969-12-23 Us Army High performance, wide band, vhf-uhf amplifier
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same
US3754168A (en) * 1970-03-09 1973-08-21 Texas Instruments Inc Metal contact and interconnection system for nonhermetic enclosed semiconductor devices
US3654526A (en) * 1970-05-19 1972-04-04 Texas Instruments Inc Metallization system for semiconductors
US3668484A (en) * 1970-10-28 1972-06-06 Rca Corp Semiconductor device with multi-level metalization and method of making the same
US3694700A (en) * 1971-02-19 1972-09-26 Nasa Integrated circuit including field effect transistor and cerment resistor
US3795975A (en) * 1971-12-17 1974-03-12 Hughes Aircraft Co Multi-level large scale complex integrated circuit having functional interconnected circuit routed to master patterns
US4631569A (en) * 1971-12-22 1986-12-23 Hughes Aircraft Company Means and method of reducing the number of masks utilized in fabricating complex multi-level integrated circuits
US4309811A (en) * 1971-12-23 1982-01-12 Hughes Aircraft Company Means and method of reducing the number of masks utilized in fabricating complex multilevel integrated circuits
FR2188304B1 (xx) * 1972-06-15 1977-07-22 Commissariat Energie Atomique
US3833919A (en) * 1972-10-12 1974-09-03 Ncr Multilevel conductor structure and method
US3877051A (en) * 1972-10-18 1975-04-08 Ibm Multilayer insulation integrated circuit structure
US4234888A (en) * 1973-07-26 1980-11-18 Hughes Aircraft Company Multi-level large scale complex integrated circuit having functional interconnected circuit routed to master patterns
DE2435371A1 (de) * 1974-07-23 1976-02-05 Siemens Ag Integrierte halbleiteranordnung
US3969751A (en) * 1974-12-18 1976-07-13 Rca Corporation Light shield for a semiconductor device comprising blackened photoresist
US3963354A (en) * 1975-05-05 1976-06-15 Bell Telephone Laboratories, Incorporated Inspection of masks and wafers by image dissection
US4342957A (en) * 1980-03-28 1982-08-03 Honeywell Information Systems Inc. Automatic test equipment test probe contact isolation detection apparatus and method
EP0077813B1 (en) * 1981-05-04 1986-02-05 Motorola, Inc. Low resistivity composite metallization for semiconductor devices and method therefor
DE4307182C2 (de) * 1993-03-08 1997-02-20 Inst Physikalische Hochtech Ev Passivierungsschichten zum Schutz funktionstragender Schichten von Bauelementen und Verfahren zu ihrer Herstellung
US20040144999A1 (en) * 1995-06-07 2004-07-29 Li Chou H. Integrated circuit device
US20050235598A1 (en) * 2001-10-23 2005-10-27 Andrew Liggins Wall construction method
NZ533315A (en) * 2001-11-28 2007-07-27 James Hardie Int Finance Bv Trough-edge building panel and method of manufacture
JP4351869B2 (ja) * 2003-06-10 2009-10-28 隆 河東田 半導体を用いた電子デバイス
WO2006039762A1 (en) * 2004-10-14 2006-04-20 James Hardie International Finance B.V. Cavity wall system
US8835310B2 (en) * 2012-12-21 2014-09-16 Intermolecular, Inc. Two step deposition of molybdenum dioxide electrode for high quality dielectric stacks

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290565A (en) * 1963-10-24 1966-12-06 Philco Corp Glass enclosed, passivated semiconductor with contact means of alternate layers of chromium, silver and chromium
US3370207A (en) * 1964-02-24 1968-02-20 Gen Electric Multilayer contact system for semiconductor devices including gold and copper layers
US3325702A (en) * 1964-04-21 1967-06-13 Texas Instruments Inc High temperature electrical contacts for silicon devices
US3290570A (en) * 1964-04-28 1966-12-06 Texas Instruments Inc Multilevel expanded metallic contacts for semiconductor devices
US3341753A (en) * 1964-10-21 1967-09-12 Texas Instruments Inc Metallic contacts for semiconductor devices
US3365628A (en) * 1965-09-16 1968-01-23 Texas Instruments Inc Metallic contacts for semiconductor devices
US3419765A (en) * 1965-10-01 1968-12-31 Texas Instruments Inc Ohmic contact to semiconductor devices

Also Published As

Publication number Publication date
DE1614872C3 (de) 1974-01-24
MY7300371A (en) 1973-12-31
US3581161A (en) 1971-05-25
DE1614872A1 (de) 1970-02-26
GB1203086A (en) 1970-08-26
US3434020A (en) 1969-03-18
GB1203087A (en) 1970-08-26
NL6714669A (xx) 1968-07-01
GB1200656A (en) 1970-07-29
DE1789106A1 (de) 1971-09-23
MY7300372A (en) 1973-12-31

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