NL6712237A - - Google Patents
Info
- Publication number
- NL6712237A NL6712237A NL6712237A NL6712237A NL6712237A NL 6712237 A NL6712237 A NL 6712237A NL 6712237 A NL6712237 A NL 6712237A NL 6712237 A NL6712237 A NL 6712237A NL 6712237 A NL6712237 A NL 6712237A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/70—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices having only two electrodes and exhibiting negative resistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Electronic Switches (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US577944A US3395845A (en) | 1966-09-08 | 1966-09-08 | Chip bonding machine |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6712237A true NL6712237A (xx) | 1968-03-11 |
Family
ID=24310780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6712237A NL6712237A (xx) | 1966-09-08 | 1967-09-06 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3395845A (xx) |
CH (1) | CH472169A (xx) |
DE (2) | DE1286095B (xx) |
FR (1) | FR1549294A (xx) |
GB (1) | GB1164037A (xx) |
NL (1) | NL6712237A (xx) |
SE (1) | SE326472B (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3448911A (en) * | 1967-06-15 | 1969-06-10 | Western Electric Co | Compensating base for simultaneously bonding multiple leads |
US3650002A (en) * | 1969-03-04 | 1972-03-21 | Kentucky Electronics Inc | Machinery for making crt electronic assemblies using two indexing tables |
US3581557A (en) * | 1969-08-18 | 1971-06-01 | Fairchild Camera Instr Co | Pneumatic leadwire bond tester |
US4151945A (en) * | 1977-12-08 | 1979-05-01 | Universal Instruments Corporation | Automated hybrid circuit board assembly apparatus |
CA1217572A (en) * | 1983-05-02 | 1987-02-03 | Kenichi Saito | Mounting apparatus for chip type electronic parts |
JP2751975B2 (ja) * | 1991-12-20 | 1998-05-18 | 株式会社日立製作所 | 半導体処理装置のロードロック室 |
GB2473600B (en) * | 2009-08-25 | 2013-09-25 | Pillarhouse Int Ltd | Quick-loading soldering apparatus |
JP6312270B2 (ja) | 2016-03-25 | 2018-04-18 | 株式会社写真化学 | デバイスチップを用いた電子デバイスの製造方法およびその製造装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3029666A (en) * | 1957-05-01 | 1962-04-17 | Curtiss Wright Corp | Means for pressure-vibration joining of metal |
US3357621A (en) * | 1965-08-19 | 1967-12-12 | Western Electric Co | Soldering apparatus |
-
1966
- 1966-09-08 US US577944A patent/US3395845A/en not_active Expired - Lifetime
-
1967
- 1967-06-09 DE DEI33869A patent/DE1286095B/de active Pending
- 1967-08-19 DE DEC43136A patent/DE1287179B/de active Pending
- 1967-08-30 CH CH1214567A patent/CH472169A/fr not_active IP Right Cessation
- 1967-08-30 FR FR119401A patent/FR1549294A/fr not_active Expired
- 1967-08-31 GB GB39884/67A patent/GB1164037A/en not_active Expired
- 1967-09-06 NL NL6712237A patent/NL6712237A/xx unknown
- 1967-09-08 SE SE12451/67A patent/SE326472B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE1286095B (de) | 1969-01-02 |
SE326472B (xx) | 1970-07-27 |
FR1549294A (xx) | 1968-12-13 |
DE1287179B (de) | 1969-01-16 |
US3395845A (en) | 1968-08-06 |
CH472169A (fr) | 1969-04-30 |
GB1164037A (en) | 1969-09-10 |