NL6712237A - - Google Patents

Info

Publication number
NL6712237A
NL6712237A NL6712237A NL6712237A NL6712237A NL 6712237 A NL6712237 A NL 6712237A NL 6712237 A NL6712237 A NL 6712237A NL 6712237 A NL6712237 A NL 6712237A NL 6712237 A NL6712237 A NL 6712237A
Authority
NL
Netherlands
Application number
NL6712237A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6712237A publication Critical patent/NL6712237A/xx

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/70Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices having only two electrodes and exhibiting negative resistance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Electronic Switches (AREA)
NL6712237A 1966-09-08 1967-09-06 NL6712237A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US577944A US3395845A (en) 1966-09-08 1966-09-08 Chip bonding machine

Publications (1)

Publication Number Publication Date
NL6712237A true NL6712237A (xx) 1968-03-11

Family

ID=24310780

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6712237A NL6712237A (xx) 1966-09-08 1967-09-06

Country Status (7)

Country Link
US (1) US3395845A (xx)
CH (1) CH472169A (xx)
DE (2) DE1286095B (xx)
FR (1) FR1549294A (xx)
GB (1) GB1164037A (xx)
NL (1) NL6712237A (xx)
SE (1) SE326472B (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3448911A (en) * 1967-06-15 1969-06-10 Western Electric Co Compensating base for simultaneously bonding multiple leads
US3650002A (en) * 1969-03-04 1972-03-21 Kentucky Electronics Inc Machinery for making crt electronic assemblies using two indexing tables
US3581557A (en) * 1969-08-18 1971-06-01 Fairchild Camera Instr Co Pneumatic leadwire bond tester
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
CA1217572A (en) * 1983-05-02 1987-02-03 Kenichi Saito Mounting apparatus for chip type electronic parts
JP2751975B2 (ja) * 1991-12-20 1998-05-18 株式会社日立製作所 半導体処理装置のロードロック室
GB2473600B (en) * 2009-08-25 2013-09-25 Pillarhouse Int Ltd Quick-loading soldering apparatus
JP6312270B2 (ja) 2016-03-25 2018-04-18 株式会社写真化学 デバイスチップを用いた電子デバイスの製造方法およびその製造装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3029666A (en) * 1957-05-01 1962-04-17 Curtiss Wright Corp Means for pressure-vibration joining of metal
US3357621A (en) * 1965-08-19 1967-12-12 Western Electric Co Soldering apparatus

Also Published As

Publication number Publication date
DE1286095B (de) 1969-01-02
SE326472B (xx) 1970-07-27
FR1549294A (xx) 1968-12-13
DE1287179B (de) 1969-01-16
US3395845A (en) 1968-08-06
CH472169A (fr) 1969-04-30
GB1164037A (en) 1969-09-10

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