NL6708363A - - Google Patents
Info
- Publication number
- NL6708363A NL6708363A NL6708363A NL6708363A NL6708363A NL 6708363 A NL6708363 A NL 6708363A NL 6708363 A NL6708363 A NL 6708363A NL 6708363 A NL6708363 A NL 6708363A NL 6708363 A NL6708363 A NL 6708363A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3955166 | 1966-06-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6708363A true NL6708363A (xx) | 1967-12-21 |
Family
ID=12556181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6708363A NL6708363A (xx) | 1966-06-20 | 1967-06-15 |
Country Status (2)
Country | Link |
---|---|
US (1) | US3492157A (xx) |
NL (1) | NL6708363A (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2102512A5 (xx) * | 1970-08-06 | 1972-04-07 | Liaison Electr Silec | |
US3869701A (en) * | 1972-03-02 | 1975-03-04 | Douglas G Waltz | Plurality of electronic elements connected together by interconnecting wires and connecting joints |
US3975757A (en) * | 1974-05-31 | 1976-08-17 | National Semiconductor Corporation | Molded electrical device |
US4203792A (en) * | 1977-11-17 | 1980-05-20 | Bell Telephone Laboratories, Incorporated | Method for the fabrication of devices including polymeric materials |
JPS59113648A (ja) * | 1982-12-20 | 1984-06-30 | Hitachi Ltd | 樹脂モ−ルド型半導体装置 |
JP2918328B2 (ja) * | 1990-11-26 | 1999-07-12 | 株式会社デンソー | 樹脂の選定方法及びこの選定方法により選定された樹脂を有する樹脂封止型半導体装置 |
JP2927081B2 (ja) * | 1991-10-30 | 1999-07-28 | 株式会社デンソー | 樹脂封止型半導体装置 |
US6521916B2 (en) * | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2940161A (en) * | 1955-10-11 | 1960-06-14 | Western Electric Co | Methods of making encapsulated electrical devices |
US2937110A (en) * | 1958-07-17 | 1960-05-17 | Westinghouse Electric Corp | Protective treatment for semiconductor devices |
US3135625A (en) * | 1958-08-29 | 1964-06-02 | Masonite Corp | Method for applying catalyzed coating compositions |
US3156580A (en) * | 1960-01-29 | 1964-11-10 | Bell Aerospace Corp | Method of surface finishing metal surfaces with epoxy and acrylic resins |
US3240619A (en) * | 1960-06-21 | 1966-03-15 | Interchem Corp | Method of coating with polyester resins |
US3235937A (en) * | 1963-05-10 | 1966-02-22 | Gen Electric | Low cost transistor |
US3298087A (en) * | 1964-03-09 | 1967-01-17 | Sylvania Electric Prod | Method for producing semiconductor devices |
US3278813A (en) * | 1964-04-22 | 1966-10-11 | Gen Electric | Transistor housing containing packed, earthy, nonmetallic, electrically insulating material |
US3283224A (en) * | 1965-08-18 | 1966-11-01 | Trw Semiconductors Inc | Mold capping semiconductor device |
-
1967
- 1967-06-09 US US644867A patent/US3492157A/en not_active Expired - Lifetime
- 1967-06-15 NL NL6708363A patent/NL6708363A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US3492157A (en) | 1970-01-27 |