NL6701217A - - Google Patents

Info

Publication number
NL6701217A
NL6701217A NL6701217A NL6701217A NL6701217A NL 6701217 A NL6701217 A NL 6701217A NL 6701217 A NL6701217 A NL 6701217A NL 6701217 A NL6701217 A NL 6701217A NL 6701217 A NL6701217 A NL 6701217A
Authority
NL
Netherlands
Application number
NL6701217A
Other versions
NL143369B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6701217A priority Critical patent/NL143369B/xx
Priority to DE19671614310 priority patent/DE1614310C3/de
Priority to CA010400A priority patent/CA918813A/en
Priority to AT66868A priority patent/AT280351B/de
Priority to GB351668A priority patent/GB1193373A/en
Priority to SE91568A priority patent/SE363191B/xx
Priority to ES349649A priority patent/ES349649A1/es
Priority to CH99468A priority patent/CH468698A/de
Priority to BE709837D priority patent/BE709837A/xx
Priority to FR1551826D priority patent/FR1551826A/fr
Publication of NL6701217A publication Critical patent/NL6701217A/xx
Priority to JP2400770A priority patent/JPS514631B1/ja
Publication of NL143369B publication Critical patent/NL143369B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
NL6701217A 1967-01-26 1967-01-26 Werkwijze voor het aanbrengen van een elektrische aansluiting op een oppervlak van een halfgeleiderinrichting en halfgeleiderinrichting verkregen volgens deze werkwijze. NL143369B (nl)

Priority Applications (11)

Application Number Priority Date Filing Date Title
NL6701217A NL143369B (nl) 1967-01-26 1967-01-26 Werkwijze voor het aanbrengen van een elektrische aansluiting op een oppervlak van een halfgeleiderinrichting en halfgeleiderinrichting verkregen volgens deze werkwijze.
DE19671614310 DE1614310C3 (de) 1967-01-26 1967-12-14 Verfahren zum Anbringen eines elektrischen Anschlusses auf einer Fläche eines elektronischen Bauelementes
CA010400A CA918813A (en) 1967-01-26 1968-01-22 Method of providing an electric connection to a surface of an electronic device and device obtained by said method
SE91568A SE363191B (cs) 1967-01-26 1968-01-23
GB351668A GB1193373A (en) 1967-01-26 1968-01-23 Improvements in and relating to Electronic Devices
AT66868A AT280351B (de) 1967-01-26 1968-01-23 Verfahren zum Anbringen eines elektrischen Anschlusses auf einer Fläche einer elektronischen Schaltungsanordnung
ES349649A ES349649A1 (es) 1967-01-26 1968-01-23 Un dispositivo electronico, en particular un circuito de cristal semiconductor integrado.
CH99468A CH468698A (de) 1967-01-26 1968-01-23 Elektrische Schaltungsanordnung mit einem elektrischen Anschluss und Verfahren zu ihrer Herstellung
BE709837D BE709837A (cs) 1967-01-26 1968-01-24
FR1551826D FR1551826A (cs) 1967-01-26 1968-01-26
JP2400770A JPS514631B1 (cs) 1967-01-26 1970-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6701217A NL143369B (nl) 1967-01-26 1967-01-26 Werkwijze voor het aanbrengen van een elektrische aansluiting op een oppervlak van een halfgeleiderinrichting en halfgeleiderinrichting verkregen volgens deze werkwijze.

Publications (2)

Publication Number Publication Date
NL6701217A true NL6701217A (cs) 1968-07-29
NL143369B NL143369B (nl) 1974-09-16

Family

ID=19799131

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6701217A NL143369B (nl) 1967-01-26 1967-01-26 Werkwijze voor het aanbrengen van een elektrische aansluiting op een oppervlak van een halfgeleiderinrichting en halfgeleiderinrichting verkregen volgens deze werkwijze.

Country Status (11)

Country Link
JP (1) JPS514631B1 (cs)
AT (1) AT280351B (cs)
BE (1) BE709837A (cs)
CA (1) CA918813A (cs)
CH (1) CH468698A (cs)
DE (1) DE1614310C3 (cs)
ES (1) ES349649A1 (cs)
FR (1) FR1551826A (cs)
GB (1) GB1193373A (cs)
NL (1) NL143369B (cs)
SE (1) SE363191B (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2176938A (en) * 1985-06-24 1987-01-07 Nat Semiconductor Corp Pad metallization structure

Also Published As

Publication number Publication date
SE363191B (cs) 1974-01-07
AT280351B (de) 1970-04-10
ES349649A1 (es) 1969-10-01
BE709837A (cs) 1968-07-24
DE1614310C3 (de) 1975-05-28
CA918813A (en) 1973-01-09
NL143369B (nl) 1974-09-16
CH468698A (de) 1969-02-15
DE1614310B2 (de) 1974-10-10
JPS514631B1 (cs) 1976-02-13
DE1614310A1 (de) 1970-08-13
FR1551826A (cs) 1968-12-27
GB1193373A (en) 1970-05-28

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee
NL80 Abbreviated name of patent owner mentioned of already nullified patent

Owner name: PHILIPS