NL6611257A - - Google Patents
Info
- Publication number
- NL6611257A NL6611257A NL6611257A NL6611257A NL6611257A NL 6611257 A NL6611257 A NL 6611257A NL 6611257 A NL6611257 A NL 6611257A NL 6611257 A NL6611257 A NL 6611257A NL 6611257 A NL6611257 A NL 6611257A
- Authority
- NL
- Netherlands
Links
Classifications
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- H10W76/60—
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
- C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
- C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
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- H10W90/00—
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- H10W95/00—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
- Glass Compositions (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US478690A US3405441A (en) | 1965-08-10 | 1965-08-10 | Method of enclosing an electrical device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6611257A true NL6611257A (cg-RX-API-DMAC10.html) | 1967-02-13 |
Family
ID=23900984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6611257A NL6611257A (cg-RX-API-DMAC10.html) | 1965-08-10 | 1966-08-10 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3405441A (cg-RX-API-DMAC10.html) |
| CH (1) | CH451274A (cg-RX-API-DMAC10.html) |
| DE (1) | DE1590251A1 (cg-RX-API-DMAC10.html) |
| ES (2) | ES123823Y (cg-RX-API-DMAC10.html) |
| FR (1) | FR1488922A (cg-RX-API-DMAC10.html) |
| GB (1) | GB1160732A (cg-RX-API-DMAC10.html) |
| NL (1) | NL6611257A (cg-RX-API-DMAC10.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3672034A (en) * | 1970-01-14 | 1972-06-27 | Bell Telephone Labor Inc | Method for bonding a beam-lead device to a substrate |
| US4063349A (en) * | 1976-12-02 | 1977-12-20 | Honeywell Information Systems Inc. | Method of protecting micropackages from their environment |
| US5268533A (en) * | 1991-05-03 | 1993-12-07 | Hughes Aircraft Company | Pre-stressed laminated lid for electronic circuit package |
| US5262927A (en) * | 1992-02-07 | 1993-11-16 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package |
| US5434750A (en) * | 1992-02-07 | 1995-07-18 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package for certain non-square die shapes |
| US5438477A (en) * | 1993-08-12 | 1995-08-01 | Lsi Logic Corporation | Die-attach technique for flip-chip style mounting of semiconductor dies |
| US5508888A (en) * | 1994-05-09 | 1996-04-16 | At&T Global Information Solutions Company | Electronic component lead protector |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3105868A (en) * | 1960-12-29 | 1963-10-01 | Sylvania Electric Prod | Circuit packaging module |
| US3187240A (en) * | 1961-08-08 | 1965-06-01 | Bell Telephone Labor Inc | Semiconductor device encapsulation and method |
| US3171187A (en) * | 1962-05-04 | 1965-03-02 | Nippon Electric Co | Method of manufacturing semiconductor devices |
| US3178506A (en) * | 1962-08-09 | 1965-04-13 | Westinghouse Electric Corp | Sealed functional molecular electronic device |
-
1965
- 1965-08-10 US US478690A patent/US3405441A/en not_active Expired - Lifetime
-
1966
- 1966-08-01 GB GB34393/66A patent/GB1160732A/en not_active Expired
- 1966-08-09 DE DE19661590251 patent/DE1590251A1/de active Pending
- 1966-08-09 ES ES123823U patent/ES123823Y/es not_active Expired
- 1966-08-09 ES ES0330076A patent/ES330076A1/es not_active Expired
- 1966-08-09 FR FR72571A patent/FR1488922A/fr not_active Expired
- 1966-08-10 CH CH1151866A patent/CH451274A/fr unknown
- 1966-08-10 NL NL6611257A patent/NL6611257A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1160732A (en) | 1969-08-06 |
| ES123823Y (es) | 1967-11-01 |
| CH451274A (fr) | 1968-05-15 |
| ES330076A1 (es) | 1967-06-01 |
| FR1488922A (fr) | 1967-07-13 |
| DE1590251A1 (de) | 1970-05-14 |
| US3405441A (en) | 1968-10-15 |
| ES123823U (es) | 1967-06-16 |