NL6610764A - - Google Patents

Info

Publication number
NL6610764A
NL6610764A NL6610764A NL6610764A NL6610764A NL 6610764 A NL6610764 A NL 6610764A NL 6610764 A NL6610764 A NL 6610764A NL 6610764 A NL6610764 A NL 6610764A NL 6610764 A NL6610764 A NL 6610764A
Authority
NL
Netherlands
Application number
NL6610764A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US425501A priority Critical patent/US3328650A/en
Priority to GB55102/65A priority patent/GB1070490A/en
Priority to FR45003A priority patent/FR1474816A/fr
Priority to DE19661564107 priority patent/DE1564107A1/de
Application filed filed Critical
Priority to NL6610764A priority patent/NL6610764A/xx
Publication of NL6610764A publication Critical patent/NL6610764A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
NL6610764A 1965-01-14 1966-07-29 NL6610764A (xx)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US425501A US3328650A (en) 1965-01-14 1965-01-14 Compression bonded semiconductor device
GB55102/65A GB1070490A (en) 1965-01-14 1965-12-29 Semiconductor device
FR45003A FR1474816A (fr) 1965-01-14 1966-01-06 Dispositif semi-conducteur hermétique, avec support à compression
DE19661564107 DE1564107A1 (de) 1965-01-14 1966-01-14 Gekapselte Halbleiteranordnung
NL6610764A NL6610764A (xx) 1965-01-14 1966-07-29

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US425501A US3328650A (en) 1965-01-14 1965-01-14 Compression bonded semiconductor device
NL6610764A NL6610764A (xx) 1965-01-14 1966-07-29

Publications (1)

Publication Number Publication Date
NL6610764A true NL6610764A (xx) 1968-01-30

Family

ID=26644073

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6610764A NL6610764A (xx) 1965-01-14 1966-07-29

Country Status (5)

Country Link
US (1) US3328650A (xx)
DE (1) DE1564107A1 (xx)
FR (1) FR1474816A (xx)
GB (1) GB1070490A (xx)
NL (1) NL6610764A (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3460002A (en) * 1965-09-29 1969-08-05 Microwave Ass Semiconductor diode construction and mounting
DE1564665C3 (de) * 1966-07-18 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement und Verfahren zu seiner Herstellung
US3504238A (en) * 1966-12-16 1970-03-31 Westinghouse Brake & Signal Solder free variable pressure contacted semiconductor device
US3475663A (en) * 1968-02-06 1969-10-28 Int Rectifier Corp High voltage glass sealed semiconductor device
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
US4329701A (en) * 1978-03-20 1982-05-11 The Trane Company Semiconductor package
US4168960A (en) * 1978-04-18 1979-09-25 Westinghouse Electric Corp. Method of making a glass encapsulated diode
US4329707A (en) * 1978-09-15 1982-05-11 Westinghouse Electric Corp. Glass-sealed power thyristor
JPS57100737A (en) * 1980-12-16 1982-06-23 Toshiba Corp Semiconductor device
DE3817600C2 (de) * 1987-05-26 1994-06-23 Matsushita Electric Works Ltd Verfahren zur Herstellung einer Halbleitervorrichtung mit einem keramischen Substrat und einem integrierten Schaltungskreis
US7947207B2 (en) 2005-04-12 2011-05-24 Abbott Cardiovascular Systems Inc. Method for retaining a vascular stent on a catheter

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB779195A (en) * 1954-03-12 1957-07-17 British Thomson Houston Co Ltd Improvements relating to hermetically sealed barrier-layer rectifiers
NL100659C (xx) * 1954-12-27
US2855334A (en) * 1955-08-17 1958-10-07 Sprague Electric Co Method of preparing semiconducting crystals having symmetrical junctions
US2864980A (en) * 1957-06-10 1958-12-16 Gen Electric Sealed current rectifier
US2946935A (en) * 1958-10-27 1960-07-26 Sarkes Tarzian Diode
BE620870A (xx) * 1961-08-04 1900-01-01

Also Published As

Publication number Publication date
DE1564107A1 (de) 1969-06-26
FR1474816A (fr) 1967-03-31
US3328650A (en) 1967-06-27
GB1070490A (en) 1967-06-01

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