NL6610764A - - Google Patents
Info
- Publication number
- NL6610764A NL6610764A NL6610764A NL6610764A NL6610764A NL 6610764 A NL6610764 A NL 6610764A NL 6610764 A NL6610764 A NL 6610764A NL 6610764 A NL6610764 A NL 6610764A NL 6610764 A NL6610764 A NL 6610764A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US425501A US3328650A (en) | 1965-01-14 | 1965-01-14 | Compression bonded semiconductor device |
| GB55102/65A GB1070490A (en) | 1965-01-14 | 1965-12-29 | Semiconductor device |
| FR45003A FR1474816A (fr) | 1965-01-14 | 1966-01-06 | Dispositif semi-conducteur hermétique, avec support à compression |
| DE19661564107 DE1564107A1 (de) | 1965-01-14 | 1966-01-14 | Gekapselte Halbleiteranordnung |
| NL6610764A NL6610764A (US07709020-20100504-C00041.png) | 1965-01-14 | 1966-07-29 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US425501A US3328650A (en) | 1965-01-14 | 1965-01-14 | Compression bonded semiconductor device |
| NL6610764A NL6610764A (US07709020-20100504-C00041.png) | 1965-01-14 | 1966-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6610764A true NL6610764A (US07709020-20100504-C00041.png) | 1968-01-30 |
Family
ID=26644073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6610764A NL6610764A (US07709020-20100504-C00041.png) | 1965-01-14 | 1966-07-29 |
Country Status (5)
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3460002A (en) * | 1965-09-29 | 1969-08-05 | Microwave Ass | Semiconductor diode construction and mounting |
| DE1564665C3 (de) * | 1966-07-18 | 1975-10-30 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Halbleiterbauelement und Verfahren zu seiner Herstellung |
| US3504238A (en) * | 1966-12-16 | 1970-03-31 | Westinghouse Brake & Signal | Solder free variable pressure contacted semiconductor device |
| US3475663A (en) * | 1968-02-06 | 1969-10-28 | Int Rectifier Corp | High voltage glass sealed semiconductor device |
| US3715632A (en) * | 1971-01-08 | 1973-02-06 | Gen Electric | Liquid cooled semiconductor device clamping assembly |
| US4329701A (en) * | 1978-03-20 | 1982-05-11 | The Trane Company | Semiconductor package |
| US4168960A (en) * | 1978-04-18 | 1979-09-25 | Westinghouse Electric Corp. | Method of making a glass encapsulated diode |
| US4329707A (en) * | 1978-09-15 | 1982-05-11 | Westinghouse Electric Corp. | Glass-sealed power thyristor |
| JPS57100737A (en) * | 1980-12-16 | 1982-06-23 | Toshiba Corp | Semiconductor device |
| DE3817600C2 (de) * | 1987-05-26 | 1994-06-23 | Matsushita Electric Works Ltd | Verfahren zur Herstellung einer Halbleitervorrichtung mit einem keramischen Substrat und einem integrierten Schaltungskreis |
| US7947207B2 (en) | 2005-04-12 | 2011-05-24 | Abbott Cardiovascular Systems Inc. | Method for retaining a vascular stent on a catheter |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB779195A (en) * | 1954-03-12 | 1957-07-17 | British Thomson Houston Co Ltd | Improvements relating to hermetically sealed barrier-layer rectifiers |
| BE543951A (US07709020-20100504-C00041.png) * | 1954-12-27 | |||
| US2855334A (en) * | 1955-08-17 | 1958-10-07 | Sprague Electric Co | Method of preparing semiconducting crystals having symmetrical junctions |
| US2864980A (en) * | 1957-06-10 | 1958-12-16 | Gen Electric | Sealed current rectifier |
| US2946935A (en) * | 1958-10-27 | 1960-07-26 | Sarkes Tarzian | Diode |
| BE628175A (US07709020-20100504-C00041.png) * | 1961-08-04 | 1900-01-01 |
-
1965
- 1965-01-14 US US425501A patent/US3328650A/en not_active Expired - Lifetime
- 1965-12-29 GB GB55102/65A patent/GB1070490A/en not_active Expired
-
1966
- 1966-01-06 FR FR45003A patent/FR1474816A/fr not_active Expired
- 1966-01-14 DE DE19661564107 patent/DE1564107A1/de active Pending
- 1966-07-29 NL NL6610764A patent/NL6610764A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3328650A (en) | 1967-06-27 |
| GB1070490A (en) | 1967-06-01 |
| DE1564107A1 (de) | 1969-06-26 |
| FR1474816A (fr) | 1967-03-31 |
