Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10B—ELECTRONIC MEMORY DEVICES
  • H10B10/00—Static random access memory [SRAM] devices
  • H10B10/10—SRAM devices comprising bipolar components
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
  • H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
  • H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
  • H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
  • H10D84/615—Combinations of vertical BJTs and one or more of resistors or capacitors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
  • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses

Applications Claiming Priority (1)

Publications (1)

Family

ID=19754786

Family Applications (2)

Family Applications After (1)

Country Status (10)

Cited By (1)

Families Citing this family (16)

Family Cites Families (7)

• 0
  • NL NL294168D patent/NL294168A/xx unknown
• 1963
  • 1963-06-17 NL NL63294168A patent/NL141332B/xx not_active IP Right Cessation
• 1964
  • 1964-06-10 US US373953A patent/US3295031A/en not_active Expired - Lifetime
  • 1964-06-12 GB GB24494/64A patent/GB1069755A/en not_active Expired
  • 1964-06-13 DE DEN25111A patent/DE1284519B/de active Pending
  • 1964-06-13 DK DK299764AA patent/DK117647B/da unknown
  • 1964-06-15 ES ES0301020A patent/ES301020A1/es not_active Expired
  • 1964-06-15 CH CH779364A patent/CH434507A/de unknown
  • 1964-06-15 BE BE649299A patent/BE649299A/xx unknown
  • 1964-06-15 AT AT510464A patent/AT251650B/de active
• 1971
  • 1971-07-30 JP JP5747771A patent/JPS5323671B1/ja active Pending

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