NL276298A - - Google Patents
Info
- Publication number
- NL276298A NL276298A NL276298DA NL276298A NL 276298 A NL276298 A NL 276298A NL 276298D A NL276298D A NL 276298DA NL 276298 A NL276298 A NL 276298A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US100427A US3200311A (en) | 1961-04-03 | 1961-04-03 | Low capacitance semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
NL276298A true NL276298A (de) | 1900-01-01 |
Family
ID=22279726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL276298D NL276298A (de) | 1961-04-03 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3200311A (de) |
GB (1) | GB955018A (de) |
NL (1) | NL276298A (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3413527A (en) * | 1964-10-02 | 1968-11-26 | Gen Electric | Conductive electrode for reducing the electric field in the region of the junction of a junction semiconductor device |
US3423255A (en) * | 1965-03-31 | 1969-01-21 | Westinghouse Electric Corp | Semiconductor integrated circuits and method of making the same |
US3430109A (en) * | 1965-09-28 | 1969-02-25 | Chou H Li | Solid-state device with differentially expanded junction surface |
US3573516A (en) * | 1969-04-23 | 1971-04-06 | Gen Electric | Rectifier bridge for use with an alternator |
US3639975A (en) * | 1969-07-30 | 1972-02-08 | Gen Electric | Glass encapsulated semiconductor device fabrication process |
US4098638A (en) * | 1977-06-14 | 1978-07-04 | Westinghouse Electric Corp. | Methods for making a sloped insulator for solid state devices |
WO1989008325A1 (en) * | 1988-03-05 | 1989-09-08 | Deutsche Itt Industries Gmbh | Semiconductor component with two connections and process and device for manufacturing it |
US5166098A (en) * | 1988-03-05 | 1992-11-24 | Deutsche Itt Industries Gmbh | Method of manufacturing an encapsulated semiconductor device with a can type housing |
US5280194A (en) * | 1988-11-21 | 1994-01-18 | Micro Technology Partners | Electrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device |
US5403729A (en) * | 1992-05-27 | 1995-04-04 | Micro Technology Partners | Fabricating a semiconductor with an insulative coating |
US5592022A (en) * | 1992-05-27 | 1997-01-07 | Chipscale, Inc. | Fabricating a semiconductor with an insulative coating |
US5656547A (en) * | 1994-05-11 | 1997-08-12 | Chipscale, Inc. | Method for making a leadless surface mounted device with wrap-around flange interface contacts |
GB2302452B (en) * | 1994-06-09 | 1998-11-18 | Chipscale Inc | Resistor fabrication |
US20040144999A1 (en) * | 1995-06-07 | 2004-07-29 | Li Chou H. | Integrated circuit device |
US20100276733A1 (en) * | 2000-09-27 | 2010-11-04 | Li Choa H | Solid-state circuit device |
US7118942B1 (en) | 2000-09-27 | 2006-10-10 | Li Chou H | Method of making atomic integrated circuit device |
TWM422161U (en) * | 2011-08-18 | 2012-02-01 | Ks Terminals Inc | Improved diode structure |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2786880A (en) * | 1951-06-16 | 1957-03-26 | Bell Telephone Labor Inc | Signal translating device |
US2802159A (en) * | 1953-10-20 | 1957-08-06 | Hughes Aircraft Co | Junction-type semiconductor devices |
GB849477A (en) * | 1957-09-23 | 1960-09-28 | Nat Res Dev | Improvements in or relating to semiconductor control devices |
US2998558A (en) * | 1959-10-19 | 1961-08-29 | Pacific Semiconductors Inc | Semiconductor device and method of manufacturing same |
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0
- NL NL276298D patent/NL276298A/xx unknown
-
1961
- 1961-04-03 US US100427A patent/US3200311A/en not_active Expired - Lifetime
-
1962
- 1962-02-22 GB GB6856/62A patent/GB955018A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US3200311A (en) | 1965-08-10 |
GB955018A (en) | 1964-04-08 |