NL270559A - - Google Patents

Info

Publication number
NL270559A
NL270559A NL270559DA NL270559A NL 270559 A NL270559 A NL 270559A NL 270559D A NL270559D A NL 270559DA NL 270559 A NL270559 A NL 270559A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL270559A publication Critical patent/NL270559A/xx

Links

Classifications

    • H10W72/30
    • H10P95/00
    • H10W72/00
    • H10W72/20
    • H10W76/132
    • H10W72/073
    • H10W72/07336
    • H10W90/753
    • H10W90/754
NL270559D 1960-11-16 NL270559A (show.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0071282 1960-11-16

Publications (1)

Publication Number Publication Date
NL270559A true NL270559A (show.php) 1900-01-01

Family

ID=7502355

Family Applications (1)

Application Number Title Priority Date Filing Date
NL270559D NL270559A (show.php) 1960-11-16

Country Status (5)

Country Link
US (1) US3254393A (show.php)
CH (1) CH393545A (show.php)
DE (1) DE1439056A1 (show.php)
GB (1) GB930352A (show.php)
NL (1) NL270559A (show.php)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492545A (en) * 1968-03-18 1970-01-27 Westinghouse Electric Corp Electrically and thermally conductive malleable layer embodying lead foil
US3590467A (en) * 1968-11-15 1971-07-06 Corning Glass Works Method for bonding a crystal to a solid delay medium
US4529836A (en) * 1983-07-15 1985-07-16 Sperry Corporation Stress absorption matrix
DE3446780A1 (de) * 1984-12-21 1986-07-03 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen
US5436407A (en) * 1994-06-13 1995-07-25 Integrated Packaging Assembly Corporation Metal semiconductor package with an external plastic seal

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2258681A (en) * 1939-04-15 1941-10-14 Aluminum Co Of America Method of joining
US2362893A (en) * 1942-04-04 1944-11-14 Metals & Controls Corp Solder
US2497665A (en) * 1945-02-07 1950-02-14 Brush Dev Co Piezoelectric device
US2530110A (en) * 1944-06-02 1950-11-14 Sperry Corp Nonlinear circuit device utilizing germanium
US2623273A (en) * 1945-05-05 1952-12-30 Indium Corp America Soldered joint and method of making same
US2474643A (en) * 1947-06-04 1949-06-28 Carboloy Company Inc Method of brazing cemented carbides to steel
BE555318A (show.php) * 1956-03-07
US2922092A (en) * 1957-05-09 1960-01-19 Westinghouse Electric Corp Base contact members for semiconductor devices
US2917686A (en) * 1957-08-19 1959-12-15 Westinghouse Electric Corp Semiconductor rectifier device
US3089067A (en) * 1957-09-30 1963-05-07 Gen Motors Corp Semiconductor device
US3046651A (en) * 1958-03-14 1962-07-31 Honeywell Regulator Co Soldering technique
US3002135A (en) * 1958-06-11 1961-09-26 Hughes Aircraft Co Semiconductor device
NL241491A (show.php) * 1958-07-21
US3020454A (en) * 1959-11-09 1962-02-06 Solid State Products Inc Sealing of electrical semiconductor devices

Also Published As

Publication number Publication date
US3254393A (en) 1966-06-07
GB930352A (en) 1963-07-03
CH393545A (de) 1965-06-15
DE1439056A1 (de) 1969-10-16

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