NL268976A - - Google Patents

Info

Publication number
NL268976A
NL268976A NL268976DA NL268976A NL 268976 A NL268976 A NL 268976A NL 268976D A NL268976D A NL 268976DA NL 268976 A NL268976 A NL 268976A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL268976A publication Critical patent/NL268976A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
NL268976D 1961-09-05 NL268976A (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL268976 1961-09-05

Publications (1)

Publication Number Publication Date
NL268976A true NL268976A (cg-RX-API-DMAC7.html)

Family

ID=19753267

Family Applications (2)

Application Number Title Priority Date Filing Date
NL268976D NL268976A (cg-RX-API-DMAC7.html) 1961-09-05
NL125517D NL125517C (cg-RX-API-DMAC7.html) 1961-09-05

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL125517D NL125517C (cg-RX-API-DMAC7.html) 1961-09-05

Country Status (4)

Country Link
US (1) US3261769A (cg-RX-API-DMAC7.html)
ES (1) ES280505A1 (cg-RX-API-DMAC7.html)
GB (1) GB1017779A (cg-RX-API-DMAC7.html)
NL (2) NL125517C (cg-RX-API-DMAC7.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340607A (en) * 1964-11-12 1967-09-12 Melpar Inc Multilayer printed circuits
US3396459A (en) * 1964-11-25 1968-08-13 Gen Dynamics Corp Method of fabricating electrical connectors
US3429036A (en) * 1965-04-08 1969-02-25 Gen Dynamics Corp Method of manufacturing electrical connectors
US3429038A (en) * 1966-08-01 1969-02-25 Gen Dynamics Corp Method of manufacturing electrical intraconnectors
US3431641A (en) * 1966-08-01 1969-03-11 Gen Dynamics Corp Method of manufacturing electrical connectors
US3429037A (en) * 1966-08-01 1969-02-25 Gen Dynamics Corp Method of making tubular solder connectors
US3429786A (en) * 1966-10-21 1969-02-25 Gen Dynamics Corp Controlled electroplating process
US3462832A (en) * 1966-10-24 1969-08-26 Gen Dynamics Corp Process for fabricating high density multilayer electrical interconnections
US4911796A (en) * 1985-04-16 1990-03-27 Protocad, Inc. Plated through-holes in a printed circuit board
GB2237580A (en) * 1989-11-03 1991-05-08 Marconi Gec Ltd A method for plating a hole and adjacent surface portion of a printed circuit board
CN103240959A (zh) * 2013-04-23 2013-08-14 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用防粘黏定位支撑销
CN103231583A (zh) * 2013-04-24 2013-08-07 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用定位撑脚
CN103240960A (zh) * 2013-04-24 2013-08-14 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用防粘黏定位支撑脚
CN104213170A (zh) * 2014-09-16 2014-12-17 四川海英电子科技有限公司 高阶高密度电路板镀铜方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA598722A (en) * 1960-05-24 H. Scheer Frederick Plating in holes
GB840544A (en) * 1955-08-11 1960-07-06 Telefunken Gmbh Improvements in or relating to methods of forming conducting elements on insulating supports
US3071521A (en) * 1959-07-21 1963-01-01 Burrougbs Corp Method and apparatus for electrolytic treatment

Also Published As

Publication number Publication date
NL125517C (cg-RX-API-DMAC7.html)
US3261769A (en) 1966-07-19
ES280505A1 (es) 1963-03-01
GB1017779A (en) 1966-01-19

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