NL259859A - - Google Patents

Info

Publication number
NL259859A
NL259859A NL259859DA NL259859A NL 259859 A NL259859 A NL 259859A NL 259859D A NL259859D A NL 259859DA NL 259859 A NL259859 A NL 259859A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL259859A publication Critical patent/NL259859A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
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    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
NL259859D 1960-01-14 NL259859A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES66638A DE1116826B (en) 1960-01-14 1960-01-14 Method for producing a semiconductor crystal arrangement which is accommodated in a protective housing and has at least two metal electrodes alloyed close together in a plane

Publications (1)

Publication Number Publication Date
NL259859A true NL259859A (en) 1900-01-01

Family

ID=7498962

Family Applications (1)

Application Number Title Priority Date Filing Date
NL259859D NL259859A (en) 1960-01-14

Country Status (4)

Country Link
CH (1) CH387808A (en)
DE (1) DE1116826B (en)
GB (1) GB916193A (en)
NL (1) NL259859A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1235439B (en) * 1964-10-01 1967-03-02 Telefunken Patent Method for manufacturing a plurality of intermediate sockets and apparatus for carrying out the method
JPS58169918A (en) * 1982-03-31 1983-10-06 Hitachi Ltd Wire bonder
DE19720847C2 (en) * 1997-05-17 2002-04-18 Daimler Chrysler Ag Device for positioning a wire and its use

Also Published As

Publication number Publication date
CH387808A (en) 1965-02-15
DE1116826B (en) 1961-11-09
GB916193A (en) 1963-01-23

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