NL258204A - - Google Patents

Info

Publication number
NL258204A
NL258204A NL258204DA NL258204A NL 258204 A NL258204 A NL 258204A NL 258204D A NL258204D A NL 258204DA NL 258204 A NL258204 A NL 258204A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL258204A publication Critical patent/NL258204A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
NL258204D 1960-11-21 NL258204A (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL258204 1960-11-21

Publications (1)

Publication Number Publication Date
NL258204A true NL258204A (cg-RX-API-DMAC7.html) 1900-01-01

Family

ID=19752712

Family Applications (1)

Application Number Title Priority Date Filing Date
NL258204D NL258204A (cg-RX-API-DMAC7.html) 1960-11-21

Country Status (5)

Country Link
CH (1) CH411139A (cg-RX-API-DMAC7.html)
DE (1) DE1193609B (cg-RX-API-DMAC7.html)
ES (1) ES272141A1 (cg-RX-API-DMAC7.html)
GB (1) GB972387A (cg-RX-API-DMAC7.html)
NL (1) NL258204A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1331028A (en) * 1971-08-07 1973-09-19 Matsushita Electronics Corp Method of soldering a semiconductor plate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1110763B (de) 1956-10-11 1961-07-13 Siemens Ag Verfahren und Vorrichtung zur Herstellung von Halbleiteranordnungen mit legierten, flaechenhaften p-n-UEbergaengen
DE1054583B (de) * 1957-03-05 1959-04-09 Bbc Brown Boveri & Cie Verfahren zur Herstellung von pn-UEbergaengen auf Halbleiterkoerpern

Also Published As

Publication number Publication date
DE1193609B (de) 1965-05-26
GB972387A (en) 1964-10-14
CH411139A (de) 1966-04-15
ES272141A1 (es) 1962-06-16

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