NL2030061B1 - High-temperature resistant release paper and preparation method and application thereof - Google Patents
High-temperature resistant release paper and preparation method and application thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21F—PAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER THEREON
- D21F11/00—Processes for making continuous lengths of paper, or of cardboard, or of wet web for fibre board production, on paper-making machines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H19/00—Coated paper; Coating material
- D21H19/80—Paper comprising more than one coating
- D21H19/82—Paper comprising more than one coating superposed
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
- D21H27/001—Release paper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/062—HDPE
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/066—LDPE (radical process)
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/045—Presence of homo or copolymers of ethene in the release coating
Abstract
The present disclosure discloses a high—temperature resistant release paper and a preparation method and an application thereof, belonging to the technical field of composite paper. The release paper comprises a first release layer, a first laminating layer, a base material layer, a second laminating layer and a second release layer in sequence from top to bottom, wherein one of the first laminating layer and the second laminating layer is a PE laminating layer, and the the component material of the PE laminating layer comprises the following raw material components: HDPE, LDPE and modified nano oxide. In the present disclosure, a PE laminating layer with a micropore air—diffusing function is arranged in the release paper, when the release agent is coated, moisture in the base material volatilizes to generate water vapor which can be diffused through micropores of the PE laminating l5 layer, the quality problems of surface blistering, layering and the like of the PE laminating layer are effectively avoided; moreover, the preparation process of the release paper is simple and feasible, the release paper prepared by the present disclosure has higher temperature resistance than conventional release paper, and has a wide application prospect in the fields of die cutting, CPU heat conduction, pressure—sensitive adhesive tapes and sealing adhesive tapes, etcetera.
Description
P840/NLpd HIGH-TEMPERATURE RESISTANT RELEASE PAPER AND PREPARATION METHOD
TECHNICAL FIELD The present disclosure relates to the technical field of com- posite paper, and more particularly to a high-temperature re- sistant release paper and a preparation method and application thereof.
BACKGROUND ART Release paper is also called silicone oil paper or non- sticking paper, it is divided into three types, namely, Glassine release paper, polyethylene terephthalate release paper (PEK) and caoline coated release paper, according to raw materials. The PEK release paper is produced in China in a large scale and is widely used in the industries of adhesive tapes, advertisements, etc. due to its advantages of dimensional stability, etc. Almost all or most of the protective films in the electronic die cutting indus- try adopt the PEK release paper.
The base materials used by the traditional common high- temperature resistant release material are Glassine, CCK (caoline coated paper) and PET (polyethylene terephthalate); the Glassine and CCK materials are low in surface gloss, so these base materi- als are high in haze and poor in transparency when being used for coating transparent pressure-sensitive adhesive; and moreover, the Glassine and CCK can cause permeation, so it is difficult to pro- duce release material with high-precision release force for exam- ple within the range of + 2 9/25 mm and different release force ratios on double sides.
In the prior art, PET base material is also used. It meets the requirement for high temperature resistance, but it is high in price, low in production speed, low in polarity, etc., and the re- lease agent reaction is poor, the produced release material is prone to migration, all the performances, excepting the high tem- perature resistance, are poorer than that those of PEK, and moreo-
ver, the PET base material is high in price, thus the PET base ma- terial is more difficult to achieve the precise release force con- trol range. Therefore, functional adhesive tapes such as conduc- tive adhesive tapes, heat conduction adhesive tapes, shielding ad- hesive tapes and high-viscosity EVA adhesive tapes are used in the photoelectric field and are used for mobile phones, automobiles, navigators, displays, laptops, tablet computers, etc. These adhe- sive tapes are high in viscosity, long in weather resistance, high in stability, etc., so most of the carriers are made of PEK dou- ble-sided release paper at present. The traditional PEK release paper has low temperature resistance, so the use amount of bridg- ing agent and catalyst must be increased in the bridging and cata- lyzing process.
In addition, the PEK double-sided release paper is prone to layering and blistering in high-temperature environment (about 100°C), the main reason is that when the PEK double-sided release paper is coated and passes through drying oven, moisture in the release paper is converted into gas state at a high temperature, the gas cannot be discharged under the coverage of PE layer, then PE film spraying surface is bulged and blistered and PE surface layering is caused, and even layering of the release paper is caused in severe cases, thus the quality and the percent of pass of the release paper finished products are seriously influenced.
SUMMARY The present disclosure provides high-temperature resistant release paper and a preparation method and an application thereof, to solve one or more technical problems in the prior art and at least provides a beneficial choice or creation condition.
In order to solve the technical problems, the present disclo- sure adopts the following technical solution: High-temperature re- sistant release paper comprises a first release layer, a first laminating layer, a base material layer, a second laminating layer and a second release layer in sequence from top to bottom, wherein one of the first laminating layer and the second laminating layer is a PE laminating layer, and the other one of the first laminat- ing layer and the second laminating layer is a common laminating layer; the component material of the PE laminating layer comprises the following raw material components: HDPE, LDPE and modified nano oxide; the modified nano oxide is obtained by modifying nano oxide with a coupling agent, and the modification process compris- es the following steps: adding the nano oxide into water, dispers- ing uniformly, then adding a coupling agent, reacting at 200-250°C for 3-5 h, adjusting the pH value to 5-6, adding n-octyl anhy- dride, reacting at 100-120°C for 2-3 h, cooling, filtering, and performing centrifugal drying to obtain the modified nano oxide; and the component material of the common laminating layer compris- es the following raw material components: HDPE and LDPE.
Wherein, the base material of modified nano oxide is nano ox- ide; nano oxide is nano silicon dioxide of which the purity is greater than or equal to 99.8%, and can be replaced with titanium dioxide of the same size; preferably, nano oxide consists of two components of which the particle sizes are respectively 40-60 nm and 200-250 nm. Nano silicon dioxide of which the particle size is 40-60 nm plays a role in improving the temperature resistance and strength performance of the laminating layers; and silicon dioxide of which the particle size is 200-250 nm plays a role in generat- ing micropores in the laminating layers.
Wherein, HDPE is high-density polyethylene, is non-polar thermoplastic resin with high crystallinity, and is nontoxic, odorless and odorless, the melting point of HDPE is about 130°C, and the relative density is 0.941-0.960 g/cm’; and low-density LDPE is a copolymer formed by polymerizing polyethylene (LDPE) under high pressure or low pressure, and is nontoxic, odorless and odor- less, and the density is less than 0.926 g/cm’.
Further, the release force of the first release layer is dif- ferent from that of the second release layer.
As a further improvement of the above solution, the component material of the PE laminating layer comprises the following raw material components in parts by weight: 30-40 parts of HDPE, 60-70 parts of LDPE, and 4-10 parts of modified nano oxide.
As a further improvement of the above solution, in the compo- nent material of the common laminating layer, the mass ratio of
HDPE to LDPE is 1: (1.5-2).
Preferably, the melt index of HDPE is greater than or equal to 5 g/10 min, and the load of HDPE at 210°C is 2.16 kg; and the melt index of LDPE is greater than or equal to 6 g/10 min, and the load of LDPE at 190°C is 2.16 kg.
As a further improvement of the above solution, a first adhe- sive layer is arranged between the base material layer and the first laminating layer; and a second adhesive layer is arranged between the base material layer and the second laminating layer.
The coating amounts of the first adhesive layer and second adhe- sive layer are respectively 0.06-0.15/m".
As a further improvement of the above solution, the base ma- terial layer is selected from one of kraft paper, writing paper, anti-sticking base paper, Glassine paper, coated paper or CCK pa- per.
A method for preparing the release paper as describe above in the present disclosure comprises the following steps: 1) Preparing modified nano oxide: adding nano oxide into wa- ter, uniformly dispersing, then adding a coupling agent, reacting for 3-5 h at the temperature of 200-250°C, adjusting pH to 5-6, adding n-caprylic anhydride, reacting for 2-3 h at the temperature of 100-120°C, and then cooling, filtering and centrifugal drying to obtain modified nano oxide; 2) Preparing a component material of a PE laminating layer: weighing raw materials according to the formula of the component material of the PE laminating layer, and mixing and stirring HDPE, LDPE and modified nano oxide obtained in the step 1) under the electrostatic condition to obtain the component material of the PE laminating layer; 3) Preparing a component material of a common laminating lay- er: weighing raw materials HDPE and LDPE according to the formula of the component material of the common laminating layer, and mix- ing and stirring the raw materials HDPE and LDPE to obtain the component material of the common laminating layer; 4) Processing the PE laminating layer and the common laminat- ing layer: performing corona treatment on the base material; per-
forming resin melting, mixing, bridging and filtering on the com- ponent material of the PE laminating layer; and performing lami- nating coating on the two surfaces of the base material by means of the obtained product and the component material of the common 5 laminating layer obtained in the step 3) respectively so as to ob- tain a first laminating layer and a second laminating layer on the two surfaces of the base material; 5) Coating release layers: coating the first laminating layer with a release agent to obtain a first release layer, and coating the second laminating layer with the release agent to form a sec- ond release layer.
Wherein, in the step 1), the weight part ratio of n-caprylic anhydride to the coupling agent is (0.7-0.9): 1.
As a further improvement of the above solution, in the step 1), the static voltage under the static condition is 20-100 KV.
As a further improvement of the above solution, steps of coating the first laminating layer with a primer and drying to form a first adhesive layer, and coating the second laminating layer with the primer and drying to form a second adhesive layer is carried out between the step 2) and the step 3), wherein the primer is an AC primer, and the main component of the primer is a water-based polyethyleneimine water solution.
In the step 2), the corona value is 1.5-3.0 w/m?. The treat- ment temperature of the resin at the melt index is 200-250°C; the mixing temperature is 250-300°C, the mixing time is 2-6 s, the con- veying speed of a base material layer material is 100-150 m/min, and the corona unit power is 1.5-3 W/m’; and the pressure of the component material of the PE laminating layer and the base materi- al during laminating and compounding is 6-9 kg/cm’.
As a further improvement of the above solution, in the step 3), the coating amount of the release agent is 0.7-2 g/m’, and the main component of the release agent is polymethyl siloxane. Polymethyl/polyethylsiloxzane of an addition type can be adopted as the polysiloxane of the release layer, solvent-free silicone oil can be preferentially selected, and other types of organosilicone such as a solvent type and a photocuring type can also be used ac- cording to needs.
In addition, the coating mode of the release layer can be a solvent-free 5-6-roller coating head or solvent-containing reticu- late pattern coating mode or a micro-gravure coating mode; the polysiloxane comprises solvent type silicone oil and solvent-free silicone oil; after the laminating layers are coated with the pol- ysiloxane, when thermocuring is conducted, the curing temperature is controlled to be 120-150°C, and the curing time is 8-15 s; and when ultraviolet curing is conducted, the irradiation intensity (also known as energy intensity) of ultraviolet light energy is controlled to be 1.5-9 mj/cm®, and the irradiation time is 1.5-3 s. The release layer is coated in the reticulate pattern coating mode or the micro-gravure coating mode and the 5-6-roller solvent- free coating mode, solvent-free coating is selected under the con- dition that no special requirement exists, and therefore the envi- ronmental protection is achieved, VOC emission is avoided, and the requirements for environmental friendliness, low carbon and energy conservation are met.
The release paper is applied to the fields of die cutting, CPU heat conduction, electric conduction, communication shielding, carbon fiber manufacturing, pressure-sensitive adhesive tapes and sealing adhesive tapes (including solar photovoltaic sealing adhe- sive tapes).
The present disclosure has the following beneficial effects: The present disclosure provides a high-temperature resistant release paper and a preparation method and an application thereof, compared with the prior art, the present disclosure has the fol- lowing advantages: (1) The present disclosure is reasonable in design, the PE laminating layer with a micropore air-diffusing function is ar- ranged in the release paper, and the PE film layer is mainly made of HDPE, LDPE and modified nano oxide. When the release agent is coated, moisture in the base material volatilizes to generate wa- ter vapor which can be diffused through micropores of the PE lami- nating layer, the quality problems of surface blistering, layering and the like of the PE laminating layer are effectively avoided, and as a result, the quality of the release paper is guaranteed; (2) The preparation process of the release paper is simple and feasible, the shortcoming of low temperature resistance of re- lease paper prepared by conventional preparation methods is over- come. The preparation process can also be used for preparing pres- sure-sensitive adhesive tapes and especially can meet requirements of pressure-sensitive adhesive tapes with high requirements on electronics, automobiles, etc., a lot of catalysts and bridging agents can be saved, product cost can be reduced while product performance is effectively improved, adhesiveness of the adhesive tapes is improved, and weatherability can exceed 10 years; (3) The release paper prepared by the present disclosure has higher temperature resistance than conventional release paper, so the temperature of the release paper in bridging, catalyzing, etc. is increased from 110°C to 130°Ccompared with those of the tradi- tional release paper, the catalyzing and bridging time can be shortened by 20-30% under the same process formula, the production efficiency is improved, and the cost is saved; and practice proves that consumption of the catalysts can be saved by 20% under same production efficiency, or production speed of the release paper is increased by more than 20-30% under the same catalyst condition; (4) The release paper has a wide application prospect in the fields of die cutting, CPU heat conduction, electric conduction, communication shielding, carbon fiber manufacturing, pressure- sensitive adhesive tapes and sealing adhesive tapes.
DETAILED DESCRIPTION OF THE EMBODIMENTS The present disclosure is described in detail in conjunction with embodiments, to facilitate the understanding of the present disclosure by those skilled in the art. It should be particularly noted that the embodiments are only used to further illustrate the present disclosure and cannot be understood as limiting the scope of protection of the present disclosure. Any non-essential im- provements to the present disclosure by those skilled in the art based on the foregoing content herein shall fall within the scope of protection of the present disclosure. Unless otherwise speci- fied, the raw materials mentioned below that are not described in detail are all commercially available products; the process steps or extraction methods not mentioned in detail are process steps or extraction methods known to those skilled in the art.
Example 1 A manufacturing process of high-temperature resistant PEK double-sided release paper comprises the following steps: (1) Preparing a component material of a PE laminating layer with micropores Adding nano silicon dioxide into water, uniformly dispersing, then adding a coupling agent HK550, and reacting for 3-5 h at 200- 250°C; then adding sulfuric acid, and adjusting pH value to be about 5-6; and finally adding n-caprylic anhydride, stirring and reacting for 2-3 h at 100-120°C; and then cooling, filtering, and carrying out centrifugal drying to obtain modified nano silicon dioxide; Wherein, the concentration of nano silicon dioxide in bath is that 400-600 kg of water is added in each cubic meter; Weighing HDPE, LDPE and modified nano silicon dioxide based on the ratio of HDPE to LDPE to modified nano silicon dioxide of 300: 600: 50; firstly placing HDPE and LDPE into a plastic stirrer with an electrostatic field or a stirrer with a stainless steel inner layer subjected to polytetrafluoroethylene spraying treat- ment; stirring for 10-15 min; uniformly stirring HDPE and LDPE; and vibrating and sprinkling modified nano silicon dioxide into a mixed PE material by using a vibration method in the stirring pro- cess until modified nano silicon dioxide is uniformly stirred, thereby obtaining a high-temperature resistant composite material 1; Wherein, the HDPE in the material has a melt index of greater than 5 g/10 min and a melting point of greater than or equal to 135°C; the LDPE adopts resin with a melt index of greater than 6 g/10 min, and nano oxide can be high-purity silicon dioxide (greater than or equal to 99.8%) with a particle size of 20-30 nm and can also be titanium dioxide with a particle size of 20-30 nm; and the coupling agent is a silane coupling agent; (2) Preparing a component material (without a microporous layer) of a common laminating layer Weighing HDPE and HDPE based on the mass ratio of HDPE to
LDPE of 35: 65, placing in the stirrer, and starting the stirrer to uniformly stir to obtain a mixture, wherein the HDPE in the ma- terial has the melt index of greater than 5 g/10 min and the melt- ing point of greater than or equal to 127°C, and the LDPE is resin with the melt index of greater than 6 g/10 min;
(3) Respectively adding the high-temperature resistant compo- site material 1 and the mixture into a feeding barrel capable of heating and drying, and respectively feeding into an extruder A (the composite material 1) and an extruder B {the mixture) in a self-flowing manner;
(4) Respectively setting the temperatures of all sections of the extruder A and the extruder B as follows: the melting tempera- ture is 180-230°C, the compression temperature is 220-270°C, the shearing temperature is 250-290°C, the mixing bridging temperature is 280-320°C, the metering extrusion temperature is 300-340°C, the filtering temperature is 300-340°C, and the screw neck temperature is 300-340°C;
(5) Adjusting the temperature of a die head to be 300-340°C, and correcting the temperature of each area on the die head ac-
cording to the transverse thickness;
(6) Carrying out paper threading according to a paper thread- ing process of a laminating machine, and adjusting the temperature of cooling water to prevent the surface of a cooling wheel from being dewed;
(7) Slowly feeding into the machine for extrusion compound- ing, and paying attention to adjust the pressure of a compounding wheel during extrusion compounding to enable the indentation to be 28-30 mm, otherwise, easily generating a layering phenomenon;
(8) Adjusting the corona discharge power to enable the unit power to reach 1.5-3 W/m°, and carrying out laminating operation after adjustment;
(9) Adjusting a trimming knife, trimming coated paper, roll- ing the trimmed coated paper, and packaging the coated paper for coating a release agent;
(10) Coating the release layer: mounting the laminated paper on an unwinding and winding table of a coating machine, and threading the paper according to a process of the coating machine to coat the release layer; Wherein, the release layer can be made of solvent-free organ- ic silicon, and is coated in a six-roller slip-frequency coating mode, foil gold is added according to a proportion of 40-50 ppm. A formula of Wacker silicone oil is taken as an example, and the proportion can be W910: V90: OL = 10: 0.3: 0.12, or organic sili- con of other manufacturers can be used; and the coating amount is adjusted according to requirements of a customer, and is generally referred to as 0.8-1.5 g/m" of an adhesive tape for the electronic industry, but is finally determined according to physical require- ments of the adhesive layer of the customer; (11) Heating a drying oven of the coating machine, setting the temperature of the drying oven in each area, taking an 8- section * 4 m drying oven as an example, setting the temperature from an inlet of a coating head to 105°C/ 120°C/ 135°C/ 150°C/ 150°C/ 150°C/ 140°C/ 130°C, wherein the temperature setting is different due to factors of a machine table, but the basic setting principle is an upper parabola; (12) After the temperature is increased to be enough, start- ing the coating machine, and checking that the surface temperature of the rolled paper is less than or equal to 35°C at a speed of 140-200 m/min, otherwise, increasing the cooling effect of an out- let of the coating drying oven, and checking whether a coating is rubbed off, delustered, etc.; and (13) Rolling, reserving a sample , performing physicochemi- cal detection, and packaging the material to obtain a finished product 1 of the release paper.
Each physical index of the finished product 1 of the release paper obtained according to the process is shown in Table 1-1.
Table 1-1 Normal tempera- |N/25mm |0.06-0.2 0.06-0.09 HG/T4139- This is a ture release 2010 general sistance re- Ere — Residual adhe- 3 =80 20.5 Better
TT Gloss Sid 78 GB/TS807
IA Sid 72 ar Temperature 110°C/1mi | 130°C/imin GB/T33377- Better Delamination N/cm 20.5 0.65 Better Ta ie A Halo- Cl, Br {g/kg £0.8 0.23 GB/T33377- Better gen Ke 2016 than the Cl+Br $1.5 0.23 limit jl Ze Rolls g/kg 1 ND MDL=0. of all co To 002 hazardous substanc- es PBB 1 ND MDLO. 0
TF Vola- Ben- 0.1 ND MDL=0.
I organ- |Tolu- 1 ND cle pounds Notes: 1. ND means that it is not detected, MDL is method de- tection limit; As shown in Table 1-1, many data are superior to the existing national standards or industry standards. The cost comparison between the traditional process and Exam- ple 1 is shown in Table 1-2.
Table 1-2 Cost comparison of release paper obtained by using Example 1 and traditional process (based on 25 g/m? PE) Item Paper Energy con- | Catalyst | PE Modified Cost com- surface sump- {plati~- silica pari-
EFF ture®C *) pp | Amo | Amount | Amo | Add | Amo | ma) m unt of unt ed unt lami- amo
HEHE Exam- 130 0.008 48 0.0 20%2 0.4 2%2 0.0 0.557
LEE Tradi- 115 0.007 60 0.0 23.5*2 | 0.5 0 0.57 tional *2 56 2 pro- Sl THT Notes: 1. The laminating thickness is 25 pm, the laminating is performed in a double-sided manner;
2. The unit price of PE is an average price of 11 Yuan/kg;
3. The price of modified silica is 18 Yuan/kg;
4. Platinum is 1,950 Yuan/kg at a concentration of 5,000 ppm.
5. The fuel is 3.5 Yuan/m’ pipeline natural gas; and
6. The coating machine is produced by the TIAN NIU Coating Machine.
As shown in Table 1-2, the cost of the double-sided release paper produced by the preparation process of Example 1 is slightly lower than that of the traditional process. At the same time, the most important thing is that the temperature resistance of the re- lease paper is greatly improved, which is conducive to the produc- tion of high-quality pressure-sensitive adhesive tapes for the electronics industry.
Example 2 The difference between Example 2 and Example 1 includes that the mass ratio of HDPE to LDPE to modified nano silica in Example 2 is 650: 350: 100. A finished product 2 of the Example is ob- tained, and it is marked as the finished product 2 of release pa- per.
Each physical index of the finished product 2 of the release paper is shown in Table 2-1.
Table 2-1
Item Unit Stand- {Result Test Method Re- ard mark s Normal tem- Light |N/25mm 0.05-0.06 HG/T4139- Meet perature re- side Ke 2010 cus- lease force Heavy 0.18-0.21 tome Aging re- side r’s sistance re- re- lease force quir Residual ad- Light 0.06-0.07 emen hesion rate side ilk ts Normal tem- Heavy 0.20-0.24 perature re- side lease force Aging re- Light |% 280 88.6 Bet- sistance re- side ter lease force Heavy 91.2 el Gloss Light 76 GB/T8807
ID Heavy 70 IT] Temperature re- 110°C/1 1130°C/1min GB/T33377- Bet- =| - hb )
I Delamination force N/ em 20.5 0.071 Bet-
EN Halogen cl, g/kg £0.8 0.23 GB/T33377- Bet-
TE Cl+Br <1.5 0.23 than
TTT Rots g/kg MDL=0. 002 Lom it stan Hg 1 ND dard cL ë Cr“ 1 ND all cd 0.1 ND ardo 7 :
PBB 1 ND MDLO. 005 sub- TTT : Volatile or- Ben- 0.1 ND pounds Tolu- 1 ND
TT Xy- 1 ND el Notes: 1. ND means that it is not detected, MDL is method de- tection limit.
2. The base material uses NPI78 g/m: yellow paper. In the finished product 2 of the release paper, the release paper is produced according to a release force at a ratio of 1:3.
This release paper is very suitable for the production of pres- sure-sensitive adhesives without base material, such as conductive adhesive tapes, thermal adhesive tapes, VHB adhesive tapes and graphite Olefin adhesive tapes. The cost comparison between the traditional process and Exam- ple 2 is shown in Table 2-2.
Table 2-2 Cost comparison of release paper obtained by using Example 2 and traditional process (based on 25 g/m‘ PE) Item Paper Energy con- Catalyst | PE Modified Cost com surface sump- (plati- silica pari- temper- tion (Yuan/m® ES son {Yuan/ ature®C ) pp | Amo | Amount | Amo | Add | Ame m) m unt of unt ed unt lami- amo - nating "Ee Exam- 130 0.008 48 | 0.0 | 20%2 0.4 {22 | 0.0 | 0.565 = EE EET Tradi- 115 0.007 60 0.0 23.5%2 10.5 0 0.583 tional *2 56 2 pro- zl TI Notes: 1. The laminating thickness is 25 um, the laminating is performed in a double-sided manner;
2. The unit price of PE is an average price of 11 Yuan/kg;
3. The price of modified silica is 18 Yuan/kg;
4. Platinum is 1,950 Yuan/kg at a concentration of 5,000 ppm.
5. The fuel is 3.5 Yuan/m’ pipeline natural gas;
6. The coating machine is produced by the TIAN NIU Coating Machine.
As shown in Tables 2-1 and 2-2, the temperature resistance of the release paper finished product 2 has been improved, but exces- sive addition will lead to an increase in the cost and make the film surface brittle, which does not meet the requirements.
Example 3 The difference between Example 3 and Example 1 includes that the base material selected in Example 3 is Glassine base paper. Because the Glassine paper has a smooth surface and high density, a coating AC agent is added before the corona treatment step. The AC agent is water-based, such as Japan's P-1050 of EPOMIN, and then drying is performed, the oven temperature is set at 90-95°C, the AC agent is dried, then the corona treatment is performed, and the laminating compounding is performed after the corona. Such process greatly improves the interlayer composite force of paper and PE, which fully meets the product requirements, and the ob- tained release paper can obtain good heat resistance, and a fin- ished product 3 of Example 3 is obtained, which is marked as the finished product 3 of release paper. Each physical index of the finished product 3 of the release paper is shown in Table 3-1 Table 3-1 prmal tempera- 25mm 08-0.12
TT hing resistance 10-0.15 I en residual adhesion 0 D.S Etter = TT pmperature L0°C/imin BO°C/imin B/T33377- ptter
FT rr plamination plamina- D.5 65 ptter bree on force hlogen hlogen kg D.8 23 B/T33377- ptter Vie an the mit i, Br ne 23 andards all D b kg D DL=0.002 zardous bstanc- oe oe — mn — — | pbla-— enzene 1 PL=0.005 le dane bluene bm— bunds cL Notes: 1. ND means that it is not detected, MDL is method de- tection limit;
2. The base material uses UPM58g/m’ blue glassine. As shown in Table 3 and Table 3-1, although the glassine pa- per is smooth, the layering force of the laminated paper is quite ideal, the migration of silicon is quite low, the residual adhe- sion rate is high, so it is an ideal release material and can ful- ly meets the requirements of high-performance adhesive tapes such as non-substrate conductive adhesive tape, thermal conductive ad- hesive tape, VHB adhesive tape and graphene adhesive tape. The cost comparison between the traditional process and Exam-
ple 3 is shown in Table 3-2.
Table 3-2 Cost comparison of release paper obtained by using this process and traditional process (based on 25 g/m? PE) Item Paper Energy Cata- PE Modified silica Cost sur- consump- | lyst com- face tion (Yua (plati- pari- vem n/m’) nl son (¥ pera- Pp | Amo | Amoun | Amou | Added | Amount van/m" ture°C p | unt | t of nt amoun } m lami- t natin 9 This 130 0.008 5 0.0 18*2 0.40 4*2 0.14 0.597 pro- 0 | 49 El [EI 2 Tradi- 115 0.007 6 0.0 23.5% 0.52 0.583 tional 0 56 2 pro- * SI | II Notes: 1. The laminating thickness is 25 um, the base materi- al is 78g/m® Glassine paper;
2. The unit price of PE is an average price of 11 Yuan/kg;
3. The price of modified silica is 18 Yuan/kg;
4. Platinum is 1,950 Yuan/kg at a concentration of 5,000 ppm.
5. The fuel is 3.5 Yuan/m’ pipeline natural gas; and
6. The coating machine is produced by the TIAN NIU Coating Machine.
As shown in Tables 3-1 and 3-2, the cost of the double-sided release paper 3 produced by the preparation process of Example 3 is slightly lower than that of the traditional process. At the same time, the most important thing is that the temperature re- sistance of the release paper is greatly improved, which is condu- cive to the production of high-quality pressure-sensitive adhesive tapes for the electronics industry and meets the production re- quirements.
Those of ordinary skill in the art can make several simple deductions or substitutions without creative work without depart- ing from the concept of the present disclosure. Therefore, simple improvements to the present disclosure made by a person skilled in the art according to the disclosure of the present disclosure shall fall within the protection scope of the present disclosure.
The foregoing embodiments are preferred embodiments of the present disclosure, and all processes similar to the present disclosure and equivalent changes made shall fall within the protection scope of the present disclosure.
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