NL2011638C2 - Integrated circuit package. - Google Patents

Integrated circuit package. Download PDF

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Publication number
NL2011638C2
NL2011638C2 NL2011638A NL2011638A NL2011638C2 NL 2011638 C2 NL2011638 C2 NL 2011638C2 NL 2011638 A NL2011638 A NL 2011638A NL 2011638 A NL2011638 A NL 2011638A NL 2011638 C2 NL2011638 C2 NL 2011638C2
Authority
NL
Netherlands
Prior art keywords
integrated circuit
circuit package
sensor
mechanical
package
Prior art date
Application number
NL2011638A
Other languages
Dutch (nl)
Inventor
Jurgen Leonardus Theodorus Maria Raben
Original Assignee
Sencio B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sencio B V filed Critical Sencio B V
Priority to NL2011638A priority Critical patent/NL2011638C2/en
Priority to PCT/NL2014/050697 priority patent/WO2015057058A2/en
Priority to US15/030,289 priority patent/US9754913B2/en
Priority to CN201480057243.7A priority patent/CN105849896B/en
Priority to EP14790767.9A priority patent/EP3058589B1/en
Application granted granted Critical
Publication of NL2011638C2 publication Critical patent/NL2011638C2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Magnetic Variables (AREA)

Description

Integrated circuit package Field of the invention
The present invention relates to an integrated circuit package comprising an integrated circuit, external connection elements connected to the integrated circuit, and a package material enclosing the integrated circuit.
Prior art
Such an integrated circuit package is known from European patent publication EP-A-2 090 873 of applicant. In the embodiments shown here, the integrated circuit may comprise various components, such as a sensor assembly with a sensor surface, a carrier element for holding the sensor assembly and further associated components, such as processing electronics (IC or ASIC).
Summary of the invention
The present invention seeks to provide an improved integrated circuit package, allowing more robust and reliable operation of the integrated circuit package, e.g. as a complete sensor package with a sensor, such as a pressure, temperature or position sensor.
According to the present invention, an integrated circuit package according to the preamble defined above is provided, the integrated circuit package further comprising a mechanical element allowing a mechanical connection of a further element to the integrated circuit package. The mechanical element can be of an open type (through hole) or a closed version type.
By adding such a mechanical element in an integrated circuit package, further functional capabilities, external connection implementations, and low-cost solutions can be provided for integrated circuit packages, especially for integrated circuit packages including a sensor. The external connection elements are e.g. bended leads, leads, pins, lead pads, solder balls, connection-holes, etc.
In an embodiment, the mechanical element is selected from the group consisting of: an attachment element; a mechanical element with a(n internal) thread; a bushing element; a bearing element; an electrical connector. This allows various connections to be implemented with an integrated circuit package, ranging from mechanical to electrical connections.
The integrated circuit package may comprise a sensor element connected to the integrated circuit in a further embodiment, wherein the mechanical element is not providing an external communication channel to the sensor element. E.g. the external communication channel may be provided in a part of the integrated circuit package where it cannot interfere with the mechanical element of the present invention embodiments.
In a further embodiment, the mechanical element is attached to a structural element of the integrated circuit package, such as a lead frame, a support frame, a ceramic substrate or a multi chip module. This results in an improved strength of the total integrated circuit package, and allows a more easy assembly process for molding the package.
The mechanical element is suspended in the integrated circuit package in an even further group of embodiments. This may be implemented in an embodiment, wherein the package material is formed by a two step molding process. No functional relationship is then present between mechanical element and sensor element of other (structural) parts of the integrated circuit package.
In a further embodiment, the integrated circuit package further comprises a sensor element connected to the integrated circuit, and a communication channel to the sensor element is provided via the suspended mechanical element. This allows external connection of further elements, such as tubing, to allow external environmental elements, e.g. external air, to reach the sensor surface.
The mechanical element may be provided with an external interface surface in a further embodiment, and the integrated circuit package material is present (e.g. molded) around the remaining external surface of the mechanical element. This allows a good mechanical interface with further components outside the integrated circuit package, yet also allows proper protection of the covered parts of the mechanical element.
In an exemplary embodiment, the mechanical element is a bearing element, and the integrated circuit package further comprising a sensor inside the package, an external connection axis supported by the bearing element, and a sensor activation element attached to the external connection axis. The sensor may be a Hall or magneto-restrictive sensor, and the sensor activation element is an active-type element (such as a magnet or magnetized element) or a passive-type element (whereby the magnetization is replaced by a tooth structure).
Short description of drawings
The present invention will be discussed in more detail below, using a number of exemplary embodiments, with reference to the attached drawings, in which
Fig. 1 shows a perspective view of a first embodiment of the present invention;
Fig. 2 shows a perspective view of a second embodiment of the present invention;
Fig. 3 shows a perspective view of a third embodiment of the present invention;
Fig. 4 shows a perspective view of an alternative of the third embodiment of the present invention;
Fig. 5 shows a perspective view of an even further embodiment of the present invention;
Fig. 6 shows a three dimensional view with a part cut-out view of the embodiment of Fig. 5; and
Fig. 7A-C show a cross sectional view of further embodiments of the present invention.
Detailed description of exemplary embodiments
Fig. 1 to 3 each show an embodiment of an integrated circuit package according to the present invention. The package comprises an integrated circuit and external connection elements 3 connected to the integrated circuit inside the package (e.g. using bond wires or flip chip). The external connection elements 3 can be connected to an electrical circuit on e.g. a printed circuit board.
Package material 2 of the integrated circuit package 1 encloses the integrated circuit tightly, thereby providing protection. The integrated circuit package further comprises a mechanical element 5, 6, 7 allowing a mechanical connection of a further element to the integrated circuit package 1. The further element is e.g. a cooling body or attachment element(s) for such a cooling body, an electrical connector (e.g. a (mini-) USB connector, a guiding element for alignment purposes, or an axis as part of a sensor assembly.
The surprising technical effect of the presence of the mechanical element 5, 6, 7 is that the integrated circuit package 1 can be mechanically mounted and/or centered and/or electrically connected to other parts or subassemblies. The mechanical element 5, 6, 7 provides robust mechanical fixation on next level assemblies and/or onto other elements such as cooling blocks. Further electrical connections can also be made through the mechanical element 6, for example, the mechanical element 6 may provide an electrical connection to a power supply, further electronics, a computer etc. The mechanical element 6 in the form of an electrical connector can be implemented in many variants, such as the USB connector mentioned above, or e.g. a wire-connection (known in the field as e.g. ’schneidklemmtechnik’).
In an embodiment, the mechanical element 5, 6, 7 is selected from the group consisting of: an attachment element 5; a mechanical element 5 with a thread; a bushing element; a bearing element 7; an electrical connector 6.
In typical embodiments, the package material 2 is a duroplast plastic material for providing solid anchoring and encapsulation of the mechanical element 5, 6, 7.
In an embodiment, the attachment element 5 may be a snap fit connector for a rapid and easy connection. In a further embodiment, the mechanical element 5 may be a standardized bolt or nut, so that the mechanical element 5 may comprise an internal and/or external threaded part.
The integrated circuit package 1 can then be robustly mounted and attached to other subassemblies. This embodiment may also be advantageous in view of vibratory environments, where the external connection elements 3 and/or a delicate sensor inside the integrated circuit packages 1 cannot sustain long periods of harsh vibrations. A firm fixation though a mechanical element 5 having a threaded part may resolve this issue.
In addition to the fixation/vibration solution the mechanical element 5 can function as a cooling element as well. The heat generated by the integrated circuit element 4 e.g. a IGBT or MOSFET can be dissipated to the ambient via the mechanical element 5 acting as a heat sink.
In further embodiments, centering the integrated circuit package 1 with respect to other parts or subassemblies is readily accomplished by a mechanical bushing element 5, e.g. a guide bushing. Such a bushing element 5 provides high precision centering of the integrated circuit package 1 but may allow for some rotational and linear sliding movement with respect to a connecting element disposed in the bushing element 5.
For example, the integrated circuit package 1 may comprise a position sensor and should be able to move with respect to e.g. a connecting element slidably disposed inside the bushing element. Further, the integrated circuit package 1 may be subjected to temperature and/or pressure changes, so that allowing for some sliding movement of the mechanical bushing element 5 with respect to a connecting element disposed therein may minimize stress and strain forces inside the integrated circuit package 1 as a result of such temperature and/or pressure changes.
In certain situations the integrated circuit package 1 is intended to be connected to various different external devices. In an embodiment, the mechanical element 6 may comprise an electrical connector for utilizing standard communication protocols for an external device, e.g. USB, FireWire, HDMI etc. Embedding such an electrical connector 6 in the integrated circuit package 1 avoids additional external connecting element 3, thereby simplifying e.g. a printed circuit board (PCB) onto which the integrated circuit package 1 may be mounted. The mechanical element 6 in the form of an electrical connector 6 may thus provide supplemental functionality that need not be implemented into a PCB onto which the integrated circuit package 1 is mounted.
In further embodiments, the mechanical element 7 may be a mechanical bearing element 7 allowing a shaft or axis to be rotatably mounted in the integrated circuit package 1. Such a mechanical bearing element 7 may be particular advantageous in case the package 1 comprises e.g. a position sensor, e.g. a rotational (Magneto Resistive) MR sensor type, wherein rotating a connecting element inside the bearing 7 with respect to the integrated circuit package 1 measures a rotation of said package 1 with respect to the connecting element inside the bearing 7.
The type of mechanical element 5, 6, 7 used may be determined by a particular application of the integrated circuit package 1. For example, in case the package 1 comprises a temperature or pressure sensor, fixation through a mechanical threaded element 5 may be desired. Should the integrated circuit package 1 comprise a mechanical motion sensor, embedding a mechanical bearing element 7 is advantageously used.
It is also possible that the mechanical element 5, 6, 7 is chosen based on an assembly process. For example, having a mechanical bushing element 5 embedded in the integrated circuit package 1 may facilitate the use of pick-and-place robots for handling the integrated circuit package 1. In such an application a robot may slidably insert a pin element inside the bushing 5 and slidably rotate/orientate the integrated circuit package 1 with respect to e.g. a PCB.
In the embodiments of Fig. 1 to 3, the integrated circuit package 1 may further comprise an external communication channel through the package material 2 for exposing a sensing surface of a sensor element inside the package 1 to the outside environment, thereby facilitating e.g. temperature and/or pressure measurements. Such an external communication channel is conveniently provided by an embedded (hollow) mechanical element 5 in the package material 2, such as a nut and/or or guide bushing which typically comprise a bore running there through. The bore of the mechanical element 5 then comprises at least in part the external communication channel.
In a further embodiment of an integrated circuit package 1, the package 1 comprises a sensor element 20 connected to the integrated circuit, and the mechanical element 5, 6, 7 is not providing an external communication channel to the sensor element 20. In this embodiment, the mechanical element 5, 6, 7 is embedded in the package material 2 away from the sensor element 20, i.e. in no direct contact with the sensor die or sensor surface of the sensor element 20. This may be possible when the sensor element 20 does not require a direct exposure to the outside environment through an external communication channel. This embodiment is particular suitable for a sensor element 20 utilizing field phenomena, such as a magnetic and/or electric field, which easily penetrate the package material 2. In an alternative to this embodiment, the sensor element 20 is in communication with the external environment using an external communication channel routed away from the mechanical element 5, 6, 7 (e.g. via a back side of the package 1).
According to a further invention embodiment, the mechanical element 5, 6, 7 is suspended in the integrated circuit package 1. In this embodiment the mechanical element 5, 6,7, is in a suspended arrangement with respect to the package material 2, so that the mechanical element is solely supported by package material 2 and does not come into contact with a structural element 22, sensor element 20, or the external connecting elements (e.g. lead frame) 21 in the integrated circuit package 1.
Suspending the mechanical element 5, 6, 7 solely in package material 2 reduces the risk of damaging internal parts the package 1, such as sensitive and delicate sensing materials and/or various electronics. This embodiment may be accomplished using a two-stage process, as explained in greater detail with reference to Fig. 7 below.
Fig. 4 shows another embodiment of the integrated circuit package 1 of the present invention. In this embodiment, the mechanical element 7 has an external interface surface 7a and the package material 2 is present (e.g. molded) around the remaining external surface of the mechanical element 7. In this embodiment the interface surface 7a (e.g. parallel to a main surface of the integrated circuit package 1) remains free from package material 2, so that said surface 7a may abut against another surface part or subassembly. This embodiment is advantageous in case a snug and precise fit of the mechanical element 5, 6, 7 against another surface part is required, as might be the case when the mechanical element 5, 6, 7, is implemented as a bearing element 7.
In a further embodiment, the integrated circuit package 1 comprises a projection 2a of package material 2, wherein the mechanical element 5, 6, 7 is at least in part embedded in the projection 2a distal to the integrated circuit package 1. The projection allows for an offset of the mechanical element 5, 6, 7, with respect to the integrated circuit package 1.
Fig. 5 and 6 show embodiments of the integrated circuit package 1 of the present invention, wherein the mechanical element 5, 6, 7 is a bearing element 7, and the integrated circuit package 1 further comprises a sensor element 20 inside the package 1, an external connection axis 15 supported by the bearing element 7, and a sensor activation element 17 attached to the external connection axis 15. The external connection axis 15 is attached to an external housing 16 and configured for rotating the activation element 17. The activation element can be an active-type (magnetized) or passive-type whereby the magnetization is replaced by a tooth structure. In further embodiments the external connection axis 15 is provided with a cog 18 for rotation thereof, allowing a mechanical connection to an external subassembly in a simple and reliable manner. The external connection axis 15 (and hence mechanical element 7 in the form of a bearing element) may penetrate entirely through the integrated circuit package 1, or alternatively, may be present only on one side (closed version of the mechanical element) of the integrated circuit package 1.
In an embodiment, the sensor element 20 is a Hall or magneto-restrictive (MR) sensor and the sensor activation element 17 is a magnet. Here the mechanical element 7 need not provide a direct external communication channel to the outside environment as the sensor element 20 senses a magnetic field change between north and south poles penetrating the package material 2.
In the embodiment of Fig. 5 and 6, the mechanical element 5, 6, 7 is attached to a structural element 22 of the integrated circuit package 1, such as a lead frame, a support frame, a (ceramic or PCB) substrate or a multi chip module. Having the mechanical element 5, 6, 7, in direct contact with the structural element 22 may provide further strength to the embedded arrangement of the mechanical element 5, 6, 7 in the package material 2.
Fig. 7 shows a cross sectional view of an integrated circuit package 1 according to a further embodiment. The package 1 comprises external connector elements 3 (cf. embodiments of Fig. 1-3), such as a lead frame, electrically connected to an integrated circuit element 4 through one or more bonding wires 3a. The integrated circuit element 4 typically comprises an IC chip and/or a semiconductor die having a sensitive surface area 4a, wherein the sensing surface 4a is exposed to the outside environment through an external communication channel 8.
The package material 2 forming the integrated circuit package 1 is formed in a two-step process. First, the integrated circuit element 4, lead frame 3 and bonding wires 3a are enclosed by package material (e.g. using a molding process), where the communication channel 8 towards the sensor surface 4a is kept free from packaging material, and a first package part 2b is formed. The mechanical element 5 (having a bore running there through) is then positioned on top of the first package part 2b and aligned with the external communication channel 8 (thus extending the external communication channel 8) at least in part. In the second step, package material is again added to a further mold on top of the first package part 2b, thus forming the second package part 2c. When viewed from the sensing surface 4a, the external communication channel 8 is then defined by the first package part 2b, the bore of the mechanical element 5, and the second package part 2c.
This first package material layer 2b is particularly advantageous in cases where the mechanical element 5 should not come into direct contact with a delicate integrated circuit element 4 and/or sensing surface 4a. To that end, the mechanical element 5 is disposed on the first package material layer 2b instead, resulting in an offset from the integrated circuit element 4 and/or sensing surface 4a by a predefined distance d.
Offsetting the mechanical element 5 may reduce any form of interference with the IC element 4 and or sensing surface 4a for improving measurement accuracy.
In the embodiment shown in Fig. 7 A, the integrated circuit element 4 is suspended in package material 2 and electrically connected to the external connector elements 3 through the one or more bonding wires 3a. In a further embodiment the integrated circuit element 4 may also be supported by the external connecting elements 3, such as a lead frame. In yet a further embodiment, the integrated circuit package 1 comprises a substrate 4b (e.g. a ceramic or glass substrate, possibly as part of a multi chip module, MCM). and the integrated circuit element 4 is supported thereby. A further embodiment is shown in Fig 7B, which shows a suspended mechanical element 5 by using the two step molding. In this case there is no contact with the semiconductor element 4 or a sensor element/sensing surface 4a nor a carrier 4b (lead frame, PCB, ceramic etc). An even further embodiment is shown in Fig 7 C, which depicts a suspended mechanical element 5 by using the two step molding. In this case the mechanical element 5 is a closed version type (in this case a closed off bottom).
The above embodiments where the mechanical element 5 is a mechanical connection element, such as an element with an internal screw thread, may be advantageously used in an integrated circuit package 1 with a sensor element 4 and an external communication channel 8. Alternatively, the mechanical element 5 is provided with an internal diameter larger than the sensor surface 4a (or even larger than sensor die 4), and attached to an underlying lead frame 3 or other structural frame element. This would still provide an external communication channel 8 that can be connected to a further element (e.g. a flexible conduit or tubing) and still providing an air tight space to the sensor surface 4a.
The invention can be described as a number of embodiments:
Embodiment 1. Integrated circuit package comprising an integrated circuit, external connection elements (3) connected to the integrated circuit, a package material (2) enclosing the integrated circuit, and a mechanical element (5, 6, 7) allowing a mechanical connection of a further element to the integrated circuit package (1). Embodiment 2. Integrated circuit package according to embodiment 1, wherein the mechanical element (5, 6, 7) is selected from the group consisting of: an attachment element (5); a mechanical element (5) with a thread; a bushing element; a bearing element (7); an electrical connector (6).
Embodiment 3. Integrated circuit package according to embodiment 1 or 2, wherein the integrated circuit package further comprises a sensor element (20) connected to the integrated circuit, and the mechanical element (5, 6, 7) is not providing an external communication channel to the sensor element (20).
Embodiment 4. Integrated circuit package according to any one of embodiments 1-3, wherein the mechanical element (5, 6, 7) is attached to a structural element (22) of the integrated circuit package (1), such as a lead frame, a support frame, a ceramic substrate or a multi chip module.
Embodiment 5. Integrated circuit package according to any one of embodiments 1-4, wherein the mechanical element (5, 6, 7) is suspended in the integrated circuit package (1).
Embodiment 6. Integrated circuit package according to embodiment 5, wherein the package material (2) is formed by a two step molding process.
Embodiment 7. Integrated circuit package according to embodiment 5 or 6, wherein the integrated circuit package further comprises a sensor element (20) connected to the integrated circuit, and a communication channel (8) to the sensor element (20) is provided via the suspended mechanical element (5, 6, 7).
Embodiment 8. Integrated circuit package according to any one of embodiments 1-7, wherein the mechanical element (7) has an external interface surface (7a), and the integrated circuit package material (2) is present around the remaining external surface of the mechanical element (7).
Embodiment 9. Integrated circuit package according to any one of embodiments 1-8, wherein the mechanical element (5, 6, 7) is a bearing element (7), and the integrated circuit package (1) further comprising a sensor (20) inside the package (1), an external connection axis (15) supported by the bearing element (7), and a sensor activation element (17) attached to the external connection axis (15).
Embodiment 10. Integrated circuit package according to embodiment 9, wherein the sensor (20) is a Hall or magneto-restrictive sensor.
Embodiment 11. Integrated circuit package according to embodiment 9 or 10, wherein the sensor activation element (17) is an active-type element or a passive-type element.
The present invention embodiments have been described above with reference to a number of exemplary embodiments as shown in the drawings. Modifications and alternative implementations of some parts or elements are possible, and are included in the scope of protection as defined in the appended claims. The integrated circuit package 1 (and its contents) may be one of many types, and includes but is not limited to the following examples: a dual-in line package (DIL), surface mount device (SMD) package, ball grid array (BGA) package, land grid array (LGA), quad flat no-leads (QFN) package, dual flat no-leads (DFN) package, etc.

Claims (11)

1. Verpakking voor geïntegreerde schakeling, omvattende een geïntegreerde schakeling, externe verbindingselementen (3) die verbonden zijn met de geïntegreerde schakeling, een verpakkingsmateriaal (2) dat de geïntegreerde schakeling omsluit, en een mechanisch element (5, 6, 7) waarmee een mechanische verbinding mogelijk is van een verder element met de verpakking voor geïntegreerde schakeling (1).An integrated circuit package comprising an integrated circuit, external connecting elements (3) connected to the integrated circuit, a packaging material (2) enclosing the integrated circuit, and a mechanical element (5, 6, 7) with which a mechanical connection of a further element to the integrated circuit package (1) is possible. 2. Verpakking voor geïntegreerde schakeling volgens conclusies 1, waarbij het mechanische element (5, 6, 7) wordt gekozen uit de groep die omvat: een bevestigingselement (5); een mechanisch element (5) met een schroefdraad; een buselement; een lagerelement (7); een elektrische connector (6).The integrated circuit package according to claim 1, wherein the mechanical element (5, 6, 7) is selected from the group comprising: a fastening element (5); a mechanical element (5) with a thread; a bus element; a bearing element (7); an electrical connector (6). 3. Verpakking voor geïntegreerde schakeling volgens conclusie 1 of 2, waarbij de verpakking voor geïntegreerde schakeling verder een sensorelement (20) omvat dat verbonden is met de geïntegreerde schakeling, en waarbij het mechanische element (5, 6, 7) geen extern communicatiekanaal naar het sensorelement (20) verschaft.The integrated circuit package according to claim 1 or 2, wherein the integrated circuit package further comprises a sensor element (20) connected to the integrated circuit, and wherein the mechanical element (5, 6, 7) does not have an external communication channel to the sensor element (20). 4. Verpakking voor geïntegreerde schakeling volgens één van de conclusies 1-3, waarbij het mechanische element (5, 6, 7) gekoppeld is aan een structureel element (22) van de verpakking voor geïntegreerde schakeling (1), zoals een lead-frame, een draagframe, een keramisch substraat of een multi-chip module.An integrated circuit package according to any of claims 1-3, wherein the mechanical element (5, 6, 7) is coupled to a structural element (22) of the integrated circuit package (1), such as a lead frame , a supporting frame, a ceramic substrate or a multi-chip module. 5. Verpakking voor geïntegreerde schakeling volgens een van de conclusies 1-4, waarbij het mechanische element (5, 6, 7) zwevend is opgenomen in de verpakking voor geïntegreerde schakeling (1).The integrated circuit package according to any of claims 1-4, wherein the mechanical element (5, 6, 7) is floatingly incorporated in the integrated circuit package (1). 6. Verpakking voor geïntegreerde schakeling volgens conclusie 5, waarbij het verpakkingsmateriaal (2) wordt gevormd door een tweestaps vormproces.The integrated circuit package according to claim 5, wherein the package material (2) is formed by a two-step forming process. 7. Verpakking voor geïntegreerde schakeling volgens conclusie 5 of 6, waarbij de verpakking voor geïntegreerde schakeling verder een sensorelement (20) omvat dat verbonden is met de geïntegreerde schakeling, en een communicatiekanaal (8) naar het sensorelement (20) is verschaft via het zwevende mechanische element (5, 6, 7).The integrated circuit package according to claim 5 or 6, wherein the integrated circuit package further comprises a sensor element (20) connected to the integrated circuit, and a communication channel (8) to the sensor element (20) is provided via the floating mechanical element (5, 6, 7). 8. Verpakking voor geïntegreerde schakeling volgens een van de conclusies 1-7, waarbij het mechanische element (7) een extern interfaceoppervlak (7a) heeft, en het verpakkingsmateriaal (2) van de verpakking voor geïntegreerde schakeling aanwezig is rondom het resterende buitenoppervlak van het mechanische element (7).An integrated circuit package according to any of claims 1-7, wherein the mechanical element (7) has an external interface surface (7a), and the packaging material (2) of the integrated circuit package is present around the remaining outer surface of the mechanical element (7). 9. Verpakking voor geïntegreerde schakeling volgens een van de conclusies 1-8, waarbij het mechanische element (5, 6, 7) een lagerelement (7) is, en de verpakking voor geïntegreerde schakeling (1) verder een sensor (20) in de verpakking (1), een externe verbindingsas (15) die wordt ondersteund door het lagerelement (7), en een sensoractiveringselement (17) dat gekoppeld is aan de externe verbindingsas (15) omvat.The integrated circuit package according to any of claims 1-8, wherein the mechanical element (5, 6, 7) is a bearing element (7), and the integrated circuit package (1) further comprises a sensor (20) in the package (1), an external connection axis (15) supported by the bearing element (7), and a sensor activation element (17) coupled to the external connection axis (15). 10. Verpakking voor geïntegreerde schakeling volgens conclusie 9, waarbij de sensor (20) een Hall of magnetorestrictieve sensor is.The integrated circuit package according to claim 9, wherein the sensor (20) is a Hall or magnetorestrictive sensor. 11. Verpakking voor geïntegreerde schakeling volgens conclusie 9 of 10, waarbij het sensoractiveringselement (17) een actief type of passief type element is.The integrated circuit package according to claim 9 or 10, wherein the sensor activation element (17) is an active type or passive type element.
NL2011638A 2013-10-18 2013-10-18 Integrated circuit package. NL2011638C2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL2011638A NL2011638C2 (en) 2013-10-18 2013-10-18 Integrated circuit package.
PCT/NL2014/050697 WO2015057058A2 (en) 2013-10-18 2014-10-07 Integrated circuit package
US15/030,289 US9754913B2 (en) 2013-10-18 2014-10-07 Integrated circuit package
CN201480057243.7A CN105849896B (en) 2013-10-18 2014-10-07 Integrated antenna package
EP14790767.9A EP3058589B1 (en) 2013-10-18 2014-10-07 Integrated circuit package

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