NL2007676C2 - SYSTEM FOR COOLING ELECTRONIC EQUIPMENT. - Google Patents

Description

Q.2KX45

SYSTEM FOR COOLING ELECTRONIC EQUIPMENT

The invention relates to a system for cooling electronic equipment which is arranged in at least two electronic racks, wherein the electronic racks are arranged at a distance from one another, while leaving a corridor, on a surface in an electronic space. Such an electronic space is in practice often referred to as "data center" or computer space, while in practice such racks are also referred to as "racks".

Such a system is for instance known from the

U.S. Patent No. 2010/0067193 (IBM). In recent decades, computers have played an increasing role in society, both in the private and public sectors. So-called "data centers" can now be found in every sector, such as the medical, education, communications, business, financial, and transportation sectors. Such data centers can take up one room or floor or even an entire building. Electronic equipment, such as, for example, so-called "servers", is usually included in the data centers in so-called "racks" or racks or racks. The racks often have standard dimensions, wherein each rack is usually made up of four vertical rails, two pairs of rails arranged opposite each other defining a rectangular space. The vertical rails contain several holes in the longitudinal direction into which supports can be fitted to mount the electronic equipment in the rack. Arranging 2 electronic equipment in racks in this way means that a large amount of heat is generated, with the risk of overheating of the electronic equipment, with all the adverse consequences that this entails. It is therefore necessary to cool the air in a data center.

A drawback of the prior art is that the cooling in the data centers often takes place in an energetically unfavorable manner, whereby the cooling of the computers takes place in an inefficient manner.

The object of the invention is to improve the state of the art and for this purpose a system of the type according to the invention mentioned in the preamble has the special feature that the system comprises an air treatment device which is adapted to supply cold air from outside the electronics room to supply the electronics room. The air treatment device is preferably adapted to supply outside air to generate the cold air, the air treatment device in particular being adapted to cool the outside air adiabatically, to humidify it adiabatically, to exchange recuperative energy and / or to mix it with the hot air from the electronic equipment. In particular, there is continuous air circulation, in which cold air is supplied by the air treatment device (using an air supply device to be discussed below) and hot air is discharged through the air treatment device.

In a preferred embodiment of a system according to the invention, the air treatment device is adapted to supply the cold air from outside the electronics room with a temperature ranging between 14 and 15 ° C, preferably approximately 14 ° C, to the electronics room. In particular, the air treatment device is also adapted to suck in hot air from the electronic equipment with a temperature ranging between 30 and 40 ° C, preferably approximately 35 ° C, to generate the cold air. The present system seeks in this preferred variant to make the temperature difference between the cold air and the warm air as large as possible within the limits of the standards (ASHREA) in order to minimize the air transport and therefore the consumption of the transport energy and the dimensions. of the system as small as possible, wherein the temperature of the warm air and the cool air is kept at least substantially constant (35 and 14 ° C, respectively).

In a further preferred embodiment of a system 20 according to the invention the air treatment device functions in the following six working areas: working area A: a condition of the outside air with an enthalpy of greater than or equal to 42 kJ / kg; - working area B: a condition of the outside air with a temperature higher than or equal to 14 ° C and an enthalpy lying between 34 kJ / kg and 42 kJ / kg; - working area C: a condition of the outside air with a temperature lower than or equal to 14 ° C and a moisture content greater than or equal to 5.3 g / kg; - working area D: a condition of the outside air with a temperature higher than or equal to 14 ° C and an enthalpy lying between 28 kJ / kg and 34 kJ / kg; 4 - working area E: a condition of the outside air with a temperature higher than or equal to 8 ° C, an enthalpy lower than or equal to 28 kJ / kg and a moisture content lower than or equal to 5.3 g / kg; 5 - working area F: a condition of the outside air with a temperature lower than or equal to 8 ° C and a moisture content lower than or equal to 5.3 g / kg.

In a further preferred embodiment of a system 10 according to the invention, the air treatment device is formed by at least two sub-devices operating independently of each other. In that case, therefore, for the sake of safety, there is a "dual system".

15

In a further preferred embodiment of a system according to the invention, the system comprises an air supply device, wherein the air supply device forms a separate unit and is arranged near the corridor, the air supply device being adapted to blow cold air from outside the electronic space into the corridor, and wherein the air supply device is adapted to control the amount of cold air that is blown into the corridor in dependence on a measured temperature of warm air in the corridor originating from the electronic equipment. The box-shaped unit is preferably mounted on a ceiling of the electronics room above the corridor. The cold air is therefore cooler than the warm air, while the warm air is warmer than the cold air.

In a preferred embodiment of a system according to the invention, the air supply device 5 comprises air quantity controls for mixing the cold air in a mixing chamber with the hot air from the electronic equipment and blowing the resulting cool air into the corridor and air displacing means to heat the air into sucking in the mixing chamber. In particular, there are control means for controlling the air flow rate (the amount of air displaced per unit of time, expressed in for example m3 / h) of the air volume controls of the cold air in dependence on the measured temperature of warm air in the corridor originating from the electronic equipment and the air flow from the displacement means of the warm air by controlling the speed of, for example, fans in dependence on the desired inlet temperature of the cool air. In particular, the speed of the fans is controlled here. In other words, the fans run faster or slower if the measured temperature exceeds or falls below a predetermined value. In another preferred variant, 20 fans are switched on or off to increase or decrease the air flow.

In a further preferred embodiment of a system according to the invention, the air supply device is adapted to blow cool air with a temperature varying between 18 and 27 ° C, preferably approximately 18 ° C, into the corridor.

In a further preferred embodiment of a system according to the invention, the air supply device 30 is adapted to mix cold air from outside the electronics room and hot air from the electronic equipment in the mixing chamber of the air supply device, wherein the air supply device is arranged to mix the air mixture with blowing a temperature ranging between 18 and 27 ° C, preferably about 18 ° C, in the cool passage.

In a further preferred embodiment of a system according to the invention, the air supply device is adapted to suck in the hot air from the electronic equipment in the mixing chamber, wherein the hot air with a temperature varying between 30 and 40 ° C, preferably approximately 35 ° C, is sucked into the mixing chamber.

In a further preferred embodiment of a system according to the invention, the cold air from outside the electronics room has a temperature ranging between 14 and 15 ° C, preferably approximately 14 ° C.

The invention will be further elucidated with reference to a schematic technical drawing of a preferred variant of the system according to the invention.

The technical drawing distinguishes a system for cooling computers that are arranged in two racks 1,2. As shown, the racks 1,2 are arranged on a floor of a data center, spaced apart 25 from each other, while leaving a cool corridor 3. The system is provided with an air supply device 4 which is arranged in the corridor 3 as a separate unit. The air supply device 4 is adapted to mix cold air with a temperature of approximately 14 ° C from outside the data center and warm air from the computers in a mixing chamber 5. The warm air is hereby sucked into the mixing chamber 5 at a temperature of approximately 35 ° C. The air mixture 7 formed in the mixing chamber 5 with a temperature of approximately 18 ° C is then blown through the air supply device 4 into the corridor 3. For sucking in the hot air use is made of fans 6 and for supplying the cold air from control valves. Control means 7 are provided for controlling the speed of the fans 6. This may be necessary if the measured temperature of the cool mixed air from the cold air outside the electronics room and the measured temperature of the warm air from the electronic equipment becomes too high or too low. For example, if the temperature in the corridor 3 threatens to be lower than 18 ° C, the speed is increased and if the temperature in the corridor 3 threatens to become higher than 18 ° C, the speed is reduced. Arrows indicate the air flow.

The system further comprises an air treatment device 8 which is adapted to supply the cold air with a temperature of approximately 14 ° C to the air supply device 4. In this preferred variant, the air treatment device consists of two identical sub-devices 9 and 10 operating independently of each other. Both devices supply outside air to generate the cold air with a temperature of approximately 14 ° C. The outside air is hereby adiabatically cooled, adiabatically humidified, recuperatively exchanged energy and / or mixed with the warm air from the electronic equipment. This will be further explained below with reference to one of the devices 9,10.

In working area A, outside air is adiabatically cooled, whereafter a recuperative heat wheel 11 is used to transfer 8 recovered cold to warm return air (i.e. warm, drawn-in air with a temperature of approximately 35 ° C from the computers). The precooled return air is subsequently postcooled in a cooling battery 12 to approximately 14 ° C. It is important that no moisture is released from the outside air to the return air. The working area A applies for an outdoor air condition with an enthalpy greater than or equal to 42 kJ / kg.

10

In working area B the following conditions apply to the outside air: temperature higher than or equal to 14 ° C and an enthalpy lying between 34 kJ / kg and 42 kJ / kg. The outside air is adiabatically cooled to about 14 ° C and supplied directly to the air supply device 4. The outside air is therefore used immediately and not mixed with the warm return air.

Working area C applies to the following conditions for the outside air: temperature lower than or equal to 14 ° C and a moisture content greater than or equal to 5.3 g / kg. The outside air has a sufficiently low temperature and a sufficient moisture content to be mixed with the warm return air up to around 14 ° C. The air mixture is then supplied to the air supply device 4.

In working area D, the following conditions apply to the outside air: temperature higher than or equal to 14 ° C and an enthalpy lying between 28 kJ / kg and 34 kJ / kg. The outside air now has a too low moisture content, while the temperature thereof is too high to be able to use the outside air directly. The outside air and the return air are mixed until the resulting air mixture has an enthalpy 9 of approximately 34 kJ / kg. The air mixture is then adiabatically moistened to approximately 14 ° C. Finally, the air mixture is fed to the air supply device 4.

5 In working area E, the following conditions apply to the outside air: temperature higher than or equal to 8 ° C, an enthalpy less than or equal to 28 kJ / kg and a moisture content less than or equal to 5.3 g / kg. The outside air now has a too low moisture content, while the temperature thereof is too high to be able to use the outside air directly. The outside air is first adiabatically cooled and humidified to a moisture content of approximately 5.5 g / kg. The resulting air is then mixed with the warm return air to approximately 14 ° C. Finally, the air mixture is supplied to the air supply device 4.

Working area F applies to the following conditions for the outside air: temperature lower than or equal to 8 ° C and a moisture content lower than or equal to 5.3 g / kg. The outside air has a sufficiently low temperature and an insufficient moisture content, i.e. the outside air is sufficiently cold, but too dry. To keep the moisture within the data center, recirculation is complete, so that the outside air is not mixed with the warm return air. The heat wheel 11 is used to supply recovered cold to the warm return air, without humidification taking place. The air is finally directed to the air supply device 4.

It is noted that the invention is not limited to the described preferred variant, but also extends to other variants that fall within the scope of the appended claims.

Claims (14)

A system for cooling electronic equipment which is arranged in at least two electronic racks, wherein the electronic racks are arranged at a distance from one another, leaving a corridor free, on a surface in an electronic space, characterized in that the system comprises an air treatment device adapted to supply cold air from outside the electronics room to the electronics room. 2. System as claimed in claim 1, wherein the air treatment device is adapted to supply outside air to generate the cold air. 3. System as claimed in claim 1 or 2, wherein the air treatment device is adapted to adiabatically cool the outside air, to humidify it adiabatically, to exchange recuperative energy and / or to mix it with the warm air originating from the electronic equipment. System as claimed in claim 1, 2 or 3, wherein the air treatment device is adapted to supply the cold air from outside the electronics room with a temperature ranging between 14 and 15 ° C, preferably approximately 14 ° C, to the electronics room. 30 System as claimed in any of the foregoing claims 1 to 4, wherein the air treatment device is adapted to suck in hot air from the electronic equipment with a temperature ranging between 30 and 40 ° C, preferably approximately 35 ° C, to generate the largest possible temperature difference. A system according to any one of the preceding claims 1 to 5, wherein the air treatment device functions in the following six working areas: - working area A: a condition of the outside air with an enthalpy greater than or equal to 42 kJ / kg; 10. working area B: a condition of the outside air with a temperature higher than or equal to 14 ° C and an enthalpy lying between 34 kJ / kg and 42 kJ / kg / - working area C: a condition of the outside air with a temperature lower than or equal to 14 ° C and a moisture content greater than or equal to 5.3 g / kg; - working area D: a condition of the outside air with a temperature higher than or equal to 14 ° C and an enthalpy lying between 28 kJ / kg and 34 kJ / kg; - working area E: a condition of the outside air with a temperature higher than or equal to 8 ° C, an enthalpy less than or equal to 28 kJ / kg and a moisture content less than or equal to 5.3 g / kg; - working area F: a condition of the outside air with a temperature lower than or equal to 8 ° C and a moisture content smaller than or equal to 5.3 g / kg. 7. System as claimed in any of the foregoing claims 1 to 6, wherein the air treatment device is formed by at least two sub-devices acting independently of each other. A system according to any one of the preceding claims 1 to 7, wherein the system comprises an air supply device, wherein the air supply device forms a separate unit and is arranged close to the corridor, the air supply device being arranged to bring cold air from outside the electronic space into the to blow a corridor, and wherein the air supply device is arranged to control the amount of cold air that is blown into the corridor in dependence on a measured temperature of warm air in the corridor originating from the electronic equipment. 10 9. System as claimed in claim 8, wherein the air supply device comprises air volume controls for mixing the cold air in a mixing chamber of the air supply device with the warm air originating from the electronic equipment and blowing the cool air created by mixing in the corridor, and also contains air displacing means for sucking in the warm air in the mixing chamber. 10. System as claimed in claim 9, wherein the air supply device comprises control means for controlling the air flow rate of the cold air in dependence on the measured temperature of the hot air in the corridor coming from the electronic equipment and controlling the air flow rate of the hot air by the speed of fans depending on the desired inlet temperature of the cool air created by mixing. 11. System as claimed in claim 8, 9 or 10, wherein the air supply device is adapted to blow the cool air with a temperature varying between 18 and 27 ° C, preferably approximately 18 ° C, in the corridor. 12. System as claimed in any of the foregoing claims 8 to 11, wherein the air supply device is adapted to suck in the hot air originating from the electronic equipment in the mixing chamber, wherein the air supply device is adapted to supply hot air with a temperature varying between 30 and 40 ° C, preferably approximately 35 ° C, to be sucked into the mixing chamber. A system according to any one of the preceding claims 1 to 10, wherein the cold air from outside the electronics room has a temperature ranging between 14 and 15 ° C, preferably approximately 14 ° C.