NL2005457C2

NL2005457C2 - Silicone containing encapsulant.

Info

Publication number: NL2005457C2
Application number: NL2005457A
Authority: NL
Inventors: Tsung-Yi Chao; Wen-Jeng Lee; Der-Gun Chou; Yen-Cheng Li; Meng-Huang Yan
Original assignee: Everlight Usa
Priority date: 2010-10-05
Filing date: 2010-10-05
Publication date: 2012-04-06

Description

SILICONE CONTAINING ENCAPSULANT

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an encapsulant composition and, more particularly, to an encapsulant composition that can be used for a solid state light emitting device .

5 2. Description of Related Art

In the recent years, light emitting diodes (LEDs) have been widely used in many electronic devices such as LCD back-light sources, large displaying devices, and light illuminating equipment. Hence, demands for LEDs with high 10 brightness have increased. Owing to the environmental requirement of various LED application, an encapsulant composition suitable for being used in light emitting devices should have certain characteristics such as being homogeneous, having high transparency, and being capable of long 15 term storage capacity in order to resist to the high temperature when a large electrical current is applied. Conventional transparent encapsulant materials used in LEDs include epoxy or silicone resins, in which the cost of silicone resin is high though it has superior optical 20 characteristics. In contrast, epoxy resin has been widely used due to its low cost. However, epoxy resin has a serious problem that yellowing occurs when it is used as the encapsulant composition of the LEDs. The yellowing of the epoxy resin, caused by the high temperature of the high 25 power operation may influence the transmittance to the short-wavelength light and causing color shift. Therefore, epoxy resin is limited in its application for being used in a high current and high temperature operating environment .

2

The anti-yellowing of the encapsulant composition such as the epoxy resin is usually obtained by adding an antioxidant. The added antioxidant can remove the peroxide radical to stop the chain reaction, or reduce the degrada-5 tion speed of the polymers by decomposing the hydroperoxide generated during the degradation. However, it is proved that the anti-yellowing obtained by adding of the antioxidant cannot be satisfactory for long operating time of the LEDs, not only suitable anti-oxidant is hard to 10 find but also some anti-oxidants have high volatility that may result in a migration problem within the encapsulant material.

Besides, internal stress caused by high temperature during high power operation may contribute negative influ-15 ence to the semiconductor element, cause a short circuit, and reduce the brightness of the applied LEDs. Therefore, for reducing the internal stress of the encapsulant composition, US Patent No. 5,145,889 has disclosed four methods, which comprise: (1) decreasing the glass transition 20 temperature (Tg) of the encapsulant composition; (2) decreasing the linear expansion coefficient of the encapsulant composition; (3) decreasing the Young's modulus of elasticity(E); and (4) decreasing the shrinkage factor(8). In general, decreasing of the glass transition temperature 25 (Tg) will lower the mechanical strength of the encapsulant at high temperature; decreasing of the Young's modulus of elasticity will dramatically decrease the adhesion of the encapsulant to chip, board, or lead frame ; besides if the amount of filler increase significantly, the viscosity of 3 0 the encapsulant will increase too much and is unfavorable to the workability.

In US Patent No. 6,800,373, an encapsulant composition is disclosed, which comprises silicone resin, low molecular weight of alicyclic compounds, aromatic com-35 pounds, hetero-cyclic compounds which having epoxy resin functional group, and siloxane surfactant. However, the optical transparency is unsatisfactory, and the siloxane surfactant is neither involved in the reaction nor does it 3 form a homogeneous mixture with common epoxy encapsulant composition.

Therefore, it is desirable to provide an improved encapsulant composition that can be used for a solid state 5 light emitting device to achieve low internal stress and better anti-yellowing performance.

SUMMARY OF THE INVENTION

10 An object of the present invention is to provide an encapsulant composition for a solid state light emitting device, such as LEDs, which can overcome the problems of yellowing and achieve low internal stress in a long term high temperature operation conditions.

15 To achieve the object, the present invention provide an encapsulant composition comprising: (a) 30 to 60 weight% of an epoxy resin; (b) 30 to 60 weight% of an acid anhydride curing agent; (c) 0.1 to 30 weight% of a Carbi- nol siloxane resin which can form a homogeneous mixture 20 with the said (a) and (b) ; and (d) 0.1 to 5 weight% of a reactive UV absorber and/or a reactive hindered amine light stabilizer (HALS).

Also, the present invention provides another encapsulant composition comprising: (a) 30 to 60 weight% of an 25 epoxy resin; (b) 30 to 60 weight% of an acid anhydride curing agent; (c) 0.1 to 30 weight% of a Carbinol siloxane resin which can form a homogeneous mixture with the said (a) and (b); (d) 0.01 to 3.0 weight% of a curing accelerator; (e) 0.1 to 5 weight% of a reactive UV absorber; and 30 (f) 0.1 to 5 weight% of a reactive hindered amine light stabilizer (HALS). Additionally a reactive anti-oxidant and a phosphor containing flame retardant can be selectively used.

Besides, the present invention also· provides a sili-35 cone containing encapsulant composition comprising: (a) 30 to 60 weight% of an epoxy resin; (b) 30- to 60 weight% of an acid anhydride curing agent; (c) 0.1 to 30 weight% of a Carbinol siloxane resin which can form a homogeneous mix- 4 ture with the said (a) and (b) ; (d) 0.1 to 5 weight% of a normal ÜV absorber; and (e) 0.1 to 5 weight% of a normal hindered amine light stabilizer (HALS).

5 BRIEF DESCRIPTION OF THE DRAWINGS

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The object, technique features, and advantages ac-10 cording to the present invention will explain later in more detail.

The present invention provide an encapsulant composition for a solid state light emitting device, such as LEDs, which can achieve low internal stress, and provide 15 better anti-yellowing performance with long term and high temperature operation. Under the presence of epoxy resin and acid anhydride, the present invention introduce a Car-binol siloxane resin to lower the hardness and the internal stress while curing the epoxy resin composition; in 20 addition, the use of Carbinol siloxane resin can prevent the encapsulant from cracking and overcome the problem of low adhesion. The adding of the UV absorber and the hindered amine light stabilizer (HALS) having reactive group may contribute to the increasing of the anti-yellowing 25 ability of the encapsulant.

The addition of Carbinol siloxane resin is to react with the unreacted acid anhydride to reduce the yellowing caused by the unreacted acid anhydride left after the polymerization óf epoxy resin and acid anhydride, if any. 30 Also, the Carbinol siloxane resin can react with the reactive group of the epoxy resin to increase the elasticity of the encapsulant. Furthermore, any unreacted Carbinol siloxane resin left can serve as a filler to reduce the linear expansion coefficient of the encapsulant. According 35 to the present invention, the Carbinol siloxane resin is a compound of the following formula: 5 R2 \ ƒ R2 \ (R4)3Si-0--Si-o-jj— Si— θ4 Si(R4)3 \ I A ' ly R3 (CH2)n (V)m

OH

r wherein (F^COm is an alkylene oxide group (when m=l) or a poly(alkylene oxide) group (when m>l); and R1 independ-5 ently represents a linear and branched divalent radical selected from - C2H4 - , - C3H6 - , - C4Hs - . It is to be noted that when m is greater than 1, e.g., 2 or more, the alkylene oxide groups can be the same or different and can form poly(alkylene oxide) homopolymers, random copolymers 10 and block copolymers.

R2 and R3 are independently H or C1-C2 alkyl; R4is H or C1-C2 alkyl and is the same with or different from R2; x is an integer of 1 to 100; y is an integer of 1 to 100; n is an integer of 1 to 5; and m is an integer of 1 to 40.

15 Though the Carbinol siloxane resin is advantageous in lower internal stress and linear expansion coefficient, it may not solving all the yellowing problems, therefore by addition of a UV absorber and/or a hindered amine light stabilizer (HALS) having reactive group would be helpful. 20 By controlling the amount of the Carbinol siloxane resin being used, the reactive ÜV absorber containing an OH or a COOH reactive group may react with the encapsulant to form a polymeric UV absorber. Hence, the volatilization due to the migration of the low molecular weight UV absorbers can 25 be reduced, then the long lasting performance of the UV absorber can be enhanced. Since the anti-yellowing performance of this type encapsulant has been substantially increased, therefore, the long lasting requirement for LEDs can be satisfied.

6

The encapsulant composition of the present invention comprises: (a) 30 to 60 weight% of an epoxy resin; (b) 30 to 60 weight% of an acid anhydride curing agent; (c) 0.1 to 30 weight% of a Carbinol siloxane resin 5 which can form a homogeneous mixture with the said (a) and (b) ; and (d) 0.1 to 5 weight% of a reactive ÜV absorber or a reactive hindered amine light stabilizer (HALS). Also, the present invention provides another encapsulant composition comprising: (a) 30 to 60 weight% of an epoxy resin; 10 (b) 30 to 60 weight% of an acid anhydride curing agent; (c) 0.1 to 30 weight% of a Carbinol siloxane resin which can form a homogeneous mixture with the said (a) and (b) ; (d) 0.01 to 3.0 weight% of a curing accelerator; (e) 0.1 to 5 weight% of a reactive UV absorber; and (f) 0.1 to 5 15 weight% of a reactive hindered amine light stabilizer (HALS). Additionally a reactive anti-oxidant and a phosphor containing flame retardant can be selectively used.

The encapsulant composition of the present invention comprises an epoxy resin and a curing agent as the primary 20 components, a Carbinol siloxane resin for reducing the internal stress of the encapsulant, and a UV absorber or a hindered amine light stabilizer (HALS) having reactive group, additionally a reactive anti-oxidant and a phosphor containing flame retardant can be selectively added to en-25 hance a better anti-yellowing performance. According to the encapsulant composition of the present invention, the (a) epoxy resin may be an aromatic epoxy resin, an ali-cyclic epoxy resin, or a silicone modified epoxy resin; the (b) acid anhydride curing agent may be methyl hexahy-30 drophthalic anhydride (MHHPA) or hexahydrophthalic anhydride (HHPA); the (c) Carbinol siloxane . resin may be a compound of following formula: 35 7 R2 / R2 \ 4 1 ƒ I \ 4 (R4)3Si-0--Si--0---Si— O--Si(R4)3 ' I \ ly R3 ( CH2 )n ( or1) ' I 'm

OH

r wherein (F^O)m is an alkylene oxide group (when m=l) or a poly(alkylene oxide) group (when m>l); and R1 independ-5 ently represents a linear and branched divalent radical selected from - C2H4 - , - C3H6 -, - C4H8 - . It is to be noted that when m is greater than 1, e.g., 2 or more, the al kylene oxide groups can be the same or different and can form poly(alkylene oxide) homopolymers, random copolymers 10 and block copolymers. R2 and R3 are independently H or C— C2 alkyl; and R4 is H or Ci-C2 alkyl and is the same with or different from R2. According to a preferred embodiment of the present invention, R2 and R4 may be both methyl. X is an integer of 1 to 100; y is an integer of 1 to 100; n 15 is an integer of 1 to 5; and m is an integer of 1 to 40.

For example, commercially-available products such as Silwet L-7608, CoatOSil 7604, BYK-373, BYK-377, and TEGO- PREN 5842 can serve as the Carbinol siloxane resin herein. According to another encapsulant composition of the pre-20 sent invention, besides the epoxy resin and curing agent as the primary components being used, a Carbinol siloxane resin may be further included to reduce the internal stress of the encapsulant, and a reactive UV absorber or a reactive hindered amine light stabilizer (HALS) having re-25 active group may be selectively added simultaneously. Also, a reactive anti-oxidant and a phosphor containing flame retardant can be selectively used to enhance antiyellowing performance of the encapsulant. The detail information of the (a) epoxy resin, the (b) acid anhydride 8 curing agent, and the (c) Carbinol siloxane resin are described as above. The (d) curing accelerator may be a tetra-alkyl ammonium salt such as tetra-ethylammonium bromide or tetra-n-butylammonium bromide; or a tetra-alkyl 5 phosphonium salt such as tetra-ethylphosphonium bromide, tetra-n-butylphosphonium bromide, methyltri- butylphosphonium iodide, methyltri-n-butylphosphonium di-methylphosphate, or tetra-ethylphosphonium tetrafluorobo-rate. The reactive UV absorber may be a compound of the 10 following formula: HO r rr\>i X (CH2)pCO(OR50)q(R5)OH HO r CC/^ X(ch2)wcooh / or HO r X(CH2)xOH .

15 wherein p, q, w, x are each independently an integer of 1 to 5; R is H or Ci-C8 alkyl; R5 is a C2-C4 alkyl with straight chain or branched chain. The (f) reactive hindered amine light stabilizer (HALS) may be a compound of 20 the following formula: (CH2)yOH 1 r ch3 9 wherein y is an integer of 0 to 8.

Besides, the reactive anti-oxidant and the phosphor containing flame retardant can serve as additives to enhance anti-yellowing performance of the encapsulant. The phos-5 phor containing flame retardant may be, for example, triphenylphosphite and 3, 4:5, 6-Dibenzo-2H-l,2- oxaphosphorin-2-oxide.

The encapsulant composition of the present invention is advantageous in many aspects, such as (1) low internal 10 stress, due to the adding of the Carbinol siloxane resin; (2) excellent anti-yellowing performance, due to the adding of the UV absorber or the hindered amine light stabilizer (HALS) having reactive group and the adding of the reactive anti-oxidant and phosphor containing flame retar-15 dant; and (3) long lasting of anti-yellowing performance by forming polymeric UV absorber and/or polymeric hindered amine light stabilizers in situ, thus avoid the possibility of decreasing UV absorbers contain due to the migration and high volatility of common low molecular weight UV 20 absorbers and/or hindered amine light stabilizers.

[Example 1] [Formulation for table 1] main components_

Samples__El__E2__E3__E4

Epoxy resin (wt%) 52.4 51.2__50.3__48.5 acid anhydride curing 47.6 47.5 47.0 46.1 agent(wt%)_____

Carbinol siloxane 1.3 · 2.7 5.4 resin A (wt%)_____ 25

The epoxy resin used herein is Bisphenol A Diglycidyl ether (NPEL-128E, purchased from Nan Ya Plastics Company), the acid anhydride curing agent used herein is methylhexa-hydrophthalic anhydride (MHHPA), and the Carbinol siloxane 30 resin A used herein is Silwet L-7608 (purchased from GE Silicone Company).

10

Tetra alkyl phosphonium salt(curing accelerator) was added into curing agent (such as MHHPA in Tablel) at room temperature and stirring to form a solution(about 0.5 hour), additional components were then added and stirred 5 to get a homogenous mixture. The resulting resin mixture was heated at 120°C for 1.5 hours and then heated at 140°C for 3.5 hours to be cured.

Films thus formed were subjected to the thermal mechanical analysis (TMA, Perkin Elmer DMA7e) to measure 10 their internal stress (c^/oii) values at a testing temperature of 25 to 250°C with the heating speed of 5°C/min. Results are listed in table 1 below.

[Table 1]_____

Samples El E2 E3 E4 αχ 61.1 62.98 73.20 79.74 a.2 187.5 176.08 191.23 192.0 (α2/αι) 3.07 2.80 2.61 2.41 15 [Example 2] [Formulation for table 2] main components_

Samples__E5__E6__E7__E8 epoxy resin (wt%)__52.4 51.4__50.7__49.1 acid anhydride curing 47.6 47.3 46.6 45.4 agent(wt%)____

Carbinol siloxane 1.3 2.7 5.5 resin B(wt%)_____

Following the same procedure as described in Examplel, except the Silwet L-7608 was replaced by CoatOSil 20 7604 (purchased from GE Silicone Company). The internal stress (α2/οίι) values measured are as shown in table 2 below .

11 [Table 2]_____

Samples E5 E6 E7 E8 ot! 61.1 71.2 70.0 80.0 <x2 187.5 191.2 182.6 183.9 (aa/ax) 3.07 2.69 2.61 2.30 [Example 3] [Formulation for table 3] main components_

Samples__E9__ElO__Ell_' E12 epoxy resin (wt%)__52.4__51.4_ 50.7 49.3

Acid anhydride curing 47.6 47.3 46.6 45.3 agent(wt%)_____ carbinol siloxane 1.3 2.7 5.4 resin C(wt%)_____ 5

Following the same procedure as described in Example 1, except the Carbinol siloxane resin C was BYK-373 (purchased from BYK Company) , and the internal stress (02/0(1) values measured are as shown in table 3 below.

10 [Table 3]_____

Samples E9 E10 Ell E12 : αχ 61.1 82.9 83.9 89.7 a2 187.5 208.0 201.8 _____194.7 (a2/«i) 3.07 2.51 2.41 2.17

According to the results shown in the above tables 1 to 3, it is believed that the use of the Carbinol siloxane resin A, B, and C can reduce the hardness of the epoxy resin and 15 reduce the internal stress caused by the' different thermo expansion coefficients of the organic material and the inorganic material. In detail, the internal stress (02/01) 12 values decrease when the content of the Carbinol siloxane resin increases. The difference between the thermo expansion coefficients below and over the glass transition temperature decreases, which means the internal 5 stress is efficiently reduced and the problem of cracking of the encapsulant and short circuit of the electronics can be overcome.

[Example 4] 10 [Formulation for table 4] main components_ E14 El5 E13

Samples (experiment (control (blank) ___group)__group) epoxy resin (wt%)_ 46.8 46.7 46.7

Carbinol siloxane 5.2 5.1 5.1

Resin A(wt%) acid anhydride curing 48 48 48 agent(wt%) reactive UVA(wt%) - 0.2 normal type UVA(wt%) - - 0.2

The epoxy resin used herein is Bisphenol A Diglycidyl ether (NPEL-128E, purchased from Nan Ya Plastics Company), the Carbinol siloxane resin A is Silwet L-7608 (purchased 15 from GE Silicone Company), the acid anhydride curing agent used herein is methylhexahydrophthalic anhydride (MHHPA), the reactive UVA (UV absorber) used herein is SV8A (make by Everlight Chemical Industrial Corp.), and the normal type UVA used herein is EV81 (purchased from Everlight 20 Chemical Industrial Corp.).

Ccv??" CH2CH2COOH (chemical structure of SV8A) 13 HO V—

C&Q

^ CHaCHaCOOCgHn (chemical structure of EV81)

The resin mixtures were prepared similar to the procedure described in the Example 1, except the curing time was heated at 120°C for 2 hours and then heated at 140°C for 4 hour .

10 The films (thickness of 3mm) made from the example 4 are then placed in a QUV Accelerated Weathering Tester (Model QUV/SE with solar Eye Irradiance Control), and the testing conditions were temperature of 70°C; 340nm; and 1.35w/m2. A spectrophotometer (SPECTROPHOTOMETER CM-3500d 15 /MINOLTA) is used to measure the yellowness index (YI) for before and after the exposure of UV lights, in which AYI= YI/t-YI/to- Results are listed in table 4 below.

[Table 4] 168 hours 336 hours 168 hours 336 hours vt/ of light of light of light of light judg samples ii/to , expo- exposure exposure exposure ment ___sure/YI /YI__/ ΔΥΙ ' / ΔΥΙ__

E13 _ NOT

(blank) ?2 7.49 14.13 8.21 14.85 PASS

E14 (experi

ment , 0.57 1.63 2.52 1.06 1.95 PASS

group) E15

(con- · NOT

trol 0.68 2.37 3.80 1.69 3.12 PASS

group)_____ 20 14

In the above table 4, "NOT PASS" means ΔΥΙ value >3.00 after 336 hours of light exposure; "PASS" means ΔΥΙ value <3.00 after 336 hours of light exposure.

5 [Example 5] [Formulation for table 5] main components_ E17 E18 E16 (experi-

Samples (control (Blank) ment group) __group)__ epoxy resin (wt%) 4 6.8__46.6__46.6_

Carbinol siloxane 5.2 5.1 5.1

Resin A(wt%)_______ acid anhydride 48 48 48 curing agent(wt%)____ normal type ^ 0 0.2 0.2 UVA(wt%)____ reactive hindered amine light stabi- - 0.1 lizer (wt%)____ normal type hindered amine light - - 0.1 stabilizer (wt%)____

Using the similar procedure as described in Example 1, the effect of hindered amine light stabilizers were measured. 10 The reactive hindered amine light stabilizer in the present example is IA38 (purchased from Nantong City Zhenxing Fine Chemical Co.,Ltd., China, the normal type hindered amine light stabilizer is EV77 (purchased from Everlight Chemical Industrial Corp.). The measured ΔΥΙ values are as 15 shown in table 5 below.

-P co c co Φ c Ρ 0-1 en co co τί B co co p o c < 'I i 12 Dj O) ° ï p ra -P co ld

P 40 O M 00 LD LD

CD 3 & di>H · Γ-

CO O -Η X <3 «T

n £ H (1) \ H O rH

o ω υ u

P

ra -p co

P 43 O H rH 00 LD

OD 3 o a>c CM CM O

CD O -Η X <

H 3 H 4) M 00 O O

ÏÏ ° s rH £ ra -P ra oo P 43 o t—i σι o cd p ion Oh η · ^ σι OO O -Η X >h "sf

OO 43 <—i CU i—I t—I i—I

4H

°

>H

ra +j i \ p 43 O Φ σο r~ o co 3 !? ft M c’ σ uo

CD O -Η X P

γΗ43ΉΦΚ!0'00 o DJ

5 O' -=31 LD

\ . f"

M O

>J i O O

Ά

P

O — U Oh

Cn p

O

•P p c en Φ Ë rp

1 1 CO -—- *H O

c° Φ Ai P P

rH G Φ -P

® &, (Ö pj G

g ^r-ir-xoDO

rM CÖ rH £} rH φ tH O

co W—'W— w—' 16

In the above table 5, "NOT PASS" means ΔΥΙ value >3.00 after 336 hours of light exposure; "PASS" means ΔΥΙ value <3.00 after 336 hours of light exposure.

According to the results indicated in the above tables 4 and 5 5, it had shown that adding the UVA and hindered amine light stabilizer (HALS) with reactive group can achieve an excellent anti-yellowing efficiency. Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and 10 variations can be made without departing from the scope of the invention as hereinafter claimed.

Claims

A silicone-containing encapsulation composition comprising: (a) 30 to 60% by weight of an epoxy resin; (b) 30 to 60% by weight of an acid anhydride curing agent; (c) 0.1 to 30% by weight of a Carbinol siloxane resin that can form a homogeneous mixture with (a) and (b); and (d) 0.1% to 5% by weight of a reactive UV absorber or a reactive hindered amine light stabilizer (HALS).

2. A silicone-containing encapsulating composition according to claim 1, wherein the epoxy resin is selected from the group consisting of an aromatic epoxy resin, an alicyclic epoxy resin or a silicone-modified epoxy resin.

3. The silicone-containing encapsulating composition of claim 1, wherein the acid anhydride curing agent is selected from the group consisting of methyl hexahydrophthalic anhydride (MHHPA) or hexahydrophthalic anhydride (HHPA).

4 I ƒ I \ 4 (R 4) 3 Si-O - Si-O---- Si-0 - Si (R 4) 3 x / y R 3 (CH 2) n (or 1) 2 OH in which (Β} θ) m stands for an alkylene oxide group when m = 1 or for a poly (alkylene oxide) group when m> 1; R 1 independently represents a linear and branched bivalent radical selected from -C 2 H 4 -, -C 3 H 6 - and -C 4 H 8 -; when m is greater than 1, the alkylene oxide groups are the same or different and form poly (alkylene oxide) homopolymers, statistical copolymers, and block copolymers; R 2 and R 3 independently represent H or C 1 -C 2 alkyl; R 4 represents H or C 1 -C 2 alkyl and is equal to or different from R 2; x is an integer from 1 to 100; y is an integer from 1 to 100; n is an integer from 1 to 5; and m is an integer from 1 to 40.

The silicone-containing encapsulation composition according to claim 1, wherein the Carbinol siloxane resin is a compound of the following formula: R2 / R2

The silicone-containing encapsulating composition according to claim 1, wherein the reactive UV absorber is at least one selected from the compounds of the following formulas: HO R 0: / - X (CH 2) p CO (0 R 50) q (R 5) 0 H 20 HO r (CH 2) w COOH and HO r ¢ 1 / - (CH 2) x OH wherein p, q, w, x are each independently an integer from 1 to 5; R represents H or C 1 -C 8 alkyl; R 5 represents straight chained or branched C 2 -C 4 alkyl.

The silicone-containing encapsulation composition of claim 1, wherein the reactive hindered amine light stabilizer is (HALS): (CH 2) y OH ch 3 wherein y is an integer from 0 to 8.

The silicone-containing encapsulation composition according to claim 1, further comprising 0.01 to 3.0% by weight of a curing accelerator, wherein the curing accelerator is selected from the group consisting of a tetraalkylammonium salt and a tetraalkyl phosphonium salt.

The silicone-containing encapsulation composition of claim 1, further comprising 0.1 to 5% by weight of a reactive antioxidant and / or phosphorus-containing flame retardant.

The silicone-containing encapsulation composition of claim 1, wherein the silicone-containing encapsulation composition is used in LED encapsulation.

10. Silicone-containing encapsulation composition; comprising: (a) 30 to 60% by weight of an epoxy resin; (b) 30 to 60% by weight of an acid anhydride curing agent; (c) 0.1 to 30% by weight of a Carbinol siloxane resin that can form a homogeneous mixture with (a) and (b); (D) 0.01% to 3.0% by weight of a cure accelerator; (E) 0.1 to 5% by weight of a reactive UV absorber; and (f) 0.1 to 5% by weight of a reactive hindered amine light stabilizer (HALS).

The silicone-containing encapsulation composition of claim 10, wherein the cure accelerator is selected from the group consisting of a tetraalkylammonium salt and a tetraalkylphosphonium salt.

The silicone-containing encapsulation composition 10 according to claim 10, wherein the reactive UV absorber is at least one selected from the compounds of the following formulas: HO r CO-Q (CH 2) p CO (0 R 50) q (R 5) 0 H 15 HO r 00¾ X (ch 2) wcooh and HO r 00¾ (CH 2) x OH wherein p, q, w, x are each independently an integer from 1 to 5; R represents H or C 1 -C 6 alkyl; R 5 represents straight chained or branched C 2 -C 4 alkyl.

13. A silicone-containing encapsulation composition according to claim 10, wherein the reactive hindered amine light stabilizer (HALS) is the compound of the following formula: (CH 2) y OH y ^ n'K ch 3 wherein y is an integer from 0 to 8 .

The silicone-containing encapsulation composition of claim 10, further comprising 0.1 to 5% by weight of a reactive antioxidant and / or phosphorus-containing flame retardant.

An epoxy encapsulation composition comprising: (a) 30 to 60% by weight of an epoxy resin; (b) 30 to 60% by weight of an acid anhydride curing agent; (c) 0.1% to 5% by weight of a reactive UV absorber or a reactive hindered amine light stabilizer (HALS); and (d) 0.1 to 5% by weight of a reactive antioxidant and / or phosphorus-containing flame retardant.

17. Epoxy-containing encapsulation composition according to claim 16, wherein the reactive UV absorber is at least one selected from the compounds of the following formulas: HO r \ = ((CH 2) p CO (0 R 50) q (R 5) 0 H 25 HO r ¢ 1 / ¾ (CH 2) w COOH and HO r (CH 2) x OH wherein p, q, w, x are each independently an integer from 1 to 5, R is H or C 1 -C 8 alkyl, R 5 is C 2 - Straight chained or branched CU alkyl.

The epoxy-containing encapsulating composition according to claim 16, wherein the reactive hindered amine light stabilizer is (HALS): (CH 2) y OH 10 ch 3 wherein y is an integer from 0 to 8.

A silicone-containing encapsulating composition comprising: (a) 30 to 60% by weight of an epoxy resin; (B) 30 to 60% by weight of an acid anhydride curing agent; (c) 0.1 to 30% by weight of a Carbinol siloxane resin that can form a homogeneous mixture with (a) and (b); (d) 0.1 to 5% by weight of a normal UV absorption agent; and (e) 0.1% to 5% by weight of a normal hindered amine light stabilizer (HALS). -o-o-o-