NL2001672C2 - Touch sensitive display. - Google Patents
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- NL2001672C2 NL2001672C2 NL2001672A NL2001672A NL2001672C2 NL 2001672 C2 NL2001672 C2 NL 2001672C2 NL 2001672 A NL2001672 A NL 2001672A NL 2001672 A NL2001672 A NL 2001672A NL 2001672 C2 NL2001672 C2 NL 2001672C2
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Classifications
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
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- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
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- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
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- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G06F2203/04808—Several contacts: gestures triggering a specific function, e.g. scrolling, zooming, right-click, when the user establishes several contacts with the surface simultaneously; e.g. using several fingers or a combination of fingers and pen
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
Description
TOUCH-SENSITIVE DISPLAY
Field of the Invention
[0001] This relates generally to input devices for computing systems, and more particularly, to a mutual-capacitance multi-touch sensor panel capable of being fabricated 5 on a single side of a substrate.
Background of the Invention
[0002] Many types of input devices are presently available for performing operations in a computing system, such as buttons or keys, mice, trackballs, touch sensor panels, joysticks, touch screens and the like. Touch screens, in particular, are becoming 10 increasingly popular because of their ease and versatility of operation as well as their declining price. Touch screens can include a touch sensor panel, which can be a clear panel with a touch-sensitive surface. The touch sensor panel can be positioned in front of a display screen so that the touch-sensitive surface covers the viewable area of the display screen. Touch screens can allow a user to make selections and move a cursor by simply 15 touching the display screen via a finger or stylus. In general, the touch screen can recognize the touch and position of the touch on the display screen, and the computing system can interpret the touch and thereafter perform an action based on the touch event.
[0003] One limitation of many conventional touch sensor panel technologies is that they are only capable of reporting a single point or touch event, even when multiple 20 objects come into contact with the sensing surface. That is, they lack the ability to track multiple points of contact at the same time. Thus, even when two points are touched, these conventional devices may only identify a single location, which is typically the average between the two contacts (e.g. a conventional touchpad on a notebook computer provides such functionality). This single-point identification is a function of the way 25 these devices provide a value representative of the touch point, which is generally by providing an average resistance or capacitance value.
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[0004] Some state-of-the-art touch sensor panels can detect multiple touches and near touches (within the near-field detection capabilities of their touch sensors) occurring at about the same time, and identify and track their locations. Examples of these so-called “multi-touch” sensor panels are described in Applicant's co-pending U.S.
5 Application No. 10/842,862 entitled "Multipoint Touchscreen," filed on May 6,2004 and published as U.S. Published Application No. 2006/0097991 on May 11, 2006, the contents of which are incorporated by reference herein.
[0005] Multi-touch sensor panel designs having row and column traces formed on the bottom and top sides of an Indium Tin Oxide (ITO) substrate (referred to herein as 10 double-sided ITO or DITO multi-touch sensor panels), can be expensive to manufacture.
One reason that DITO multi-touch sensor panels can be so expensive to manufacture is that thin-film processing steps must be performed on both sides of the glass substrate. However, because current fabrication machinery is designed to process only one side of a substrate as it is moved along by rollers, belts, or other means, special steps must be taken 15 to protect the processed side of the substrate while being transported face down through the fabrication machinery. For example, a protective layer (e.g. photoresist) can be formed over a first processed side of the substrate while a second unprocessed side is being processed, to be removed after completion of the processing of the second side.
[0006] Another reason that DITO touch panels can be expensive is the cost of flex 20 circuit fabrication and bonding. As shown in FIG. 1, DITO multi-touch sensor panel 100 can have column traces 102 that can terminate at a short edge 104 of substrate 106, requiring flex circuit 124 having wide flex circuit portion 108 extending the full width of the short edge that can bond to bond pads 110 on the top side of the substrate.
[0007] In addition, it is undesirable to have column and row traces 102 and 112, 25 respectively, cross over each other at bonding areas 114, or bond pads 110 and 118 on directly opposing sides of substrate 106 because such areas would generate unwanted stray mutual capacitance and coupling of signals. Therefore, row traces 112, which can be routed to the same short edge 104 of substrate 106 using metal traces 116 running along the borders of the substrate, can be routed to pads 118 at the extreme ends of the 30 substrate. This in turn can require wide flex circuit portion 120 extending the full width 3 of the short edge that can bond to bond pads 118 on the bottom side of the substrate.
Even so, a grounded shield layer 122 can be formed along with bond pads 118 on the bottom side of substrate 106 and directly opposing bond pads 110 to reduce stray mutual capacitance.
5 [0008] Because both connector ends of flex circuit 124 can be approximately the full width of the short edge of substrate 106, a large flex circuit 124 can be required. Moreover, the actual step of bonding flex circuit 124 to opposite sides of the same short edge 104 of substrate 106 can create bonding reliability issues due to the potential for excessive heat and pressure.
10 [0009] By comparison, the flex circuit of a conventional liquid ciystal display (LCD) assembly can be generally much narrower than the short edge of its substrate, can bond to only one side of a substrate (which makes for much easier bonding), and can be much smaller because it does not need to span the entire width of the substrate and connect to both sides of the substrate.
15 Summary of the Invention
[0010] This relates to a substantially transparent mutual-capacitance touch sensor panel having sensors fabricated on a single side of a substrate for detecting multi-touch events (the touching of multiple fingers or other objects upon a touch-sensitive surface at distinct locations at about the same time). To avoid having to fabricate substantially 20 transparent row and column traces on opposite sides of the same substrate, embodiments of the invention can form the row and column traces on the same side of the substrate, separated by a thin dielectric material, using diamond, rectangular, or hexagonal rows and columns. Dummy shapes of the same material as the row and column traces can be formed alongside the rows and columns to provide optical uniformity. The metal traces 25 in the border areas used to route the rows to the short edge of the Substrate can also be formed on the same side of the substrate as the rows and columns. The metal traces can allow both the rows and columns to be routed to the same short edge of the substrate so that a small flex circuit can be bonded to a small area on only one side of the substrate.
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Brief Description of the Drawings
[0011] FIG. 1 illustrates an exemplary DITO multi-touch sensor panel having column traces that can terminate at a short edge of the substrate, requiring a larger and more expensive flex circuit.
5 [0012] FIG. 2a illustrates an exemplary arrangement of diamond-shaped rows and columns on the same side of a single substrate according to one embodiment of this invention.
[0013] FIG. 2b illustrates an exemplary pixel generated from diamond-shaped rows and columns on the same side of a single substrate according to one embodiment of this 10 invention.
[0014] FIG. 3a illustrates an exemplary arrangement of diamond-shaped rows and columns, with isolated "dummy" diamonds formed between the rows and columns according to one embodiment of this invention.
[0015] FIG. 3b illustrates exemplary column, row, and dummy diamonds according 15 to one embodiment of this invention.
[0016] FIG. 4a illustrates an exemplary arrangement of rectangular-shaped rows and columns, with isolated "dummy" squares and rectangles formed between the rows and columns according to one embodiment of this invention.
[0017] FIG. 4b illustrates an exemplary column and row according to one 20 embodiment of this invention.
[0018] FIG. 5a illustrates an exemplary arrangement of hexagon-shaped rows and columns, with isolated "dummy" squares and hexagons formed between the rows and columns according to one embodiment of this invention.
[0019] FIG. 5b illustrates an exemplary column and row according to one 25 embodiment of this invention.
[0020] FIG. 6a illustrates an exemplaiy timing diagram of LCD display activity versus touch sensor panel scan activity.
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[0021] FIG. 6b illustrates an exemplary timing diagram of LCD display activity versus touch sensor panel scan activity, where the timing of the LCD display activity and touch panel scanning is synchronized so that scanning only occurs when the LCD display is inactive, during the vertical blanking period, according to one embodiment of this 5 invention.
[0022] FIG. 7 illustrates an exemplary touchscreen stackup according to one embodiment of this invention.
[0023] FIG. 8 illustrates an exemplary detailed view of the stackup of the rows and columns formed on a single side of a substrate according to one embodiment of this 10 invention.
[0024] FIG. 9 illustrates a top view of an exemplary substrate with rows and columns formed on the top side and connected at a single end according to one embodiment of this invention.
[0025] FIG. 10 illustrates an expanded view of exemplary metal traces as they are 15 routed to the bond pads at a bottom short edge of a substrate according to one embodiment of this invention.
[0026] FIG. 11 illustrates a top view of an exemplary substrate with rows and columns formed on the top side and with rows connected at both ends according to one embodiment of this invention.
20 [0027] FIG. 12 illustrates an exemplary computing system operable with the sensor panel and touchscreen stackups according to embodiments of this invention.
[0028] FIG. 13a illustrates an exemplary mobile telephone that can include the sensor panel and touchscreen stackups and computing system described above according to embodiments of the invention.
25 [0029] FIG. 13b illustrates an exemplary digital audio/video player that can include the sensor panel and touchscreen stackups and computing system described above according to embodiments of the invention.
6
Detailed Description of the Preferred Embodiment
[0030] In the following description of preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which it is shown by way of illustration specific embodiments in which the invention can be practiced. It is to be 5 understood that other embodiments can be used and structural changes can be made without departing from the scope of the embodiments of this invention.
[0031] This relates to a substantially transparent mutual-capacitance touch sensor panel having sensors fabricated on a single side of a substrate for detecting multi-touch events (the touching of multiple fingers or other objects upon a touch-sensitive surface at 10 distinct locations at about the same time). To avoid having to fabricate substantially transparent row and column traces on opposite sides of the same substrate, embodiments of the invention can form the row and column traces on the same side of the substrate, separated by a thin dielectric material, using diamond, rectangular, or hexagonal rows and columns. Dummy shapes of the same material as the row and column traces can be 15 formed alongside the rows and columns to provide optical uniformity. The metal traces in the border areas used to route the rows to Ihe short edge of the substrate can also be formed on the same side of the substrate as the rows and columns. The metal traces can allow both the rows and columns to be routed to the same short edge of the substrate so that a small flex circuit can be bonded to a small area on only one side of the substrate.
20 [0032] Although some embodiments of this invention may be described herein in terms of mutual capacitance multi-touch sensor panels, it should be understood that embodiments of this invention are not so limited, but are additionally applicable to selfcapacitance sensor panels and single-touch sensor panels. Furthermore, although the touch sensors in the sensor panel may be described herein in terms of an orthogonal array 25 of touch sensors having rows and columns, embodiments of this invention are not limited to orthogonal arrays, but can be generally applicable to touch sensors arranged in any number of dimensions and orientations, including diagonal, concentric circle, three-dimensional and random orientations. In addition, although the columns are generally described herein as being on top of the rows, it should be understood that the rows can be 30 on top of the columns to achieve different sensor panel performance.
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[0033] A DITO mutual capacitance touch sensor panel, with rows and column traces in perpendicular orientations on opposite sides of a glass substrate, can create about 1 pF of static mutual capacitance at each intersection of the row and column traces. However, if this same technique and pattern was applied to rows and columns on the 5 same side of a substrate, the much smaller thickness of the dielectric between the rows and columns can create a large static mutual capacitance. As a result, the touching of a finger or other object will only cause a small change in the large static mutual capacitance, making it difficult to detect the touching of a finger.
[0034] For example, in a DITO mutual capacitance touch sensor panel with rows 10 having about 1 pF of static mutual capacitance at each pixel, the presence of a finger will change this capacitance by about 0.1 pF or 10%. However, with the rows and columns on the same side and separated only by a thin dielectric, the static mutual capacitance is on the order of 100 times greater or about 100 pF. Nevertheless, the touching of a finger would still only change this capacitance by about 0.1 pF or 0.1%. Because the sensitivity 15 would be only one part in a thousand, it can be veiy difficult to detect the touching of a finger.
[0035] FIG. 2a illustrates exemplary arrangement 200 of diamond-shaped rows and columns (separated by a dielectric material) on the same side of a single substrate that generates about the same amount of static mutual capacitance between the row and 20 column traces as with DITO, according to embodiments of the invention. Note that the spatial density of pixels in the arrangement can be made similar to previously disclosed sensor panels, as spatial density can be dependent on the geometry of the diamondshaped rows and columns. Note also that FIG. 2a shows diamond-shaped rows 202 and diamond-shaped columns 204 separately and superimposed at 200. In FIG. 2a, each row 25 202 can be formed from diamond-shaped areas of substantially transparent ITO 206 connected at adjacent facing points by necked-down area 208. Each column can be similarly formed from diamond-shaped areas of substantially transparent ITO 210 connected at adjacent facing points by necked-down area 212. Columns 204 can be connected to a pre-amplifier held at a virtual ground of, for example, 1.5V, and one or 30 more rows 202 can be stimulated with tiie others held at direct current (DC) voltage levels.
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[0036] FIG. 2b illustrates exemplary pixel 230 generated from diamond-shaped rows 202 and columns 204 on the same side of a single substrate according to embodiments of the invention. If row 202 is stimulated with a stimulation signal Vstim 214, a static mutual capacitance can be formed at intersection 216 of the necked-down 5 areas. The static mutual capacitance at intersection 216 is undesirable because a finger will not be able to block many of the fringing fields. Accordingly, in this embodiment the necked-down areas are made as small as possible.
[0037] A fringe mutual capacitance 218 can also be formed between the diamonds in the stimulated row and the adjacent column diamonds. Fringe mutual capacitance 218 10 between adjacent diamonds can be of roughly the same order as the mutual capacitance formed between rows and columns separated by a substrate. Fringe mutual capacitance 218 between adjacent row and column diamonds is desirable because a finger will be able to block many of the fringing fields and effect a change in the mutual capacitance that can be detected by the analog channels connected to the rows. As shown in FIG. 2b, 15 there can be four “hot spots” of fringing mutual capacitance indicated at 218 that can be blocked by a finger, and the more that a finger blocks, the greater the change in the signal capacitance.
[0038] Columns 204 and rows 202 can be arranged such that the row diamonds and column diamonds do not appear on directly opposing sides of the dielectric material. If 20 the same ITO is used for both the rows and columns, and each layer of ITO is formed over the same material, such an arrangement can produce optical uniformity, because the substrate is "covered" from an orthogonal perspective by either the row or column diamonds of the same ITO on either side of the substrate.
[0039] However, if different types of ITO are needed to form the rows and columns 25 on the top and bottom sides of the dielectric, or if the same ITO is deposited on different materials, the configuration described above may not provide optical uniformity due to the dissimilarity of the materials and the fact that the substrate is not uniformly and substantially covered by diamonds of the same ITO chemistries. For example, rows of ITO can be deposited directly onto a glass substrate, then covered with an organic 30 polymer having dielectric properties. Columns of ITO can then be deposited over the 9 organic polymer. Even though both layers of ITO may be of the same composition, because they were deposited over different materials, their composition or chemistry can differ, and their optical properties can be slightly different. As a result, the patterns of rows and column can be visible to a user, which is generally undesirable.
5 [0040] FIG. 3a illustrates exemplary arrangement 300 of diamond-shaped rows and columns, with isolated "dummy” diamonds formed between the rows and columns according to embodiments of the invention. Note that the substrate upon which the rows and columns are supported, along with the dielectric layer between the rows and columns, are not shown in FIG. 3a for purposes of clarity. In particular, dummy diamonds 320 of 10 the same ITO composition as rows 302 can be formed between the rows on the same layer as the rows, and dummy diamonds 322 of the same ITO composition as columns 304 can be formed between the columns on the same layer as the columns. Note that FIG. 3a shows diamond-shaped rows 302 and diamond-shaped columns 304 along with their dummy diamonds 320 and 322 superimposed at 300. In particular, in the 15 arrangement of FIG. 3a, dummy diamonds 320 substantially cover columns 304, and dummy diamonds 322 substantially cover rows 302. Because of the dummy diamonds, almost all areas of the substrate can be covered (i.e. substantially covered) by both types of ITO (see, e.g., areas 324 and 326), providing optical uniformity even if the composition of the row and column ITO is different.
20 [0041] FIG. 3b illustrates exemplary column 304, row 302, and dummy diamonds 322 and 320 according to embodiments of the invention. Note that the dummy diamonds are drawn smaller for purposes of clarity. A large parasitic mutual capacitance 328 can be formed between the stimulated row and the dummy diamonds 322 on the column layer, but because the dummy diamonds are isolated, their voltage potential will move 25 along with the stimulated row and should not have a major impact on finger detection. A fringe mutual capacitance 318 can also be formed between the diamonds in the stimulated row and the adjacent column diamonds. Fringe mutual capacitance 318 between adjacent diamonds can be of roughly the same order as the mutual capacitance formed between rows and columns separated by a substrate. Fringe mutual capacitance 318 between 30 adjacent row and column diamonds can be desirable because a finger will be able to block many of the fringing fields and effect a change in the mutual capacitance that can 10 be detected by the analog channels connected to the rows. As shown in FIG. 3b, there can be four “hot spots” of fringing mutual capacitance at 318 that can be blocked by a finger, and the more that a finger blocks, the greater the change in the signal capacitance.
[0042] FIG. 4a illustrates exemplary arrangement 400 of rectangular or line-shaped 5 rows and columns, with isolated "dummy" squares and rectangles that can be formed between the rows and columns according to embodiments of the invention. Note that the substrate upon which the rows and columns can be supported, along with the dielectric layer between the rows and columns, are not shown in FIG. 4a for purposes of clarity. In particular, dummy squares 420 and rectangles 421 of the same ITO composition as rows 10 402 can be formed between the rows on the same layer as the rows, and dummy squares 422 and rectangles 423 of the same ITO composition as columns 404 can be formed between the columns on the same layer as the columns. Note that FIG. 4a shows rows 402 and columns 404 along with their dummy squares and rectangles 420,421,422 and 423 superimposed at 400. In particular, in the arrangement of FIG. 4a, dummy rectangles 15 421 substantially cover columns 404, and dummy rectangles 423 substantially cover rows 402. Because of the dummy squares and rectangles, almost all areas of the substrate are covered by both types of ITO (see, e.g., areas 424 and 426), providing optical uniformity even if the composition of the row and column ITO is different.
[0043] FIG. 4b illustrates exemplary column 404 and row 402 according to 20 embodiments of the invention. Note that the dummy squares and rectangles are not shown for purposes of clarity. A fringe mutual capacitance 418 can also be formed between the stimulated row and the adjacent columns. Fringe mutual capacitance 418 can be of roughly the same order as the mutual capacitance formed between rows and columns separated by a substrate. Fringe mutual capacitance 418 between adjacent rows 25 and columns can be desirable because a finger will be able to block many of the fringing fields and effect a change in the mutual capacitance that can be detected by the analog channels connected to the rows. As shown in FIG. 4b, there can be four “hot spots” of fringing mutual capacitance at 418 that can be blocked by a finger, and the more that a finger blocks, the greater the change in the signal capacitance.
11
[0044] One advantage of the diamond-shaped rows and columns shown in FIGs. 3a and 3b is that the necked-down areas ("pinch points"), which create undesirable high resistance junctions, are limited to small areas, and within the diamonds the resistance is not an issue. However, with the rows and columns of FIG. 4a and 4b, the entire length of 5 the row can be essentially a pinch point.
[0045] FIG. 5a illustrates exemplary arrangement 500 of hexagon-shaped rows and columns, with isolated "dummy" squares and hexagons formed between the rows and columns according to embodiments of the invention. FIG. 5a is intended to reduce the pinch points and resistance described above by widening the rows and columns, and 10 represents a middle ground between the embodiments of FIGs. 3 and 4. Those skilled in the art will know that there can be a number of different variations between the embodiments of FIGs. 3 and 4 according to embodiments of the invention, of which FIG. 5 is just one example. Note that the substrate upon which the rows and columns can be supported, along with the dielectric layer between the rows and columns, are not shown 15 in FIG. 5a for purposes of clarity. In particular, dummy hexagons 521 and squares 520 of the same ITO composition as rows 502 can be formed between the rows on the same layer as the rows, and dummy squares 522 and hexagons 523 of the same ITO composition as columns 504 can be formed between the columns on the same layer as the columns. Note that FIG. 5a shows hexagon-shaped rows 502 and hexagon-shaped 20 columns 504 along with their dummy squares and rectangles 520, 521, 522 and 523 superimposed at 500. In particular, in the arrangement of FIG. 5a, dummy hexagons 521 substantially cover columns 504, and dummy hexagons‘523 substantially cover rows 502. Because of the dummy squares and rectangles, almost all areas of the substrate can be covered by both types of ITO (see, e.g., areas 524 and 526), providing optical uniformity 25 even if the composition of the row and column ITO is different.
[0046] FIG. 5b illustrates exemplary column 504 and row 502 according to embodiments of the invention. Note that the dummy hexagons and rectangles are not shown for purposes of clarity. A fringe mutual capacitance 518 can also be formed between the stimulated row and the adjacent columns. Fringe mutual capacitance 518 30 can be of roughly the same order as the mutual capacitance formed between rows and columns separated by a substrate. Fringe mutual capacitance 518 between adjacent rows 12 and columns can be desirable because a finger will be able to block many of the fringing fields and effect a change in the mutual capacitance that can be detected by the analog channels connected to the rows. As shown in FIG. 5b, there can be four “hot spots” of fringing mutual capacitance at 518 that can be blocked by a finger, and the more that a 5 finger blocks, the greater the change in the signal capacitance.
[0047] FIG. 6a illustrates an exemplary timing diagram of LCD display activity 600 versus touch sensor panel scan activity 602. Note that the timing is not synchronized, so that a panel scan may be occurring at the same time as LCD display activity (when the Vcom layer and other display-related voltages may be changing state), which causes 10 noise. To prevent this noise from coupling into the column traces of the sensor panel, shielding can be provided.
[0048] In some embodiments, this shielding can be provided by the row traces themselves. However, in the embodiments of FIGs. 3-6, dummy squares, rectangles or hexagons can be present alongside the row traces, but unconnected to the row traces.
15 These floating areas do not provide adequate shielding because they are isolated and not driven or tied to DC or ground. Thus, in the embodiments of FIGs. 3-6, LCD shielding is required.
[0049] FIG. 6b illustrates an exemplary timing diagram of LCD display activity 600 versus touch sensor panel scan activity 602, where the timing of the LCD display activity 20 and touch panel scanning is synchronized so that scanning only occurs when the LCD display is inactive, during the vertical blanking period, according to embodiments of the invention. With this embodiment, no shielding is required. The staggering of LCD and scanning activity can be accomplished by providing a much longer blanking period to account for the relatively long scan time of conventional panel scanning methods.
25 [0050] FIG. 7 illustrates exemplary touchscreen stackup 700 according to embodiments of the invention. In FIG. 7, black mask (or a mask of any color) 702 can be formed on a portion of the back side of cover 704, and an optional smoothing coat 706 can be applied over the black mask and back side of the cover. Touch panel 708 of the type described above, with rows and columns formed on the same side of a substrate 30 (represented by dashed line 709 in FIG. 7), can be bonded to the cover with pressure 13 sensitive adhesive (PSA) 710. An unpattemed layer of ITO 712 can optionally be formed on the bottom of the glass to act as a shield. Anti-reflective film 714 can then be deposited over unpattemed ITO 712. LCD module 716 can then be placed beneath the glass substrate, optionally separated by air gap 718 for ease of repair.
5 [0051] FIG. 8 illustrates exemplary detailed view 800 of the stackup of the rows and columns formed on a single side of a substrate according to embodiments of the invention. In FIG. 8, metal layer 802 (having a resistivity of 0.4 ohms per square maximum, for example) for routing the row traces to a short edge of the substrate can be formed directly on glass substrate 804 and patterned. A first layer 806 of ITO 1 (having a 10 resistivity of200 ohms per square maximum, for example) can then be formed on substrate 804 and patterned. ITOl 806 can contact metal 802, and can be formed and patterned to remain over the metal for corrosion protection, which can improve the reliability of the connections. Alternatively, ITOl 806 can be formed on substrate 804 before metal layer 802. However, if the metal layer is put over the ITOl, the metal must 15 be more corrosion resistant, which can be more expensive.
[0052] A layer of clear, photo-imageable organic polymer 808 (pattemable by exposing it to light and removing the exposed part or the non-exposed part) having a low dielectric constant (low can be better to create the least amount of capacitance between rows and columns) and a thickness of 3 microns ± 20%, for example, can then be formed 20 over ITOl 806 and patterned. Photo-imagable clear polymer can be used because it has a lower dielectric constant, and therefore creates less mutual capacitance. A second layer of IT02 810 (having a resistivity of 500 ohms per square maximum, for example) can then be sputtered over polymer 808 and patterned. Because IT02 810 is generally sputtered onto polymer 808, it can generally be of lower quality and higher resistivity as 25 compared to ITOl, which is clearer and has less color shift. ITOl and IT02 can be the same, or of a different composition, or they can be the same and yet have different chemistries or properties due to their deposition onto different materials. For example, note that in the example of FIG. 8, IT02 can have a higher resistance than ITOl, because it can be easier to form a uniform layer over glass as opposed to a polymer. Vias 812, 30 formed by patterning, allow IT02 810 to connect to metal 802, so that a single layer of metal can be used to route both ITOl and IT02 to flexible printed circuit (FPC) 814.
14
Note that in the example of FIG. 8, IT02 contacts ITOl, which contacts the metal. If ITOl was sputtered first, IT02 would contact the metal directly.
[0053] In the example of FIG. 8, there can be four mask steps for the top layer, one each for the metal, ITOl, polymer and IT02. The metal, ITOl and IT02 can be 5 patterned to form 20 micron ± 3 micron lines and spaces, for example. Anisotropic conductive film (ACF) 816 can then be used to bond flex circuit 814 to metal traces 802 on substrate 804. The ACF can form a conductive bond with the metal on the flex circuit.
[0054] A shield layer of unpattemed IT03 818 (having a resistivity of 200 ohms per square maximum, for example) can be formed on the bottom side of glass substrate 804.
10 ACF 820 can be used to bond flex circuit 822 to shield layer 818 and ground it. A PET
substrate 824 (having a thickness of 50 microns, for example) can be bonded to glass 804 using PSA 826 (having a thickness of 25 microns, for example), and an anti-reflective hardcoat 828 can be applied to the PET.
[0055] One advantage of using the diamond-shaped rows and columns according to 15 embodiments of the invention is that a single layer of metal routing can be used to route both the rows and the columns to the same short edge of the substrate. In previous designs (see FIG. 1), the rows had metal traces along the borders, but the columns did not, and thus a wide FPC was required for the columns. However, in embodiments of the invention, with rows and columns on the same side, metal traces can be used to connect 20 up to both drive the rows and sense the columns, and fan them into a narrow region for flex bonding.
[0056] FIG. 9 illustrates top view 900 of exemplary substrate 902 with rows 904 and columns 906 formed on the top side and connected at a single end according to embodiments of the invention. In FIG. 9, the grid of rows and columns is symbolic — the 25 rows and columns can be diamond-shaped, rectangular, or any of a number of shapes as described above. 15 micron patterning can be used to allow for the same mechanical control outline (MCO) (i.e. the same physical envelope) as previous designs. Upper rows 908 can be connected to the bottom short edge of substrate 902 using metal traces 910 running along the left border of the substrate, outside visible area 912. Lower rows 914 30 can be connected to the bottom short edge of substrate 902 using metal traces 916 15 running along the right border of the substrate, outside visible area 912. By connecting the rows to metal traces at only one end, the metal traces can take up less width in the border areas and can be made wider, lowering their resistivity. The metal traces connecting the rows can be connected to bond pads in small connector areas 918 near the 5 middle of the bottom short edge of substrate 902. The column traces can be routed to center 920 of the small connector area using metal traces. Note that flex circuit 922 in FIG. 9 can be made very small, and includes tab 924 for connecting to a shield layer on the back side of the substrate.
[0057] . FIG. 10 illustrates expanded view 1000 of exemplary metal traces as they 10 are routed to the bond pads at the bottom short edge of the substrate according to embodiments of the invention. In FIG. 10, areas 1002 and 1004 actually represent many metal traces. Areas 1006, 1008 and 1010 adjacent to areas 1002 and 1004 represent continuous isolation regions that can be connected to bond pads which are then ultimately grounded to reduce coupling (undesired mutual capacitance) between the row traces 15 routed through areas 1004 and the column traces routed through 1002.
[0058] FIG. 11 illustrates top view 1100 of exemplary substrate 1102 with rows 1104 and columns 1106 formed on the top side and with rows connected at both ends according to embodiments of the invention. In the dual row, single column embodiment of FIG. 11, all rows 1104 can be connected on both the left and right sides by metal traces 20 1108 and 1110 running within the left and right borders of substrate 1102. Because rows 1104 only need to be driven for half of the width of substrate 1102, the phase delay differences between rows is reduced. However, one drawback is that because double the number of metal traces can be needed as compared to FIG. 11, the traces must be made narrow, which increases their resistivity.
25 [0059] It should also be noted that in alternative embodiments of the invention, the columns can also be connected from either or both sides, and the rows and columns can be routed on either the top or bottom ITO layers.
[0060] FIG. 12 illustrates exemplary computing system 1200 operable with the sensor panel and touchscreen stackups described above according to embodiments of this 30 invention. Touchscreen 1242, which can include sensor panel 1224 and display device 16 1240 (e.g. an LCD module), can be connected to other components in computing system 1200 through connectors integrally formed on the sensor panel, or using flex circuits. Computing system 1200 can include one or more panel processors 1202 and peripherals 1204, and panel subsystem 1206. The one or more processors 1202 can include, for 5 example, ARM968 processors or other processors with similar functionality and capabilities. However, in other embodiments, the panel processor functionality can be implemented instead by dedicated logic such as a state machine. Peripherals 1204 can include, but are not limited to, random access memory (RAM) or other types of memory or storage, watchdog timers and the like.
10 (0061J Panel subsystem 1206 can include, but is not limited to, one or more analog channels 1208, channel scan logic 1210 and driver logic 1214. Channel scan logic 1210 can access RAM 1212, autonomously read data from the analog channels and provide control for the analog channels. This control can include multiplexing columns of multi-touch panel 1224 to analog channels 1208. In addition, channel scan logic 1210 can 15 control the driver logic and stimulation signals being selectively applied to rows of multi-touch panel 1224. In some embodiments, panel subsystem 1206, panel processor 1202 and peripherals 1204 can be integrated into a single application specific integrated circuit (ASIC).
[0062] Driver logic 1214 can provide multiple panel subsystem outputs 1216 and 20 can present a proprietary interface that drives high voltage driver 1218. High voltage driver 1218 can provide level shifting from a low voltage level (e.g. complementary metal oxide semiconductor (CMOS) levels) to a higher voltage level, providing a better signal-to-noise (S/N) ratio for noise reduction purposes. Panel subsystem outputs 1216 can be sent to decoder 1220 and level shifter/driver 1238, which can selectively connect 25 one or more high voltage driver outputs to one or more panel row inputs 1222 through a proprietary interface and enable the use of fewer high voltage driver circuits in the high voltage driver 1218. Each panel row input 1222 can drive one or more rows in a multi-touch panel 1224. In some embodiments, high voltage driver 1218 and decoder 1220 can be integrated into a single ASIC. However, in other embodiments high voltage driver 30 1218 and decoder 1220 can be integrated into driver logic 1214, and in still other embodiments high voltage driver 1218 and decoder 1220 can be eliminated entirely.
17
[0063] Computing system 1200 can also include host processor 1228 for receiving outputs from panel processor 1202 and performing actions based on the outputs that can include, but are not limited to, moving an object such as a cursor or pointer, scrolling or panning, adjusting control settings, opening a file or document, viewing a menu, making 5 a selection, executing instructions, operating a peripheral device connected to the host device, answering a telephone call, placing a telephone call, terminating a telephone call, changing the volume or audio settings, storing information related to telephone communications such as addresses, frequently dialed numbers, received calls, missed calls, logging onto a computer or a computer network, permitting authorized individuals 10 access to restricted areas of the computer or computer network, loading a user profile associated with a user's preferred arrangement of the computer desktop, permitting access to web content, launching a particular program, encrypting or decoding a message, and/or the like. Host processor 1228 can also perform additional functions that may not be related to panel processing, and can be coupled to program storage 1232 and display 15 device 1240 such as an LCD for providing a user interface (UI) to a user of the device.
[0064] As mentioned above, multi-touch panel 1224 can in some embodiments include a capacitive sensing medium having a plurality of row traces or driving lines and a plurality of column traces or sensing lines separated by a dielectric. In some embodiments, the dielectric material can be transparent, such as PET or glass. The row 20 and column traces can be formed from a transparent conductive medium such as ITO or antimony tin oxide (ATO), although other non-transparent materials such as copper can also be used. In some embodiments, the row and column traces can be perpendicular to each other, although in other embodiments other non-orthogonal orientations are possible. For example, in a polar coordinate system, the sensing lines can be concentric 25 circles and the driving lines can be radially extending lines (or vice versa). It should be understood, therefore, that the terms "row" and "column," “first dimension” and “second dimension,” or “first axis” and “second axis” as may be used herein are intended to encompass not only orthogonal grids, but the intersecting traces of other geometric configurations having first and second dimensions (e.g. the concentric and radial lines of 30 a polar-coordinate arrangement).
18 10065] At the "intersections" of the traces, where the traces pass above and below each other (but do not make direct electrical contact with each other), the traces essentially form two electrodes. Each intersection of row and column traces can represent a capacitive sensing node and can be viewed as picture element (pixel) 1226, 5 which can be particularly useful when multi-touch panel 1224 is viewed as capturing an "image" of touch. (In other words, after panel subsystem 1206 has determined whether a touch event has been detected at each touch sensor in multi-touch panel 1224, the pattern of touch sensors in the multi-touch panel at which a touch event occurred can be viewed as an "image" of touch (e.g. a pattern of fingers touching the panel).) When the two 10 electrodes are at different potentials, each pixel can have an inherent self or mutual capacitance formed between the row and column electrodes of the pixel. If an AC signal is applied to one of the electrodes, such as by exciting the row electrode with an AC voltage at a particular frequency, an electric field and an AC or signal capacitance can be formed between the electrodes, referred to as Csig. The presence of a finger or other 15 object near or on multi-touch panel 1224 can be detected by measuring changes to Csig. The columns of multi-touch panel 1224 can drive one or more analog channels 1208 in panel subsystem 1206. In some embodiments, each column is coupled to one dedicated analog channel 1208. However, in other embodiments, the columns can be couplable via an analog switch to a fewer number of analog channels 1208.
20 [0066] The sensor panel and touchscreen stackups described above can be advantageously used in the system of FIG. 12 to provide a space-efficient touch sensor panel and UI that is lower cost, more manufacturable, fits into existing mechanical control outlines (the same physical envelope).
[0067] FIG. 13a illustrates exemplary mobile telephone 1336 that can include 25 sensor panel 1324 and display device 1330 stackups (optionally bonded together using PSA 1334) and computing system described above according to embodiments of the invention. FIG. 13b illustrates exemplary digital audio/video player 1340 that can include sensor panel 1324 and display device 1330 stackups (optionally bonded together using PSA 1334) and computing system described above according to embodiments of 30 the invention. The mobile telephone and digital audio/video player of FIGs. 13a and 13b can advantageously benefit from the touchscreen stackups described above because the touchscreen stackups allow these devices to be smaller and less expensive, which are important consumer factors that can have a significant effect on consumer desirability and commercial success.
19 10068] Although embodiments of this invention have been fully described with 5 reference to the accompanying drawings, it is to be noted that various changes and modifications will become apparent to those skilled in the art. Such changes and modifications are to be understood as being included within the scope of embodiments of this invention as defined by the appended claims.
20
List of elements
Figure 1 5 1= exaggerated Figure 6a 10 2= display period (e.g, 16ms) 3= vertical blanking period (e.g. <lms) 4= scan time
Figure 6b 15 5= display period (e.g. 12ms) 6= vertical blanking period (e.g. 4ms) 7= scan time 20 Figure 9 8= Ground metal 9= Column routing metal 10= Bottom short edge 25
Figure 11 11= Visible Area 12= Row routing metal 30 13= Ground metal 14= Column routing metal 15= flex
Figure 12 35 16= to Display Device 17= control signals 18= to Host Processor 40 Figure 13 19= other computing system blocks
Claims (40)
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2008
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- 2008-06-11 NL NL2001672A patent/NL2001672C2/en not_active IP Right Cessation
- 2008-06-13 DE DE102008028224A patent/DE102008028224A1/en not_active Ceased
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2009
- 2009-09-30 HK HK09109080.3A patent/HK1131229A1/en not_active IP Right Cessation
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US20080309633A1 (en) | 2008-12-18 |
GB2453190A (en) | 2009-04-01 |
DE102008028224A1 (en) | 2008-12-18 |
HK1131229A1 (en) | 2010-01-15 |
NL2001672A1 (en) | 2008-12-16 |
GB2453190B (en) | 2012-08-22 |
GB0808779D0 (en) | 2008-06-18 |
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