|
US3097418A
(en)
*
|
|
1963-07-16 |
|
Electrically coded terrain model map |
|
US2910766A
(en)
*
|
1953-02-24 |
1959-11-03 |
Pritikin Nathan |
Method of producing an electrical component
|
|
US2874085A
(en)
*
|
1953-10-27 |
1959-02-17 |
Northern Engraving & Mfg Co |
Method of making printed circuits
|
|
US2861911A
(en)
*
|
1954-12-20 |
1958-11-25 |
Molded Fiber Glass Body Compan |
Electrically conductive body and method of making same
|
|
US2854386A
(en)
*
|
1955-02-07 |
1958-09-30 |
Aladdin Ind Inc |
Method of photographically printing conductive metallic patterns
|
|
US2849298A
(en)
*
|
1955-05-03 |
1958-08-26 |
St Regis Paper Co |
Printed circuitry laminates and production thereof
|
|
US2947625A
(en)
*
|
1955-12-21 |
1960-08-02 |
Ibm |
Method of manufacturing printed circuits
|
|
US2933436A
(en)
*
|
1956-02-10 |
1960-04-19 |
Westinghouse Electric Corp |
Grid electrodes for electron discharge devices
|
|
US2969300A
(en)
*
|
1956-03-29 |
1961-01-24 |
Bell Telephone Labor Inc |
Process for making printed circuits
|
|
US2889258A
(en)
*
|
1956-06-08 |
1959-06-02 |
Camin Lab Inc |
Method of making hollow body of non-uniform wall thickness
|
|
US2961746A
(en)
*
|
1956-06-18 |
1960-11-29 |
Aladdin Ind Inc |
Printed circuits
|
|
US2984595A
(en)
*
|
1956-06-21 |
1961-05-16 |
Sel Rex Precious Metals Inc |
Printed circuit manufacture
|
|
US2945180A
(en)
*
|
1957-04-17 |
1960-07-12 |
Louis W Parker |
Shunts for printed circuit meters
|
|
NL217955A
(US06168776-20010102-C00028.png)
*
|
1957-06-07 |
|
Philips Nv |
|
|
BE568197A
(US06168776-20010102-C00028.png)
*
|
1957-06-12 |
|
|
|
|
DE1101550B
(de)
*
|
1957-07-22 |
1961-03-09 |
Jacques Marie Noel Hanlet |
Verfahren zur Herstellung gedruckter Schaltungen
|
|
US3039177A
(en)
*
|
1957-07-29 |
1962-06-19 |
Itt |
Multiplanar printed circuit
|
|
US3013913A
(en)
*
|
1957-08-30 |
1961-12-19 |
Westinghouse Electric Corp |
Molded printed circuit
|
|
US3060076A
(en)
*
|
1957-09-30 |
1962-10-23 |
Automated Circuits Inc |
Method of making bases for printed electric circuits
|
|
US3024151A
(en)
*
|
1957-09-30 |
1962-03-06 |
Automated Circuits Inc |
Printed electrical circuits and method of making the same
|
|
US2967766A
(en)
*
|
1957-10-22 |
1961-01-10 |
Aladdin Ind Inc |
Method and apparatus for making cylindrical printed circuits
|
|
US2964436A
(en)
*
|
1958-03-31 |
1960-12-13 |
Sanders Associates Inc |
Method of laminating conductors to thermoplastic materials
|
|
DE1106822B
(de)
*
|
1958-06-12 |
1961-05-18 |
Jean Michel |
Verfahren zur Herstellung eines gedruckten Stromkreises
|
|
US2984597A
(en)
*
|
1958-08-15 |
1961-05-16 |
Leighton R Johnson Jr |
Method of making electrical conductors on insulating supports
|
|
NL242849A
(US06168776-20010102-C00028.png)
*
|
1958-10-17 |
|
|
|
|
US3076752A
(en)
*
|
1958-10-17 |
1963-02-05 |
Minnesota Mining & Mfg |
Developer
|
|
US3139392A
(en)
*
|
1959-08-10 |
1964-06-30 |
Norman B Mears |
Method of forming precision articles
|
|
NL255454A
(US06168776-20010102-C00028.png)
*
|
1960-02-09 |
|
|
|
|
DE1164528B
(de)
*
|
1960-02-10 |
1964-03-05 |
Ruwel Werke Gmbh |
Verfahren zum Herstellen von gedruckten Leiterplatten
|
|
FR1260804A
(fr)
*
|
1960-03-31 |
1961-05-12 |
Electronique & Automatisme Sa |
Procédé de réalisation de circuits imprimés
|
|
US3077658A
(en)
*
|
1960-04-11 |
1963-02-19 |
Gen Dynamics Corp |
Method of manufacturing molded module assemblies
|
|
US3077021A
(en)
*
|
1960-05-27 |
1963-02-12 |
Ibm |
Method of forming memory arrays
|
|
DE1236617B
(de)
*
|
1960-11-03 |
1967-03-16 |
Photocircuits Corp |
Verfahren zum Herstellen von elektrischen Bauelementen
|
|
GB993885A
(US06168776-20010102-C00028.png)
*
|
1961-03-03 |
1965-06-02 |
Aktiebolaget Electrolux |
|
|
DE1275920B
(de)
*
|
1961-05-29 |
1968-08-22 |
Electronic Aids Inc |
Verfahren zur Herstellung gedruckter Schaltungen
|
|
BE624491A
(US06168776-20010102-C00028.png)
*
|
1961-11-13 |
|
|
|
|
US3279969A
(en)
*
|
1962-11-29 |
1966-10-18 |
Amphenol Corp |
Method of making electronic circuit elements
|
|
US3328865A
(en)
*
|
1963-03-06 |
1967-07-04 |
Globe Union Inc |
Capacitor
|
|
US3320657A
(en)
*
|
1963-11-27 |
1967-05-23 |
Sanders Associates Inc |
Methods for producing printed circuits
|
|
US3370351A
(en)
*
|
1964-11-02 |
1968-02-27 |
Gen Dynamics Corp |
Method of manufacturing electrical connectors
|
|
US3282755A
(en)
*
|
1965-06-14 |
1966-11-01 |
Electronic Aids Inc |
Method of making plastic embedded color-coded printed circuit
|
|
GB1167729A
(en)
*
|
1965-12-23 |
1969-10-22 |
Texas Instruments Inc |
Circuit Board
|
|
US3449828A
(en)
*
|
1966-09-28 |
1969-06-17 |
Control Data Corp |
Method for producing circuit module
|
|
US3516154A
(en)
*
|
1968-06-12 |
1970-06-23 |
Langley London Ltd |
Heating elements and resistors
|
|
US3526573A
(en)
*
|
1969-06-11 |
1970-09-01 |
Westinghouse Electric Corp |
Flexible flame retardant foil-clad laminates
|
|
US3526568A
(en)
*
|
1969-06-11 |
1970-09-01 |
Westinghouse Electric Corp |
Flexible foil clad laminates
|
|
US3649274A
(en)
*
|
1969-09-18 |
1972-03-14 |
Bunker Ramo |
Coaxial circuit construction method
|
|
US3948701A
(en)
*
|
1971-07-20 |
1976-04-06 |
Aeg-Isolier-Und Kunststoff Gmbh |
Process for manufacturing base material for printed circuits
|
|
DE2264956C2
(de)
*
|
1971-08-30 |
1984-03-08 |
Perstorp AB, 28400 Perstorp |
Vormaterial für gedruckte Schaltungen
|
|
US3903584A
(en)
*
|
1972-05-08 |
1975-09-09 |
Aeroquip Corp |
Method of manufacture of spring for composite sealing ring
|
|
SE7308653L
(US06168776-20010102-C00028.png)
*
|
1973-06-20 |
1974-12-23 |
Perstorp Ab |
|
|
US4289384A
(en)
*
|
1979-04-30 |
1981-09-15 |
Bell & Howell Company |
Electrode structures and interconnecting system
|
|
US4236777A
(en)
*
|
1979-07-27 |
1980-12-02 |
Amp Incorporated |
Integrated circuit package and manufacturing method
|
|
DE3035717C2
(de)
*
|
1980-09-22 |
1983-08-25 |
Siemens AG, 1000 Berlin und 8000 München |
Verfahren zur serienmäßigen Herstellung von Folienwiderständen oder Netzwerken von Folienwiderständen
|
|
US4401521A
(en)
*
|
1980-11-28 |
1983-08-30 |
Asahi Kasei Kogyo Kabushiki Kaisha |
Method for manufacturing a fine-patterned thick film conductor structure
|
|
US4394419A
(en)
*
|
1981-06-12 |
1983-07-19 |
Oak Industries Inc. |
Printed circuit material
|
|
DE3135554A1
(de)
*
|
1981-09-08 |
1983-04-07 |
Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt |
"verfahren zur herstellung von gedruckten schaltungen"
|
|
US4415607A
(en)
*
|
1982-09-13 |
1983-11-15 |
Allen-Bradley Company |
Method of manufacturing printed circuit network devices
|
|
US4564423A
(en)
*
|
1984-11-28 |
1986-01-14 |
General Dynamics Pomona Division |
Permanent mandrel for making bumped tapes and methods of forming
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US5220488A
(en)
*
|
1985-09-04 |
1993-06-15 |
Ufe Incorporated |
Injection molded printed circuits
|
|
US4725478A
(en)
*
|
1985-09-04 |
1988-02-16 |
W. R. Grace & Co. |
Heat-miniaturizable printed circuit board
|
|
JPH0712111B2
(ja)
*
|
1985-09-04 |
1995-02-08 |
ユーエフイー・インコーポレイテッド |
電気回路埋設方法及びプラスチック製品
|
|
FR2623023B1
(fr)
*
|
1987-11-10 |
1990-02-02 |
Alcatel Thomson Faisceaux |
Procede de report de motifs en cuivre sur un support parabolique en materiau composite
|
|
US5070596A
(en)
*
|
1988-05-18 |
1991-12-10 |
Harris Corporation |
Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
|
|
US4944908A
(en)
*
|
1988-10-28 |
1990-07-31 |
Eaton Corporation |
Method for forming a molded plastic article
|
|
US4985601A
(en)
*
|
1989-05-02 |
1991-01-15 |
Hagner George R |
Circuit boards with recessed traces
|
|
US5108541A
(en)
*
|
1991-03-06 |
1992-04-28 |
International Business Machines Corp. |
Processes for electrically conductive decals filled with inorganic insulator material
|
|
US5116459A
(en)
*
|
1991-03-06 |
1992-05-26 |
International Business Machines Corporation |
Processes for electrically conductive decals filled with organic insulator material
|
|
US5232548A
(en)
*
|
1991-10-29 |
1993-08-03 |
International Business Machines Corporation |
Discrete fabrication of multi-layer thin film, wiring structures
|
|
US5231751A
(en)
*
|
1991-10-29 |
1993-08-03 |
International Business Machines Corporation |
Process for thin film interconnect
|
|
US5199163A
(en)
*
|
1992-06-01 |
1993-04-06 |
International Business Machines Corporation |
Metal transfer layers for parallel processing
|
|
JP3168389B2
(ja)
*
|
1995-01-26 |
2001-05-21 |
矢崎総業株式会社 |
回路基板の製造方法
|
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US6147870A
(en)
*
|
1996-01-05 |
2000-11-14 |
Honeywell International Inc. |
Printed circuit assembly having locally enhanced wiring density
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US5839188A
(en)
|
1996-01-05 |
1998-11-24 |
Alliedsignal Inc. |
Method of manufacturing a printed circuit assembly
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US6143116A
(en)
*
|
1996-09-26 |
2000-11-07 |
Kyocera Corporation |
Process for producing a multi-layer wiring board
|
|
US6455784B1
(en)
|
1999-10-27 |
2002-09-24 |
Asahi Kasei Kabushiki Kaisha |
Curable sheet for circuit transfer
|
|
DE10205592B4
(de)
*
|
2002-02-11 |
2008-01-03 |
Ksg Leiterplatten Gmbh |
Verfahren zum Herstellen eines Halbzeugs für Leiterplatten
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|
KR100782407B1
(ko)
*
|
2006-10-30 |
2007-12-05 |
삼성전기주식회사 |
회로기판 제조방법
|
|
DE102009060480A1
(de)
*
|
2009-12-18 |
2011-06-22 |
Schweizer Electronic AG, 78713 |
Leiterstrukturelement und Verfahren zum Herstellen eines Leiterstrukturelements
|
