NL189769C - PROCEDURE FOR MAINTAINING BATH SOLUTIONS FOR THE DEPOSIT OF COPPER ON SUBSTRATE PLATES WITHOUT POWERLESS IN METAL ESTABLISHMENTS. - Google Patents

PROCEDURE FOR MAINTAINING BATH SOLUTIONS FOR THE DEPOSIT OF COPPER ON SUBSTRATE PLATES WITHOUT POWERLESS IN METAL ESTABLISHMENTS.

Info

Publication number
NL189769C
NL189769C NLAANVRAGE8002515,A NL189769DA NL189769C NL 189769 C NL189769 C NL 189769C NL 189769D A NL189769D A NL 189769DA NL 189769 C NL189769 C NL 189769C
Authority
NL
Netherlands
Prior art keywords
powerless
establishments
deposit
copper
procedure
Prior art date
Application number
NLAANVRAGE8002515,A
Other languages
Dutch (nl)
Original Assignee
Amp Akzo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL189769C publication Critical patent/NL189769C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/958—Passivation layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
NLAANVRAGE8002515,A 1953-12-30 PROCEDURE FOR MAINTAINING BATH SOLUTIONS FOR THE DEPOSIT OF COPPER ON SUBSTRATE PLATES WITHOUT POWERLESS IN METAL ESTABLISHMENTS. NL189769C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US401419A US2816850A (en) 1953-12-30 1953-12-30 Semiconductive translator

Publications (1)

Publication Number Publication Date
NL189769C true NL189769C (en)

Family

ID=23587673

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8002515,A NL189769C (en) 1953-12-30 PROCEDURE FOR MAINTAINING BATH SOLUTIONS FOR THE DEPOSIT OF COPPER ON SUBSTRATE PLATES WITHOUT POWERLESS IN METAL ESTABLISHMENTS.

Country Status (6)

Country Link
US (1) US2816850A (en)
BE (1) BE534505A (en)
CH (1) CH328878A (en)
FR (1) FR1110900A (en)
GB (1) GB760563A (en)
NL (1) NL189769C (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2918628A (en) * 1957-01-23 1959-12-22 Otmar M Stuetzer Semiconductor amplifier
US3145328A (en) * 1957-04-29 1964-08-18 Raytheon Co Methods of preventing channel formation on semiconductive bodies
NL108504C (en) * 1958-01-14
US2989424A (en) * 1958-03-31 1961-06-20 Westinghouse Electric Corp Method of providing an oxide protective coating for semiconductors
US3104991A (en) * 1958-09-23 1963-09-24 Raytheon Co Method of preparing semiconductor material
FR1222719A (en) * 1959-01-21 1960-06-13 Labo Cent Telecommunicat Semiconductor device manufacturing processes
US3097308A (en) * 1959-03-09 1963-07-09 Rca Corp Semiconductor device with surface electrode producing electrostatic field and circuits therefor
BE589705A (en) * 1959-04-15
US3146135A (en) * 1959-05-11 1964-08-25 Clevite Corp Four layer semiconductive device
US3200310A (en) * 1959-09-22 1965-08-10 Carman Lab Inc Glass encapsulated semiconductor device
US3154692A (en) * 1960-01-08 1964-10-27 Clevite Corp Voltage regulating semiconductor device
NL274830A (en) * 1961-04-12
BE627302A (en) * 1962-01-19
US3372472A (en) * 1962-05-22 1968-03-12 Carrier Corp Method for forming a thermoelectric module
NL297002A (en) * 1962-08-23 1900-01-01
GB991263A (en) * 1963-02-15 1965-05-05 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3293010A (en) * 1964-01-02 1966-12-20 Motorola Inc Passivated alloy diode
DE1278017B (en) * 1964-05-06 1968-09-19 Siemens Ag Electrical component enveloped by a potting compound or sealed against the environment by means of this, in particular semiconductor rectifier
US5119167A (en) * 1987-06-23 1992-06-02 Sga-Thomson Microelectronics, Inc. Method of improving the corrosion resistance of aluminum contacts on semiconductors
US4818727A (en) * 1987-06-23 1989-04-04 Sgs-Thomson Microelectronics Inc. Method of improving the corrosion resistance of aluminum contacts on semiconductors

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2391706A (en) * 1940-10-10 1945-12-25 Battelle Memorial Institute Method of forming blocking layers on selenium coated plates
US2569892A (en) * 1941-11-05 1951-10-02 Hazeltine Research Inc Crystal contacts of which one element is mainly silicon
US2349622A (en) * 1941-12-18 1944-05-23 Gen Electric Manufacture of rectifiers of the blocking layer type
BE594959A (en) * 1943-07-28
US2444255A (en) * 1944-11-10 1948-06-29 Gen Electric Fabrication of rectifier cells
US2615587A (en) * 1949-06-24 1952-10-28 Trailmobile Inc Conveyer system for vehicles
US2655626A (en) * 1949-07-11 1953-10-13 Fansteel Metallurgical Corp Selenium rectifier
US2722490A (en) * 1950-07-24 1955-11-01 Bell Telephone Labor Inc Germanium elements and methods of preparing same
US2743430A (en) * 1952-03-01 1956-04-24 Rca Corp Information storage devices
US2748325A (en) * 1953-04-16 1956-05-29 Rca Corp Semi-conductor devices and methods for treating same

Also Published As

Publication number Publication date
BE534505A (en)
FR1110900A (en) 1956-02-17
GB760563A (en) 1956-10-31
US2816850A (en) 1957-12-17
CH328878A (en) 1958-03-31

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